LPC1830FET100,551
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NXP USA Inc. LPC1830FET100,551

Manufacturer No:
LPC1830FET100,551
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 32BIT ROMLESS 100TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The LPC1830FET100,551 is a high-performance 32-bit microcontroller from NXP USA Inc., based on the Arm Cortex-M3 core. This microcontroller is designed for a wide range of embedded applications, offering a balance of performance, power efficiency, and advanced peripherals. It features a 180 MHz CPU, 200 kB of SRAM, and various communication interfaces such as Ethernet, High-speed USB, and multiple serial communication protocols.

Key Specifications

ParameterValue
Core ProcessorARM Cortex-M3
Core Speed180 MHz
SRAM Size200 kB
Program Memory TypeFLASH
Program Memory Size1 MB (1M x 8)
Package Type100-TFBGA
Supply Voltage2V ~ 3.6V
Operating Temperature-40°C ~ 85°C (TA)
PeripheralsBrown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Data ConvertersA/D 16x10b; D/A 1x10b

Key Features

  • High-performance Arm Cortex-M3 core at 180 MHz
  • 200 kB of SRAM and 1 MB of FLASH memory
  • Dual High-speed USB ports and Ethernet interface
  • Advanced peripherals including SPIFI, I²S, and motor control PWM
  • Multiple serial communication protocols such as I²C, SPI, and UART/USART
  • Integrated CANbus and SD/MMC interfaces
  • Low power consumption with various power-saving modes

Applications

The LPC1830FET100,551 is suitable for a variety of embedded applications, including industrial control systems, medical devices, consumer electronics, and automotive systems. Its advanced peripherals and high-performance capabilities make it an ideal choice for applications requiring robust communication, data processing, and control functions.

Q & A

  1. What is the core processor of the LPC1830FET100,551?
    The core processor is the ARM Cortex-M3.
  2. What is the maximum clock speed of the LPC1830FET100,551?
    The maximum clock speed is 180 MHz.
  3. How much SRAM does the LPC1830FET100,551 have?
    The LPC1830FET100,551 has 200 kB of SRAM.
  4. What type of program memory does the LPC1830FET100,551 use?
    The program memory type is FLASH.
  5. What is the program memory size of the LPC1830FET100,551?
    The program memory size is 1 MB (1M x 8).
  6. What is the package type of the LPC1830FET100,551?
    The package type is 100-TFBGA.
  7. What are the supply voltage ranges for the LPC1830FET100,551?
    The supply voltage ranges from 2V to 3.6V.
  8. What are the operating temperature ranges for the LPC1830FET100,551?
    The operating temperature ranges from -40°C to 85°C (TA).
  9. What advanced peripherals are available on the LPC1830FET100,551?
    The LPC1830FET100,551 includes advanced peripherals such as SPIFI, I²S, motor control PWM, and more.
  10. What communication interfaces are supported by the LPC1830FET100,551?
    The LPC1830FET100,551 supports various communication interfaces including Ethernet, High-speed USB, CANbus, I²C, SPI, and UART/USART.

Product Attributes

Core Processor:ARM® Cortex®-M3
Core Size:32-Bit Single-Core
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O:49
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:200K x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 3.6V
Data Converters:A/D 8x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:100-TFBGA
Supplier Device Package:100-TFBGA (9x9)
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Similar Products

Part Number LPC1830FET100,551 LPC1830FET180,551 LPC1810FET100,551 LPC1820FET100,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 180MHz 180MHz 150MHz 150MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 49 118 64 64
Program Memory Size - - - -
Program Memory Type ROMless ROMless ROMless ROMless
EEPROM Size - - - -
RAM Size 200K x 8 200K x 8 136K x 8 168K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.2V ~ 3.6V 2V ~ 3.6V 2V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b A/D 8x10b; D/A 1x10b A/D 12x10b; D/A 1x10b A/D 12x10b; D/A 1x10b
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 100-TFBGA 180-TFBGA 100-TFBGA 100-TFBGA
Supplier Device Package 100-TFBGA (9x9) 180-TFBGA (12x12) 100-TFBGA (9x9) 100-TFBGA (9x9)

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