Overview
The SZNUP2301MW6T1G is a micro-integrated device designed by onsemi to provide protection for sensitive components against harmful electrical transients, such as electrostatic discharge (ESD). This low capacitance diode array is specifically engineered to safeguard two data lines, ensuring data line speed and integrity. It is packaged in a SC-88 (SC70-6/SOT-363) package, which is Pb-free and AEC-Q101 qualified, making it suitable for automotive and other applications requiring stringent quality standards.
Key Specifications
| Characteristic | Symbol | Value | Unit |
|---|---|---|---|
| Reverse Voltage | VR | 70 | Vdc |
| Forward Current | IF | 200 | mAdc |
| Peak Forward Surge Current | IFM(surge) | 500 | mAdc |
| Repetitive Peak Reverse Voltage | VRRM | 70 | V |
| Average Rectified Forward Current | IF(AV) | 715 | mA |
| Repetitive Peak Forward Current | IFRM | 450 | mA |
| Non-Repetitive Peak Forward Current (t = 1.0 μs) | IFSM | 2.0 | A |
| Thermal Resistance Junction-to-Ambient | RθJA | 625 | °C/W |
| Lead Solder Temperature (Maximum 10 Seconds Duration) | TL | 260 | °C |
| Junction Temperature | TJ | -55 to +150 | °C |
| Storage Temperature | Tstg | -55 to +150 | °C |
| Capacitance (between I/O pins) | CD | 2.0 | pF |
| Capacitance (between I/O pin and ground) | CD | 3 | pF |
Key Features
- Low Capacitance: Maximum 2.0 pF between I/O lines and 3 pF between I/O pin and ground.
- Single Package Integration Design: Reduces board space and component count.
- ESD Protection: Compliant with JEDEC Standards JESD22 (Machine Model = Class C, Human Body Model = Class 3B) and IEC61000-4-2 (Level 4) for 8.0 kV (Contact) and 15 kV (Air).
- Data Line Speed and Integrity: Ensures high-speed data transmission without significant signal degradation.
- Direct Transient to Positive Side or Ground: Flexible transient handling.
- SZ Prefix for Automotive and Other Applications: AEC-Q101 qualified and PPAP capable.
- Pb-Free Device: Compliant with environmental regulations.
Applications
- T1/E1 Secondary IC Protection
- T3/E3 Secondary IC Protection
- HDSL, IDSL Secondary IC Protection
- Video Line Protection
- Microcontroller Input Protection
- Base Stations
- I2C Bus Protection
Q & A
- What is the primary function of the SZNUP2301MW6T1G?
The primary function is to provide ESD protection for sensitive components in electronic circuits.
- What are the key ESD protection standards it complies with?
It complies with JEDEC Standards JESD22 (Machine Model = Class C, Human Body Model = Class 3B) and IEC61000-4-2 (Level 4).
- What is the maximum capacitance between I/O lines?
The maximum capacitance between I/O lines is 2.0 pF.
- What is the package type and size of the SZNUP2301MW6T1G?
The device is packaged in a SC-88 (SC70-6/SOT-363) package.
- Is the SZNUP2301MW6T1G Pb-free?
- What are some typical applications of the SZNUP2301MW6T1G?
Typical applications include T1/E1, T3/E3, HDSL, IDSL secondary IC protection, video line protection, microcontroller input protection, base stations, and I2C bus protection.
- What is the junction temperature range of the SZNUP2301MW6T1G?
The junction temperature range is -55°C to +150°C.
- Is the SZNUP2301MW6T1G suitable for automotive applications?
- What is the maximum reverse voltage the SZNUP2301MW6T1G can handle?
The maximum reverse voltage is 70 Vdc.
- How does the SZNUP2301MW6T1G ensure data line speed and integrity?
It ensures data line speed and integrity by maintaining low capacitance and providing effective ESD protection without significant signal degradation.
