Overview
The HD3SS3212-Q1, produced by Texas Instruments, is a high-speed, bidirectional, two-channel differential 2:1/1:2 multiplexer/demultiplexer (MUX/DEMUX) designed for USB Type-C applications. It supports USB 3.2 Gen 1 and Gen 2 data rates and is suitable for various high-speed interface applications. The device features adaptive tracking to maintain signal integrity across a common mode voltage range of 0 V to 2 V and differential signaling with amplitudes up to 1800 mVpp. It consumes less than 1.65 mW of power in operational mode and less than 0.02 µW in shutdown mode, making it power-efficient. The HD3SS3212-Q1 is packaged in a VQFN (20) package with a body size of 2.50 mm × 4.50 mm × 0.5-mm pitch.
Key Specifications
| Parameter | Test Conditions | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|
| VCC (Supply Voltage) | -0.5 | 4 | V | ||
| Differential I/O Voltage | -0.5 | 2.5 | V | ||
| Control Pins Voltage | -0.5 | VCC + 0.5 | V | ||
| Tstg (Storage Temperature) | -65 | 150 | °C | ||
| ICC (Device Active Current) | VCC = 3.3 V, OEn = 0 | 0.5 | 0.8 | mA | |
| ISTDN (Device Shutdown Current) | VCC = 3.3 V, OEn = VCC | 0.005 | 1 | µA | |
| CON (Output ON Capacitance to GND) | 0.6 | pF | |||
| COFF (Output OFF Capacitance to GND) | 0.8 | pF | |||
| RON (Output ON Resistance) | VCC = 3.3 V; VCM = 0 to 2 V; IO = –8 mA | 5 | 8 | Ω |
Key Features
- High-speed bidirectional passive switch in MUX/DEMUX configurations.
- Supports USB 3.2 Gen 1 and Gen 2 data rates.
- Adaptive tracking ensures signal integrity across a common mode voltage range of 0 V to 2 V.
- Differential signaling with amplitudes up to 1800 mVpp.
- Low power consumption: less than 1.65 mW in operational mode and less than 0.02 µW in shutdown mode.
- Output enable and power savings with OEn pin control.
- Supports FPD-Link II and FPD-Link III switching, and MIPI DSI/CSI-2 switching.
- Tolerates polarity inversions for all differential signals on Ports A, B, and C.
Applications
- USB Type-C applications, including host and device side configurations.
- High-speed data protocols such as USB 3.2 and DisplayPort 1.4.
- FPD-Link II and FPD-Link III applications.
- MIPI DSI/CSI-2 applications.
- Generic high-speed interface applications requiring differential signaling.
- Down-facing and up-facing port configurations for USB 3.1 Type C connectors.
Q & A
- What is the primary function of the HD3SS3212-Q1?
The HD3SS3212-Q1 is a high-speed, bidirectional, two-channel differential 2:1/1:2 multiplexer/demultiplexer (MUX/DEMUX) for USB Type-C applications.
- What USB standards does the HD3SS3212-Q1 support?
The device supports USB 3.2 Gen 1 and Gen 2 data rates.
- What is the common mode voltage range supported by the HD3SS3212-Q1?
The device supports a common mode voltage range of 0 V to 2 V.
- What is the maximum differential amplitude supported by the HD3SS3212-Q1?
The device supports differential signaling with amplitudes up to 1800 mVpp.
- How much power does the HD3SS3212-Q1 consume in operational and shutdown modes?
The device consumes less than 1.65 mW in operational mode and less than 0.02 µW in shutdown mode.
- What is the purpose of the OEn pin on the HD3SS3212-Q1?
The OEn pin controls the output enable and power savings, allowing the device to enter a low-power shutdown mode.
- What other high-speed protocols does the HD3SS3212-Q1 support besides USB?
The device supports FPD-Link II, FPD-Link III, and MIPI DSI/CSI-2 switching.
- How does the HD3SS3212-Q1 handle polarity inversions on differential signals?
The device tolerates polarity inversions for all differential signals on Ports A, B, and C.
- What are the key considerations for designing the HD3SS3212-Q1 into a system?
Key considerations include determining the loss profile, providing clean impedance and electrical length matched board traces, placing AC coupling capacitors appropriately, and ensuring proper control signals for the SEL and OEn pins.
- What is the recommended package and thermal management for the HD3SS3212-Q1?
The device is packaged in a VQFN (20) package, and it is recommended to solder the PowerPAD onto the thermal land on high-K boards.
