LPC1837FET256,551
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NXP USA Inc. LPC1837FET256,551

Manufacturer No:
LPC1837FET256,551
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 1MB FLASH 256LBGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The LPC1837FET256,551 is a high-performance 32-bit microcontroller from NXP USA Inc., based on the Arm Cortex-M3 core. This microcontroller is designed to offer advanced system enhancements, including low power consumption and enhanced debug features. It is packaged in a LBGA256 surface mount package, making it suitable for a wide range of applications requiring high processing power and efficiency.

Key Specifications

SpecificationDetails
CoreArm Cortex-M3
Flash Memory1 MB (1M x 8)
SRAM136 kB
Operating FrequencyUp to 180 MHz
Voltage Range2.4V - 3.6V
Package TypeLBGA256

Key Features

  • High-performance Arm Cortex-M3 core
  • Low power consumption
  • Enhanced debug features
  • High-speed processing up to 180 MHz
  • Integrated 1 MB flash and 136 kB SRAM
  • Wide voltage range of 2.4V - 3.6V

Applications

The LPC1837FET256,551 is versatile and can be used in various applications, including:

  • Industrial control systems
  • Medical devices
  • Consumer electronics
  • Automotive systems
  • IoT devices

Q & A

  1. What is the core type of the LPC1837FET256,551?
    The LPC1837FET256,551 is based on the Arm Cortex-M3 core.
  2. How much flash memory does the LPC1837FET256,551 have?
    The LPC1837FET256,551 has 1 MB of flash memory.
  3. What is the maximum operating frequency of the LPC1837FET256,551?
    The maximum operating frequency is up to 180 MHz.
  4. What is the voltage range for the LPC1837FET256,551?
    The voltage range is 2.4V - 3.6V.
  5. What type of package does the LPC1837FET256,551 come in?
    The LPC1837FET256,551 is packaged in a LBGA256 surface mount package.
  6. How much SRAM does the LPC1837FET256,551 have?
    The LPC1837FET256,551 has 136 kB of SRAM.
  7. What are some key features of the LPC1837FET256,551?
    Key features include low power consumption, enhanced debug features, and high-speed processing.
  8. In what types of applications can the LPC1837FET256,551 be used?
    The LPC1837FET256,551 can be used in industrial control systems, medical devices, consumer electronics, automotive systems, and IoT devices.
  9. Where can I find more detailed specifications for the LPC1837FET256,551?
    You can find detailed specifications on the NXP Semiconductors official website or through distributors like Farnell and Flip Electronics.
  10. Is the LPC1837FET256,551 suitable for high-performance applications?
    Yes, the LPC1837FET256,551 is designed for high-performance applications due to its Arm Cortex-M3 core and high-speed processing capabilities.

Product Attributes

Core Processor:ARM® Cortex®-M3
Core Size:32-Bit Single-Core
Speed:150MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O:80
Program Memory Size:1MB (1M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:136K x 8
Voltage - Supply (Vcc/Vdd):2V ~ 3.6V
Data Converters:A/D 16x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:256-LBGA
Supplier Device Package:256-LBGA (17x17)
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Part Number LPC1837FET256,551 LPC1857FET256,551 LPC1837JET256,551 LPC1830FET256,551 LPC1833FET256,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Discontinued at Digi-Key Active
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 150MHz 180MHz 180MHz 180MHz 150MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 80 164 164 164 80
Program Memory Size 1MB (1M x 8) 1MB (1M x 8) 1MB (1M x 8) - 512KB (512K x 8)
Program Memory Type Flash Flash Flash ROMless Flash
EEPROM Size - 16K x 8 16K x 8 - -
RAM Size 136K x 8 136K x 8 136K x 8 200K x 8 136K x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V 2V ~ 3.6V
Data Converters A/D 16x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 16x10b; D/A 1x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 256-LBGA 256-LBGA 256-LBGA 256-LBGA 256-LBGA
Supplier Device Package 256-LBGA (17x17) 256-LBGA (17x17) 256-LBGA (17x17) 256-LBGA (17x17) 256-LBGA (17x17)

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