SPC5775BDK3MME2
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NXP USA Inc. SPC5775BDK3MME2

Manufacturer No:
SPC5775BDK3MME2
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 4MB FLASH 416MAPBGA
Delivery:
Payment:
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Product Introduction

Overview

The SPC5775BDK3MME2 is a microcontroller from NXP USA Inc., specifically designed for automotive and industrial battery management systems (BMS) and inverter applications. It is part of the MPC5775B and MPC5775E series, which offer advanced performance, security, and ASIL D support. These microcontrollers are optimized for applications requiring high reliability and robust feature sets, making them an ideal choice for customers migrating from other MPC5xx series devices.

Key Specifications

Specification Value
Core Processor e200z7, 32-Bit Dual-Core
Speed 220 MHz
Flash Memory 4 MB
RAM 512 KB
Timer/PWM 2x eMIOS, 32 channels total; 3x eTPU, 96 channels total
Analog Features 2x eQADC, 40 channels total; 4x SD ADC, 20 channels total
Ethernet 1x FEC Module
CAN 2x MCAN-FD, 4x FlexCAN
Security Hardware CSE module
Operating Temperature -40°C to 125°C
Package 416 BGA

Key Features

  • Dual-Core Processor: The SPC5775BDK3MME2 features a 32-bit dual-core e200z7 processor, providing high computational power and efficiency.
  • Advanced Analog and Digital Peripherals: Includes multiple eQADCs, SD ADCs, and eMIOS/eTPU timers, which are essential for precise control and monitoring in BMS and inverter applications.
  • Robust Communication Interfaces: Supports various communication protocols such as CANbus, FlexCANbus, LINbus, SCI, SPI, and Ethernet, ensuring comprehensive connectivity.
  • Enhanced Security: Equipped with a hardware CSE (Central Security Engine) module to provide robust security features.
  • High Reliability and ASIL D Support: Designed to meet stringent automotive and industrial safety standards, including ASIL D compliance.

Applications

  • Battery Management Systems (BMS): The SPC5775BDK3MME2 is optimized for BMS applications, providing the necessary features for battery monitoring, charging, and discharging.
  • Inverter Applications: Suitable for inverter control in electric vehicles, renewable energy systems, and other industrial applications requiring high-performance and reliable control.
  • Automotive and Industrial Control Systems: Can be used in various control systems within the automotive and industrial sectors due to its robust feature set and high reliability.

Q & A

  1. What is the primary application of the SPC5775BDK3MME2 microcontroller?

    The primary applications are battery management systems (BMS) and inverter control in automotive and industrial settings.

  2. What is the core processor of the SPC5775BDK3MME2?

    The core processor is a 32-bit dual-core e200z7.

  3. What is the maximum operating speed of the SPC5775BDK3MME2?

    The maximum operating speed is 220 MHz.

  4. How much flash memory and RAM does the SPC5775BDK3MME2 have?

    The SPC5775BDK3MME2 has 4 MB of flash memory and 512 KB of RAM.

  5. What are the key analog features of the SPC5775BDK3MME2?

    The key analog features include 2x eQADC with 40 channels and 4x SD ADC with 20 channels.

  6. Does the SPC5775BDK3MME2 support Ethernet and CAN protocols?

    Yes, it supports 1x FEC Module for Ethernet and 2x MCAN-FD, 4x FlexCAN for CAN protocols.

  7. What is the operating temperature range of the SPC5775BDK3MME2?

    The operating temperature range is -40°C to 125°C.

  8. What package type does the SPC5775BDK3MME2 use?

    The package type is 416 BGA.

  9. Does the SPC5775BDK3MME2 support ASIL D safety standards?

    Yes, it is designed to meet ASIL D safety standards.

  10. What security features does the SPC5775BDK3MME2 include?

    The SPC5775BDK3MME2 includes a hardware CSE (Central Security Engine) module for enhanced security.

Product Attributes

Core Processor:e200z7
Core Size:32-Bit Dual-Core
Speed:220MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:DMA, LVD, POR, Zipwire
Number of I/O:293
Program Memory Size:4MB (4M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 40x12b eQADCx2
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:416-BGA
Supplier Device Package:416-MAPBGA (27x27)
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