LPC1820FET100,551
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NXP USA Inc. LPC1820FET100,551

Manufacturer No:
LPC1820FET100,551
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT ROMLESS 100TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC1820FET100,551 is a high-performance microcontroller from NXP USA Inc., part of the LPC18xx series. This device is based on the ARM Cortex-M3 core, which is a next-generation processor designed for embedded applications. It offers a balance of performance, power efficiency, and advanced peripherals, making it suitable for a wide range of applications.

Key Specifications

SpecificationValue
Processor CoreARM Cortex-M3
Package Type100-pin TFBGA
SRAM168 kB
Max Supply Voltage3.6 V
Min Operating Temperature-40°C
Max Operating Temperature85°C
Max Power Dissipation1.5 W
Memory TypeROMless, SRAM

Key Features

  • High-performance ARM Cortex-M3 processor core
  • Advanced peripherals including High Speed USB, Ethernet, and CAN
  • 168 kB of SRAM for efficient data processing
  • ROMless architecture for flexibility in code storage
  • Low power consumption with various power-saving modes
  • Support for multiple communication interfaces such as UART, SPI, and I2C

Applications

The LPC1820FET100,551 is versatile and can be used in a variety of embedded applications, including:

  • Industrial control systems
  • Medical devices
  • Automotive systems
  • Consumer electronics
  • Networking and communication devices

Q & A

  1. What is the processor core of the LPC1820FET100,551?
    The processor core is the ARM Cortex-M3.
  2. How much SRAM does the LPC1820FET100,551 have?
    The device has 168 kB of SRAM.
  3. What is the maximum supply voltage for the LPC1820FET100,551?
    The maximum supply voltage is 3.6 V.
  4. What are some of the advanced peripherals available on this microcontroller?
    Advanced peripherals include High Speed USB, Ethernet, and CAN.
  5. What is the operating temperature range for the LPC1820FET100,551?
    The operating temperature range is from -40°C to 85°C.
  6. Is the LPC1820FET100,551 suitable for low-power applications?
    Yes, it has various power-saving modes to reduce power consumption.
  7. What types of memory does the LPC1820FET100,551 have?
    The device has ROMless architecture with SRAM.
  8. Can the LPC1820FET100,551 be used in automotive systems?
    Yes, it is suitable for use in automotive systems.
  9. What communication interfaces are supported by the LPC1820FET100,551?
    The device supports multiple communication interfaces such as UART, SPI, and I2C.
  10. Where can I find detailed specifications for the LPC1820FET100,551?
    Detailed specifications can be found on the NXP Semiconductors official website and other authorized distributors like Digi-Key and Mouser.

Product Attributes

Core Processor:ARM® Cortex®-M3
Core Size:32-Bit Single-Core
Speed:150MHz
Connectivity:CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O:64
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:168K x 8
Voltage - Supply (Vcc/Vdd):2V ~ 3.6V
Data Converters:A/D 12x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:100-TFBGA
Supplier Device Package:100-TFBGA (9x9)
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Similar Products

Part Number LPC1820FET100,551 LPC1830FET100,551 LPC1810FET100,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 150MHz 180MHz 150MHz
Connectivity CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 64 49 64
Program Memory Size - - -
Program Memory Type ROMless ROMless ROMless
EEPROM Size - - -
RAM Size 168K x 8 200K x 8 136K x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V 2.2V ~ 3.6V 2V ~ 3.6V
Data Converters A/D 12x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 12x10b; D/A 1x10b
Oscillator Type Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 100-TFBGA 100-TFBGA 100-TFBGA
Supplier Device Package 100-TFBGA (9x9) 100-TFBGA (9x9) 100-TFBGA (9x9)

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