LPC1837JET100E
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NXP USA Inc. LPC1837JET100E

Manufacturer No:
LPC1837JET100E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 1MB FLASH 100TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC1837JET100E is a 32-bit microcontroller from NXP USA Inc., based on the Arm Cortex-M3 CPU. This microcontroller is part of the LPC1800 series and is known for its high performance and low power consumption. It features a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses, as well as a third bus for peripherals. The LPC1837JET100E is packaged in a 100-pin TFBGA (Thin Fine-Pitch Ball Grid Array) and operates at 3.3V.

Key Specifications

SpecificationValue
Microcontroller Type32-bit Arm Cortex-M3 RISC
Flash Memory1 MB
Operating Voltage3.3 V
Package Type100-pin TFBGA
CPU ArchitectureHarvard architecture with 3-stage pipeline
Local BusesSeparate instruction and data buses, plus a third bus for peripherals

Key Features

  • High-performance Arm Cortex-M3 CPU with a 3-stage pipeline
  • 1 MB of flash memory for code storage
  • Low power consumption, making it suitable for battery-powered applications
  • Multiple communication interfaces including USB, SPI, I2C, and UART
  • Integrated peripherals such as timers, watchdogs, and GPIOs
  • Support for various power modes to optimize energy efficiency

Applications

The LPC1837JET100E is versatile and can be used in a variety of applications, including:

  • Industrial control systems
  • Medical devices
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Robotics and automation

Q & A

  1. What is the CPU architecture of the LPC1837JET100E?
    The LPC1837JET100E uses a Harvard architecture with a 3-stage pipeline based on the Arm Cortex-M3 CPU.
  2. How much flash memory does the LPC1837JET100E have?
    The LPC1837JET100E has 1 MB of flash memory.
  3. What is the operating voltage of the LPC1837JET100E?
    The operating voltage is 3.3 V.
  4. What type of package does the LPC1837JET100E come in?
    The LPC1837JET100E is packaged in a 100-pin TFBGA.
  5. What are some of the key features of the LPC1837JET100E?
    Key features include high-performance CPU, low power consumption, multiple communication interfaces, and integrated peripherals.
  6. What are some common applications for the LPC1837JET100E?
    Common applications include industrial control systems, medical devices, consumer electronics, automotive systems, IoT devices, and robotics.
  7. Where can I purchase the LPC1837JET100E?
    The LPC1837JET100E can be purchased from authorized distributors such as Digi-Key, CATR, and X-On Electronics.
  8. What is the significance of the Harvard architecture in the LPC1837JET100E?
    The Harvard architecture allows for separate local instruction and data buses, as well as a third bus for peripherals, enhancing performance and efficiency.
  9. Does the LPC1837JET100E support various power modes?
    Yes, the LPC1837JET100E supports various power modes to optimize energy efficiency.
  10. What communication interfaces are available on the LPC1837JET100E?
    The LPC1837JET100E includes interfaces such as USB, SPI, I2C, and UART.

Product Attributes

Core Processor:ARM® Cortex®-M3
Core Size:32-Bit Single-Core
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O:49
Program Memory Size:1MB (1M x 8)
Program Memory Type:Flash
EEPROM Size:16K x 8
RAM Size:136K x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 3.6V
Data Converters:A/D 4x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:100-TFBGA
Supplier Device Package:100-TFBGA (9x9)
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Similar Products

Part Number LPC1837JET100E LPC18S37JET100E LPC1817JET100E LPC1827JET100E LPC1833JET100E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 180MHz 180MHz 180MHz 180MHz 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O 49 49 49 49 49
Program Memory Size 1MB (1M x 8) 1MB (1M x 8) 1MB (1M x 8) 1MB (1M x 8) 512KB (512K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 16K x 8 - 16K x 8 16K x 8 16K x 8
RAM Size 136K x 8 136K x 8 136K x 8 136K x 8 136K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V
Data Converters A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 100-TFBGA 100-TFBGA 100-TFBGA 100-TFBGA 100-TFBGA
Supplier Device Package 100-TFBGA (9x9) 100-TFBGA (9x9) 100-TFBGA (9x9) 100-TFBGA (9x9) 100-TFBGA (9x9)

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