Overview
The SPC5775EDK3MME3 is a high-performance microcontroller from NXP USA Inc., specifically designed for advanced automotive applications such as battery management systems (BMS) and inverter control. This microcontroller is part of the MPC5775E series, which is known for its reliability, security, and energy efficiency. The device features a robust architecture with multiple CPU cores, extensive memory, and a wide range of peripherals, making it an ideal choice for demanding automotive systems.
Key Specifications
| Specification | Details |
|---|---|
| Microcontroller Type | MPC5775E |
| Package Type | 416-ball MAPBGA |
| CPU Cores | Three dual-issue, 32-bit CPU core complexes (e200z7) |
| Flash Memory | 4 MB on-chip flash |
| SRAM | 512 KB on-chip general-purpose SRAM (including 64 KB standby RAM) |
| Operating Temperature | -40 °C to 125 °C |
| Cache Memory | 16 KB I-Cache and 16 KB D-Cache per core |
| Direct Memory Access (DMA) | Two multichannel DMA controllers (eDMA) with 64 channels each |
| Analog-to-Digital Converters (ADC) | Up to two Enhanced Queued Analog-to-Digital Converter (eQADC) modules, and up to four independent 16-bit Sigma-Delta ADCs (SDADCs) |
| Communication Interfaces | Ethernet (FEC), SENT Receiver (SRX), DSPI, eSCI, FlexCAN, M_CAN |
Key Features
- Power Architecture embedded specification compliance with instruction set enhancement for variable length encoding (VLE) and single-precision floating point operations
- Signal processing extension (SPE1.1) instruction support for digital signal processing (DSP)
- Hardware cache coherency between cores and 16 hardware semaphores
- 3-channel CRC module and Error Injection Module (EIM) and Error Reporting Module (ERM)
- Enhanced Modular Input/Output System (eMIOS) supporting 32 unified channels with PWM and modulus counter operation
- Up to three second-generation Enhanced Time Processor Units (eTPUs) with 32 channels per eTPU
- Boot Assist Module (BAM) supporting serial bootload via CAN or SCI
- Crossbar Switch architecture for concurrent access to peripherals, flash memory, or RAM from multiple bus masters with End-To-End ECC
Applications
The SPC5775EDK3MME3 microcontroller is primarily used in advanced automotive systems, including:
- Battery Management Systems (BMS): For managing and monitoring battery health in electric and hybrid vehicles.
- Inverter Control: For controlling the power electronics in electric vehicles and other automotive applications.
- Automotive Safety Systems: Due to its robust architecture and fault-tolerant features, it is suitable for safety-critical applications.
- Automotive Networking: Supports various communication protocols like CAN, Ethernet, and more.
Q & A
- What is the primary application of the SPC5775EDK3MME3 microcontroller?
The primary applications include battery management systems (BMS) and inverter control in automotive systems. - How many CPU cores does the SPC5775EDK3MME3 have?
The microcontroller features three dual-issue, 32-bit CPU core complexes (e200z7). - What is the flash memory capacity of the SPC5775EDK3MME3?
The device has 4 MB of on-chip flash memory. - What are the key peripherals supported by the SPC5775EDK3MME3?
The microcontroller supports Ethernet, SENT Receiver, DSPI, eSCI, FlexCAN, and M_CAN among others. - What is the operating temperature range of the SPC5775EDK3MME3?
The operating temperature range is -40 °C to 125 °C. - Does the SPC5775EDK3MME3 support DSP instructions?
Yes, it supports signal processing extension (SPE1.1) instructions for digital signal processing (DSP). - How many channels does each eTPU support in the SPC5775EDK3MME3?
Each eTPU supports 32 channels. - What is the purpose of the Boot Assist Module (BAM) in the SPC5775EDK3MME3?
The Boot Assist Module (BAM) supports serial bootload via CAN or SCI. - Does the SPC5775EDK3MME3 have hardware cache coherency?
Yes, it has hardware cache coherency between cores. - What is the package type of the SPC5775EDK3MME3?
The package type is 416-ball MAPBGA.
