NX3DV642GU,115
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NXP USA Inc. NX3DV642GU,115

Manufacturer No:
NX3DV642GU,115
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC SWITCH TPDT DIFF XQFN24
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The NX3DV642GU,115 is a high-speed, triple-pole double-throw (TPDT) differential signal switch produced by NXP USA Inc. This device is optimized for switching between two MIPI (Mobile Industry Processor Interface) devices, such as cameras, LCD displays, and on-board multimedia application processors. It is designed to handle high-frequency signals, making it suitable for various mobile and multimedia applications.

Key Specifications

ParameterMinTypMaxUnit
Supply Voltage (VCC)2.65-4.3V
Input Voltage (VI)0-4.3V
Switch Voltage (VSW)0-4.5V
Ambient Temperature (Tamb)-40-85°C
ON Resistance-7.5-Ω
ON Capacitance-8.4-pF
-3 dB Frequency Response-950-MHz
Crosstalk (at 100 MHz)--55-dB
ESD Protection (HBM)-2000-V
ESD Protection (CDM)-1000-V
Package Type-XQFN24--
Package Dimensions-3.4 x 2.5 x 0.5 mm--

Key Features

  • High-speed switching capability with a typical bandwidth of 950 MHz.
  • Low ON resistance of 7.5 Ω and low ON capacitance of 8.4 pF.
  • Low crosstalk of -55 dB at 100 MHz.
  • Break-before-make switching to prevent signal overlap.
  • Robust ESD protection: HBM JESD22-A114F Class 2 exceeds 2000 V, CDM AEC-Q100-011 revision B exceeds 1000 V.
  • Operating temperature range from -40°C to +85°C.
  • Compact XQFN24 package with dimensions of 3.4 x 2.5 x 0.5 mm.

Applications

  • Dual camera applications for cell phones.
  • Dual LCD applications for cell phones, digital camera displays, and viewfinders.
  • On-board multimedia application processors.

Q & A

  1. What is the supply voltage range of the NX3DV642GU,115?
    The supply voltage range is from 2.65 V to 4.3 V.
  2. What is the typical ON resistance of the NX3DV642GU,115?
    The typical ON resistance is 7.5 Ω.
  3. What is the typical ON capacitance of the NX3DV642GU,115?
    The typical ON capacitance is 8.4 pF.
  4. What is the maximum frequency the NX3DV642GU,115 can handle?
    The device can handle signals exceeding 500 MHz in frequency.
  5. What type of switching does the NX3DV642GU,115 use?
    The device uses break-before-make switching.
  6. What is the ESD protection level of the NX3DV642GU,115?
    The device has ESD protection exceeding 2000 V for HBM and 1000 V for CDM.
  7. What is the operating temperature range of the NX3DV642GU,115?
    The operating temperature range is from -40°C to +85°C.
  8. What type of package does the NX3DV642GU,115 use?
    The device is packaged in an XQFN24, which is a plastic, extremely thin quad flat package.
  9. What are the dimensions of the XQFN24 package?
    The dimensions are 3.4 x 2.5 x 0.5 mm.
  10. What are some common applications of the NX3DV642GU,115?
    Common applications include dual camera and dual LCD applications in cell phones, digital camera displays, and viewfinders.

Product Attributes

Applications:MIPI
Multiplexer/Demultiplexer Circuit:- 
Switch Circuit:3PDT
Number of Channels:1
On-State Resistance (Max):14Ohm
Voltage - Supply, Single (V+):2.65V ~ 4.3V
Voltage - Supply, Dual (V±):- 
-3db Bandwidth:950MHz
Features:Break-Before-Make
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:24-XFQFN
Supplier Device Package:24-XQFN (2.5x3.4)
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Similar Products

Part Number NX3DV642GU,115 NX3DV42GU,115
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Active
Applications MIPI USB
Multiplexer/Demultiplexer Circuit - -
Switch Circuit 3PDT DPDT
Number of Channels 1 1
On-State Resistance (Max) 14Ohm 6.5Ohm
Voltage - Supply, Single (V+) 2.65V ~ 4.3V 3V ~ 4.3V
Voltage - Supply, Dual (V±) - -
-3db Bandwidth 950MHz 950MHz
Features Break-Before-Make Break-Before-Make, USB 2.0
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 24-XFQFN 10-XFQFN
Supplier Device Package 24-XQFN (2.5x3.4) 10-XQFN (1.4x1.8)

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