Overview
The ESD8504G, produced by onsemi, is a high-performance ESD protection diode designed to safeguard high-speed data lines from electrostatic discharge (ESD) events. This device is particularly suited for applications requiring ultra-low capacitance and low ESD clamping voltage, making it an ideal solution for protecting voltage-sensitive high-speed data lines. The flow-through style package of the ESD8504G facilitates easy PCB layout and ensures consistent impedance between high-speed differential lines, such as those found in USB 3.0/3.1 interfaces.
Key Specifications
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Operating Junction Temperature Range | TJ | −55 to +125 | °C |
| Storage Temperature Range | Tstg | −55 to +150 | °C |
| Lead Solder Temperature (Maximum, 10 Seconds) | TL | 260 | °C |
| IEC 61000−4−2 Contact (ESD) | ESD | ±25 kV | kV |
| IEC 61000−4−2 Air (ESD) | ESD | ±25 kV | kV |
| Reverse Working Voltage | VRWM | 3.0 V | V |
| Breakdown Voltage | VBR | 4.0 to 6.0 V | V |
| Reverse Leakage Current | IR | 1.0 μA | μA |
| Holding Reverse Voltage | VHOLD | 1.9 V | V |
| Holding Reverse Current | IHOLD | 20 mA | mA |
| Clamping Voltage (IEC61000−4−2, ±8 kV Contact) | VC | 7.0 to 8.5 V | V |
| Dynamic Resistance | RDYN | 0.3 to 0.4 Ω | Ω |
| Junction Capacitance (VR = 0 V, f = 1 MHz) | CJ | 0.5 pF | pF |
Key Features
- Ultra-low capacitance (0.5 pF max, I/O to GND)
- Low ESD clamping voltage
- Protection compliant with IEC 61000−4−2 (Level 4)
- Pb-free, halogen-free/BFR-free, and RoHS compliant
- Flow-through style package for easy PCB layout and matched trace lengths
Applications
- USB 3.0/3.1
- eSATA
- DisplayPort
Q & A
- What is the primary function of the ESD8504G?
The ESD8504G is designed to protect high-speed data lines from electrostatic discharge (ESD) events.
- What are the key features of the ESD8504G?
The device features ultra-low capacitance, low ESD clamping voltage, and compliance with IEC 61000−4−2 (Level 4).
- What is the operating junction temperature range of the ESD8504G?
The operating junction temperature range is −55°C to +125°C.
- What is the storage temperature range for the ESD8504G?
The storage temperature range is −55°C to +150°C.
- What are the typical applications for the ESD8504G?
Typical applications include USB 3.0/3.1, eSATA, and DisplayPort.
- Is the ESD8504G RoHS compliant?
- What is the maximum reverse leakage current of the ESD8504G?
The maximum reverse leakage current is 1.0 μA at VRWM = 3.0 V.
- What is the dynamic resistance of the ESD8504G?
The dynamic resistance is 0.3 to 0.4 Ω.
- How should the ESD8504G be placed on the PCB for optimal performance?
The device should be placed as close as possible to the I/O connector to reduce the ESD path to ground and improve protection performance.
- Are there any specific considerations for using the ESD8504G in USB 3.0 applications?
