LPC1850FET256,551
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NXP USA Inc. LPC1850FET256,551

Manufacturer No:
LPC1850FET256,551
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 32BIT ROMLESS 256LBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The LPC1850FET256,551 is a high-performance microcontroller from NXP USA Inc., based on the ARM Cortex-M3 core. This microcontroller is designed for demanding embedded applications, offering a robust set of features and peripherals. It is part of the LPC1850 series, which is known for its advanced capabilities and versatility in various industrial and consumer electronics.

Key Specifications

ParameterValue
Microcontroller CoreARM Cortex-M3
Package256-LBGA
Supply Voltage2.2V ~ 3.6V
SRAM200 kB
ROM65536 words
Number of I/Os164
Operating Temperature-40°C ~ 85°C (TA)
Data ConvertersA/D 8x10b; D/A 1x10b
Mounting TypeSurface Mount
RoHS StatusROHS3 Compliant
Factory Lead Time12 Weeks

Key Features

  • Quad SPI Flash Interface (SPIFI)
  • Two High-speed USB ports
  • Ethernet interface
  • LCD controller
  • Advanced power management with multiple power modes
  • High-performance ARM Cortex-M3 core

Applications

The LPC1850FET256,551 is suitable for a wide range of applications, including industrial control systems, medical devices, automotive systems, consumer electronics, and IoT devices. Its robust feature set and high performance make it an ideal choice for complex embedded systems that require advanced peripherals and low power consumption.

Q & A

  1. What is the core type of the LPC1850FET256,551? The core type is ARM Cortex-M3.
  2. What is the package type of the LPC1850FET256,551? The package type is 256-LBGA.
  3. What is the supply voltage range for the LPC1850FET256,551? The supply voltage range is 2.2V ~ 3.6V.
  4. How much SRAM does the LPC1850FET256,551 have? It has 200 kB of SRAM.
  5. What are the operating temperature ranges for the LPC1850FET256,551? The operating temperature ranges are -40°C ~ 85°C (TA).
  6. Is the LPC1850FET256,551 RoHS compliant? Yes, it is ROHS3 compliant.
  7. What is the factory lead time for the LPC1850FET256,551? The factory lead time is 12 weeks.
  8. What are some of the key peripherals available on the LPC1850FET256,551? Key peripherals include two High-speed USB ports, Ethernet interface, and LCD controller.
  9. What is the mounting type of the LPC1850FET256,551? The mounting type is Surface Mount.
  10. How many I/Os does the LPC1850FET256,551 have? It has 164 I/Os.

Product Attributes

Core Processor:ARM® Cortex®-M3
Core Size:32-Bit Single-Core
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O:164
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:200K x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 3.6V
Data Converters:A/D 8x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:256-LBGA
Supplier Device Package:256-LBGA (17x17)
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Similar Products

Part Number LPC1850FET256,551 LPC1857FET256,551 LPC1853FET256,551 LPC18S50FET256,551 LPC1830FET256,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Discontinued at Digi-Key
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 180MHz 180MHz 150MHz 180MHz 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 164 164 80 164 164
Program Memory Size - 1MB (1M x 8) 512KB (512K x 8) - -
Program Memory Type ROMless Flash Flash ROMless ROMless
EEPROM Size - 16K x 8 - - -
RAM Size 200K x 8 136K x 8 136K x 8 200K x 8 200K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.2V ~ 3.6V 2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 16x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 8x10b; D/A 1x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 256-LBGA 256-LBGA 256-LBGA 256-LBGA 256-LBGA
Supplier Device Package 256-LBGA (17x17) 256-LBGA (17x17) 256-LBGA (17x17) 256-LBGA (17x17) 256-LBGA (17x17)

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