STM32H747XGH6
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STMicroelectronics STM32H747XGH6

Manufacturer No:
STM32H747XGH6
Manufacturer:
STMicroelectronics
Package:
Tray
Description:
IC MCU 32BIT 1MB FLASH TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STM32H747XGH6 is a high-performance microcontroller from STMicroelectronics, part of the STM32H7 series. It is built around dual 32-bit Arm® Cortex®-M7 and Cortex®-M4 cores, providing a robust platform for demanding applications. The device is designed to offer a comprehensive set of peripherals and features, making it suitable for a wide range of applications, including industrial, automotive, and consumer electronics.

Key Specifications

Specification Details
Cores 32-bit Arm® Cortex®-M7 core (up to 480 MHz) and 32-bit Arm® Cortex®-M4 core (up to 240 MHz)
Flash Memory Up to 2 Mbytes with read-while-write capability
RAM 1 Mbyte (864 Kbytes of user SRAM, 4 Kbytes of SRAM in the backup domain, and 192 Kbytes of TCM RAM)
Cache 16 Kbytes of data and 16 Kbytes of instruction cache for Cortex®-M7 core
DMIPS 1027 DMIPS for Cortex®-M7 core and 300 DMIPS for Cortex®-M4 core
Internal Oscillators 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI
External Oscillators 4-48 MHz HSE, 32.768 kHz LSE
Communication Peripherals Up to 35 communication peripherals including I2Cs, USARTs/UARTs, SPIs, and more
Power Domains 3 separate power domains (D1, D2, D3) which can be independently clock-gated or switched off

Key Features

  • Dual-Core Architecture: Combines a 32-bit Arm® Cortex®-M7 core with a 32-bit Arm® Cortex®-M4 core, offering high performance and flexibility.
  • High-Performance Cores: Cortex®-M7 core with double-precision FPU and L1 cache, operating up to 480 MHz, and Cortex®-M4 core with FPU and ART Accelerator, operating up to 240 MHz.
  • Memory and Cache: Up to 2 Mbytes of Flash memory with read-while-write capability, 1 Mbyte of RAM, and 16 Kbytes of data and instruction cache for the Cortex®-M7 core.
  • Peripherals and Interfaces: Includes USB OTG HS, Ethernet, microSD card, SAI audio DAC, MEMS digital microphone, SDRAM, quad-SPI flash, DCMI connector, MIPI® DSI interface, and more.
  • Power Management: Features 3 separate power domains that can be independently clock-gated or switched off.
  • Security Features: Includes ROP, PC-ROP, active tamper, and a memory protection unit (MPU) for enhanced security.
  • Communication Interfaces: Supports up to 35 communication peripherals including I2Cs, USARTs/UARTs, SPIs, and more.

Applications

  • Industrial Automation: Suitable for control systems, motor control, and industrial communication protocols.
  • Automotive Systems: Used in advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units.
  • Consumer Electronics: Ideal for smart home devices, wearables, and other consumer electronics requiring high performance and low power consumption.
  • Medical Devices: Can be used in medical diagnostic equipment, patient monitoring systems, and other medical applications.
  • Aerospace and Defense: Suitable for various aerospace and defense applications due to its high reliability and security features.

Q & A

  1. What are the core specifications of the STM32H747XGH6?

    The STM32H747XGH6 features a 32-bit Arm® Cortex®-M7 core operating up to 480 MHz and a 32-bit Arm® Cortex®-M4 core operating up to 240 MHz.

  2. How much Flash and RAM does the STM32H747XGH6 have?

    The device has up to 2 Mbytes of Flash memory and 1 Mbyte of RAM.

  3. What are the key peripherals and interfaces available on the STM32H747XGH6?

    The device includes USB OTG HS, Ethernet, microSD card, SAI audio DAC, MEMS digital microphone, SDRAM, quad-SPI flash, DCMI connector, MIPI® DSI interface, and more.

  4. What are the power management features of the STM32H747XGH6?

    The device features 3 separate power domains that can be independently clock-gated or switched off.

  5. What security features does the STM32H747XGH6 offer?

    The device includes ROP, PC-ROP, active tamper, and a memory protection unit (MPU) for enhanced security.

  6. What are some typical applications of the STM32H747XGH6?

    The device is suitable for industrial automation, automotive systems, consumer electronics, medical devices, and aerospace and defense applications.

  7. How many communication peripherals does the STM32H747XGH6 support?

    The device supports up to 35 communication peripherals.

  8. What is the maximum frequency of the internal oscillators?

    The internal oscillators include a 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, and 32 kHz LSI.

  9. Does the STM32H747XGH6 support external memory interfaces?

    Yes, it supports flexible external memory interfaces including SRAM, PSRAM, SDRAM/LPSDR SDRAM, and NOR/NAND Flash memory.

  10. What is the purpose of the ART Accelerator in the STM32H747XGH6?

    The ART Accelerator is used for internal Flash memory and external memories, enhancing real-time performance.

  11. How does the STM32H747XGH6 support development and debugging?

    The device can be used with the STLINK-V3E for embedded in-circuit debugging and programming, and it includes connectors for expansion shields or daughterboards.

Product Attributes

Core Processor:ARM® Cortex®-M4/M7
Core Size:32-Bit Dual-Core
Speed:240MHz, 480MHz
Connectivity:
Peripherals:Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O:168
Program Memory Size:1MB (1M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:1M x 8
Voltage - Supply (Vcc/Vdd):1.62V ~ 3.6V
Data Converters:A/D 36x16b; D/A 2x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:265-TFBGA
Supplier Device Package:240+25-TFBGA (14x14)
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Similar Products

Part Number STM32H747XGH6 STM32H747XIH6 STM32H742XGH6 STM32H743XGH6 STM32H745XGH6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Product Status Active Active Active Active Active
Core Processor ARM® Cortex®-M4/M7 ARM® Cortex®-M4/M7 ARM® Cortex®-M7 ARM® Cortex®-M7 ARM® Cortex®-M4/M7
Core Size 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Dual-Core
Speed 240MHz, 480MHz 240MHz, 480MHz 480MHz 480MHz 240MHz, 480MHz
Connectivity
Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O 168 168 168 168 168
Program Memory Size 1MB (1M x 8) 2MB (2M x 8) 1MB (1M x 8) 1MB (1M x 8) 1MB (1M x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size - - - - -
RAM Size 1M x 8 1M x 8 688K x 8 1M x 8 1M x 8
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V 1.62V ~ 3.6V 1.62V ~ 3.6V 1.62V ~ 3.6V 1.62V ~ 3.6V
Data Converters A/D 36x16b; D/A 2x12b A/D 36x16b; D/A 2x12b A/D 36x16b; D/A 2x12b A/D 36x16b; D/A 2x12b A/D 36x16b; D/A 2x12b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 265-TFBGA 265-TFBGA 265-TFBGA 265-TFBGA 265-TFBGA
Supplier Device Package 240+25-TFBGA (14x14) 240+25-TFBGA (14x14) 240+25-TFBGA (14x14) 240+25-TFBGA (14x14) 240+25-TFBGA (14x14)

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