LPC1830FET256,551
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NXP USA Inc. LPC1830FET256,551

Manufacturer No:
LPC1830FET256,551
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 32BIT ROMLESS 256LBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The LPC1830FET256,551 is a high-performance, 32-bit microcontroller from NXP USA Inc., based on the Arm Cortex-M3 core. This microcontroller is designed for a wide range of embedded applications, offering a balance of performance, power efficiency, and advanced peripherals. It features 200 kB of SRAM and a variety of interfaces, making it suitable for complex and demanding applications.

Key Specifications

ParameterValue
Microcontroller CoreArm Cortex-M3
Operating FrequencyUp to 180 MHz
SRAM200 kB
Package Type256-pin LBGA
PeripheralsEthernet, High-Speed USB, CAN, SPI, I2C, I2S, UART, etc.
Supply Voltage2.4 V to 3.6 V

Key Features

  • High-performance Arm Cortex-M3 core with up to 180 MHz operating frequency.
  • Advanced peripherals including Ethernet, High-Speed USB, CAN, SPI, I2C, I2S, and UART.
  • 200 kB of SRAM for efficient data processing.
  • 256-pin LBGA package for compact and reliable integration.
  • Low power consumption with multiple power modes.
  • Support for various communication protocols and interfaces.

Applications

  • Industrial automation and control systems.
  • Medical devices and healthcare equipment.
  • Automotive systems, including infotainment and driver assistance.
  • Consumer electronics, such as smart home devices and appliances.
  • Internet of Things (IoT) applications requiring high performance and low power.

Q & A

  1. What is the core architecture of the LPC1830FET256,551?
    The LPC1830FET256,551 is based on the Arm Cortex-M3 core.
  2. What is the maximum operating frequency of the LPC1830FET256,551?
    The maximum operating frequency is up to 180 MHz.
  3. How much SRAM does the LPC1830FET256,551 have?
    The LPC1830FET256,551 features 200 kB of SRAM.
  4. What type of package does the LPC1830FET256,551 come in?
    The LPC1830FET256,551 comes in a 256-pin LBGA package.
  5. What are some of the advanced peripherals available on the LPC1830FET256,551?
    The microcontroller includes Ethernet, High-Speed USB, CAN, SPI, I2C, I2S, and UART among its peripherals.
  6. What are the typical applications for the LPC1830FET256,551?
    It is used in industrial automation, medical devices, automotive systems, consumer electronics, and IoT applications.
  7. What is the supply voltage range for the LPC1830FET256,551?
    The supply voltage range is from 2.4 V to 3.6 V.
  8. Does the LPC1830FET256,551 support low power modes?
    Yes, it supports multiple power modes for low power consumption.
  9. Where can I find detailed datasheets for the LPC1830FET256,551?
    Detailed datasheets can be found on the NXP Semiconductors website and other authorized distributors like Mouser Electronics.
  10. Is the LPC1830FET256,551 RoHS compliant?
    Yes, the LPC1830FET256,551 is RoHS compliant.

Product Attributes

Core Processor:ARM® Cortex®-M3
Core Size:32-Bit Single-Core
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O:164
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:200K x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 3.6V
Data Converters:A/D 8x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:256-LBGA
Supplier Device Package:256-LBGA (17x17)
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Similar Products

Part Number LPC1830FET256,551 LPC1850FET256,551 LPC1837FET256,551 LPC1833FET256,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Discontinued at Digi-Key Active Active Active
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 180MHz 180MHz 150MHz 150MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 164 164 80 80
Program Memory Size - - 1MB (1M x 8) 512KB (512K x 8)
Program Memory Type ROMless ROMless Flash Flash
EEPROM Size - - - -
RAM Size 200K x 8 200K x 8 136K x 8 136K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.2V ~ 3.6V 2V ~ 3.6V 2V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 16x10b; D/A 1x10b A/D 16x10b; D/A 1x10b
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 256-LBGA 256-LBGA 256-LBGA 256-LBGA
Supplier Device Package 256-LBGA (17x17) 256-LBGA (17x17) 256-LBGA (17x17) 256-LBGA (17x17)

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