LPC1833JET100E
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NXP USA Inc. LPC1833JET100E

Manufacturer No:
LPC1833JET100E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 512KB FLSH 100TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The LPC1833JET100E is a high-performance 32-bit microcontroller from NXP USA Inc., based on the Arm Cortex-M3 core. This microcontroller is part of the LPC1800 series, known for its robust feature set and high performance. It is designed to meet the demands of various embedded applications requiring advanced processing capabilities, multiple peripherals, and low power consumption.

Key Specifications

SpecificationValue
Processor CoreArm Cortex-M3
Flash MemoryUp to 1 MB (specifically 512 kB for LPC1833JET100E)
SRAM136 kB
Package TypeTFBGA100
USB InterfacesTwo High-Speed USB
EthernetYes

Key Features

  • High-performance Arm Cortex-M3 processor core
  • Up to 1 MB of flash memory (512 kB for LPC1833JET100E)
  • 136 kB of SRAM
  • Two High-Speed USB interfaces
  • Ethernet support
  • Multiple peripherals including UART, SPI, I2C, and I2S
  • Low power consumption

Applications

The LPC1833JET100E is suitable for a wide range of applications, including:

  • Industrial control systems
  • Medical devices
  • Consumer electronics
  • Automotive systems
  • Internet of Things (IoT) devices
  • Networking and communication equipment

Q & A

  1. What is the processor core of the LPC1833JET100E?
    The processor core is the Arm Cortex-M3.
  2. How much flash memory does the LPC1833JET100E have?
    The LPC1833JET100E has up to 512 kB of flash memory.
  3. What is the SRAM capacity of the LPC1833JET100E?
    The SRAM capacity is 136 kB.
  4. What package type is the LPC1833JET100E available in?
    The LPC1833JET100E is available in a TFBGA100 package.
  5. Does the LPC1833JET100E support Ethernet?
    Yes, it supports Ethernet.
  6. How many High-Speed USB interfaces does the LPC1833JET100E have?
    The LPC1833JET100E has two High-Speed USB interfaces.
  7. What are some common applications for the LPC1833JET100E?
    Common applications include industrial control systems, medical devices, consumer electronics, automotive systems, IoT devices, and networking equipment.
  8. Where can I find detailed specifications for the LPC1833JET100E?
    Detailed specifications can be found in the datasheet available on NXP's official website or other electronic component databases.
  9. Is the LPC1833JET100E suitable for low power applications?
    Yes, it is designed with low power consumption in mind.
  10. What peripherals are supported by the LPC1833JET100E?
    The LPC1833JET100E supports multiple peripherals including UART, SPI, I2C, and I2S.

Product Attributes

Core Processor:ARM® Cortex®-M3
Core Size:32-Bit Single-Core
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O:49
Program Memory Size:512KB (512K x 8)
Program Memory Type:Flash
EEPROM Size:16K x 8
RAM Size:136K x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 3.6V
Data Converters:A/D 4x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:100-TFBGA
Supplier Device Package:100-TFBGA (9x9)
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Similar Products

Part Number LPC1833JET100E LPC1837JET100E LPC1823JET100E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 180MHz 180MHz 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O 49 49 49
Program Memory Size 512KB (512K x 8) 1MB (1M x 8) 512KB (512K x 8)
Program Memory Type Flash Flash Flash
EEPROM Size 16K x 8 16K x 8 16K x 8
RAM Size 136K x 8 136K x 8 104K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V
Data Converters A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b
Oscillator Type Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 100-TFBGA 100-TFBGA 100-TFBGA
Supplier Device Package 100-TFBGA (9x9) 100-TFBGA (9x9) 100-TFBGA (9x9)

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