BAP65-03,115
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NXP USA Inc. BAP65-03,115

Manufacturer No:
BAP65-03,115
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
RF DIODE PIN 30V 500MW SOD323
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The BAP65-03,115 is a Silicon planar PIN diode manufactured by NXP USA Inc. This component is packaged in a small plastic SMD package, specifically the SOD-323 package style. It is designed for high-performance applications requiring precise control over RF signals.

Key Specifications

ParameterConditionsMinTypMaxUnit
Continuous Reverse Voltage (VR)---30V
Continuous Forward Current (IF)---100mA
Total Power Dissipation (Ptot)Tsp ≤ 90 °C--500mW
Storage Temperature (Tstg)--65-150°C
Junction Temperature (Tj)--65-150°C
Thermal Resistance from Junction to Solder Point (Rth(j-sp))--120-K/W
Maximum Diode Capacitance---0.8pF
Series Inductance (LS)IF = 100 mA; f = 100 MHz--1.5nH

Key Features

  • High voltage, current controlled
  • RF resistor for RF attenuators and switches
  • Low diode capacitance
  • Low diode forward resistance
  • Very low series inductance

Applications

  • RF attenuators and switches
  • Bandswitch for TV tuners
  • Mobile communication

Q & A

  1. What is the BAP65-03,115? The BAP65-03,115 is a Silicon planar PIN diode in a SOD-323 package, manufactured by NXP USA Inc.
  2. What is the maximum continuous reverse voltage of the BAP65-03,115? The maximum continuous reverse voltage is 30 V.
  3. What is the maximum continuous forward current of the BAP65-03,115? The maximum continuous forward current is 100 mA.
  4. What are the typical applications of the BAP65-03,115? Typical applications include RF attenuators and switches, bandswitch for TV tuners, and mobile communication.
  5. What is the package style of the BAP65-03,115? The package style is SOD-323.
  6. What is the mounting method of the BAP65-03,115? The mounting method is surface mount.
  7. What is the maximum diode capacitance of the BAP65-03,115? The maximum diode capacitance is 0.8 pF.
  8. What is the thermal resistance from junction to solder point of the BAP65-03,115? The thermal resistance from junction to solder point is 120 K/W.
  9. What are the key features of the BAP65-03,115? Key features include high voltage, current controlled; RF resistor for RF attenuators and switches; low diode capacitance; low diode forward resistance; and very low series inductance.
  10. What is the storage temperature range for the BAP65-03,115? The storage temperature range is from -65 °C to 150 °C.

Product Attributes

Diode Type:PIN - Single
Voltage - Peak Reverse (Max):30V
Current - Max:100 mA
Capacitance @ Vr, F:0.375pF @ 20V, 1MHz
Resistance @ If, F:350mOhm @ 100mA, 100MHz
Power Dissipation (Max):500 mW
Operating Temperature:-65°C ~ 150°C (TJ)
Package / Case:SC-76, SOD-323
Supplier Device Package:SOD-323
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Similar Products

Part Number BAP65-03,115 BAP63-03,115 BAP64-03,115 BAP65-02,115
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Obsolete Active Active
Diode Type PIN - Single PIN - Single PIN - Single PIN - Single
Voltage - Peak Reverse (Max) 30V 50V 175V 30V
Current - Max 100 mA 100 mA 100 mA 100 mA
Capacitance @ Vr, F 0.375pF @ 20V, 1MHz 0.32pF @ 20V, 1MHz 0.35pF @ 20V, 1MHz 0.375pF @ 20V, 1MHz
Resistance @ If, F 350mOhm @ 100mA, 100MHz 1.5Ohm @ 100mA, 100MHz 1.35Ohm @ 100mA, 100MHz 350mOhm @ 100mA, 100MHz
Power Dissipation (Max) 500 mW 500 mW 500 mW 715 mW
Operating Temperature -65°C ~ 150°C (TJ) -65°C ~ 150°C (TJ) -65°C ~ 150°C (TJ) -65°C ~ 150°C (TJ)
Package / Case SC-76, SOD-323 SC-76, SOD-323 SC-76, SOD-323 SC-79, SOD-523
Supplier Device Package SOD-323 SOD-323 SOD-323 SOD-523

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