SPC5775EDK3MME3R
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NXP USA Inc. SPC5775EDK3MME3R

Manufacturer No:
SPC5775EDK3MME3R
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 4MB FLASH 416MAPBGA
Delivery:
Payment:
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Product Introduction

Overview

The SPC5775EDK3MME3R is a 32-bit dual-core microcontroller from NXP USA Inc., specifically designed for Battery Management Systems (BMS) and inverter applications in hybrid and electric vehicles (HEV/EV). This microcontroller is part of the MPC5775B/E series, known for its high reliability and performance in demanding automotive environments.

Key Specifications

SpecificationValue
Microcontroller Type32-Bit Dual-Core
Core Frequency264 MHz
Flash Memory4 MB (4M x 8)
Package Type416-MAPBGA (27x27 mm)
Environmental CompliancePbFree, EU RoHS, Halogen Free, REACH SVHC compliant
Operating TemperatureTBD (Refer to datasheet for specific temperature range)

Key Features

  • Dual-core architecture for enhanced processing power and redundancy.
  • High-speed flash memory of 4 MB.
  • Advanced safety and security features tailored for automotive applications.
  • Comprehensive set of peripherals including timers, UARTs, and CAN interfaces.
  • Support for high-temperature operation, making it suitable for harsh automotive environments.

Applications

The SPC5775EDK3MME3R microcontroller is primarily used in:

  • Battery Management Systems (BMS) for electric and hybrid vehicles.
  • Inverter applications in HEV/EV systems.
  • Other high-reliability automotive control systems requiring advanced safety and security features.

Q & A

  1. What is the primary application of the SPC5775EDK3MME3R microcontroller?
    The primary application is in Battery Management Systems (BMS) and inverter applications for hybrid and electric vehicles.
  2. What is the core frequency of the SPC5775EDK3MME3R microcontroller?
    The core frequency is 264 MHz.
  3. How much flash memory does the SPC5775EDK3MME3R microcontroller have?
    The microcontroller has 4 MB of flash memory.
  4. What is the package type of the SPC5775EDK3MME3R microcontroller?
    The package type is 416-MAPBGA (27x27 mm).
  5. Is the SPC5775EDK3MME3R microcontroller environmentally compliant?
    Yes, it is PbFree, EU RoHS, Halogen Free, and REACH SVHC compliant.
  6. What are the key safety features of the SPC5775EDK3MME3R microcontroller?
    The microcontroller includes advanced safety and security features tailored for automotive applications.
  7. Can the SPC5775EDK3MME3R microcontroller operate in high-temperature environments?
    Yes, it is designed to operate in harsh automotive environments, including high temperatures.
  8. What peripherals does the SPC5775EDK3MME3R microcontroller support?
    The microcontroller supports a comprehensive set of peripherals including timers, UARTs, and CAN interfaces.
  9. Where can I find detailed specifications and datasheets for the SPC5775EDK3MME3R microcontroller?
    Detailed specifications and datasheets can be found on the NXP Semiconductors website and other authorized distributors like Digi-Key.
  10. Is the SPC5775EDK3MME3R microcontroller suitable for other automotive applications beyond BMS and inverter systems?
    Yes, it can be used in other high-reliability automotive control systems requiring advanced safety and security features.

Product Attributes

Core Processor:e200z7
Core Size:32-Bit Dual-Core
Speed:264MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:DMA, LVD, POR, Zipwire
Number of I/O:293
Program Memory Size:4MB (4M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 40x12b eQADCx2
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:416-BGA
Supplier Device Package:416-MAPBGA (27x27)
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Similar Products

Part Number SPC5775EDK3MME3R SPC5775EDK3MME3
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Active
Core Processor e200z7 e200z7
Core Size 32-Bit Dual-Core 32-Bit Dual-Core
Speed 264MHz 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire
Number of I/O 293 293
Program Memory Size 4MB (4M x 8) 4MB (4M x 8)
Program Memory Type Flash Flash
EEPROM Size - -
RAM Size 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 40x12b eQADCx2 A/D 40x12b eQADCx2
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 416-BGA 416-BGA
Supplier Device Package 416-MAPBGA (27x27) 416-MAPBGA (27x27)

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