Overview
The ESD7371XV2T1G from onsemi is a high-performance ESD protection diode designed to safeguard voltage-sensitive components from electrostatic discharge (ESD) and transient voltage events. This device is particularly suited for applications where ultra-low capacitance and high linearity are crucial, such as in RF signal protection and antenna line applications for wireless handsets and terminals.
Key Specifications
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Breakdown Voltage | VBR | 7.0 V | V |
| Maximum Reverse Peak Pulse Current | IPP | 3 A | A |
| Clamping Voltage @ IPP = 1 A | VC | 11 - 15 V | V |
| Clamping Voltage @ IPP = 3 A | VC | 14 - 20 V | V |
| Junction Capacitance @ VR = 0 V, f = 1 MHz | CJ | 0.7 pF | pF |
| Reverse Leakage Current @ VRWM = 5.3 V | IR | < 1 nA | nA |
| Package / Case | SOD-523-2 | ||
| Operating Temperature Range | TJ, Tstg | -55 to +150 °C | °C |
| Lead Solder Temperature - Maximum (10 Second Duration) | TL | 260 °C | °C |
Key Features
- Industry-leading capacitance linearity over voltage, making it ideal for RF applications.
- Ultra-low capacitance (0.7 pF max, I/O to GND).
- Low leakage current (< 1 nA).
- Low dynamic resistance (< 1 Ω).
- IEC61000-4-2 Level 4 ESD protection, withstanding 1000 ESD strikes ±8 kV contact/air discharged.
- Pb-free, halogen-free/BFR-free, and RoHS compliant.
- SZ prefix for automotive and other applications requiring unique site and control change requirements; AEC-Q101 qualified and PPAP capable.
Applications
- RF signal ESD protection.
- RF switching, PA, and antenna ESD protection.
- Near Field Communications (NFC).
- USB 2.0 and USB 3.0 applications.
Q & A
- What is the primary function of the ESD7371XV2T1G? The primary function is to protect voltage-sensitive components from ESD and transient voltage events.
- What is the breakdown voltage of the ESD7371XV2T1G? The breakdown voltage is 7.0 V.
- What is the maximum reverse peak pulse current (IPP) the device can handle? The device can handle up to 3 A.
- What is the clamping voltage at IPP = 1 A and IPP = 3 A? The clamping voltage is 11 - 15 V at IPP = 1 A and 14 - 20 V at IPP = 3 A.
- What is the junction capacitance of the ESD7371XV2T1G? The junction capacitance is 0.7 pF at VR = 0 V and f = 1 MHz.
- Is the ESD7371XV2T1G RoHS compliant? Yes, it is Pb-free, halogen-free/BFR-free, and RoHS compliant.
- What are the typical applications of the ESD7371XV2T1G? Typical applications include RF signal ESD protection, RF switching, PA, and antenna ESD protection, NFC, and USB 2.0 and USB 3.0 applications.
- What is the operating temperature range of the ESD7371XV2T1G? The operating temperature range is -55 to +150 °C.
- What is the maximum lead solder temperature for the ESD7371XV2T1G? The maximum lead solder temperature is 260 °C for a 10-second duration.
- Is the ESD7371XV2T1G suitable for automotive applications? Yes, it is AEC-Q101 qualified and PPAP capable, making it suitable for automotive and other applications requiring unique site and control change requirements.
