MT41K512M8DA-107:P TR
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Micron Technology Inc. MT41K512M8DA-107:P TR

Manufacturer No:
MT41K512M8DA-107:P TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC DRAM 4GBIT PARALLEL 78FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MT41K512M8DA-107:P TR is a 4Gb DDR3L SDRAM module produced by Micron Technology Inc. This component is designed to offer high performance and low power consumption, making it suitable for a variety of applications requiring robust memory solutions. The DDR3L specification is a low-voltage version of the DDR3 standard, operating at 1.35V while maintaining backward compatibility with 1.5V DDR3 systems.

Key Specifications

ParameterValue
Capacity4Gb (512 Meg x 8)
PackageFBGA (78-ball, 9mm x 10.5mm, Pb-free)
VoltageVDD = VDDQ = 1.35V (1.283–1.45V), backward compatible to 1.5V ±0.075V
Speed GradeDDR3-1866 (MT/s)
CAS Latency (CL)13 (ns)
tRCD-tRP-CL13-13-13 (ns)
Internal Banks8
Refresh Count8K
Row Address64K (A[15:0])
Column Address1K (A[9:0])
Page Size1KB
Operating TemperatureCommercial (0°C to +95°C), Industrial (–40°C to +95°C), Automotive (–40°C to +105°C)

Key Features

  • Differential bidirectional data strobe
  • Differential clock inputs (CK, CK#)
  • Programmable CAS (READ) latency (CL) and CAS (WRITE) latency (CWL)
  • Fixed burst length (BL) of 8 and burst chop (BC) of 4
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Self refresh mode and automatic self refresh (ASR)
  • Write leveling and multipurpose register
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

Applications

The MT41K512M8DA-107:P TR is suitable for various applications requiring high-density, low-power memory solutions. These include:

  • Server and data center systems
  • Cloud computing infrastructure
  • High-performance computing (HPC) systems
  • Embedded systems and industrial control devices
  • Automotive systems requiring robust and reliable memory

Q & A

  1. What is the capacity of the MT41K512M8DA-107:P TR?
    The capacity is 4Gb, configured as 512 Meg x 8.
  2. What is the operating voltage of this DDR3L SDRAM?
    The operating voltage is 1.35V, with backward compatibility to 1.5V ±0.075V.
  3. What is the speed grade of this component?
    The speed grade is DDR3-1866 (MT/s).
  4. How many internal banks does this SDRAM have?
    It has 8 internal banks.
  5. What are the key features of this SDRAM?
    Key features include differential bidirectional data strobe, programmable CAS latency, self refresh mode, and on-die termination.
  6. What are the typical applications for this component?
    Typical applications include server and data center systems, cloud computing infrastructure, HPC systems, embedded systems, and automotive systems.
  7. What is the package type and size of this component?
    The package type is FBGA (78-ball), with dimensions of 9mm x 10.5mm.
  8. Is this component backward compatible with DDR3 systems?
    Yes, it is backward compatible with 1.5V DDR3 systems.
  9. What are the operating temperature ranges for this component?
    The operating temperature ranges are Commercial (0°C to +95°C), Industrial (–40°C to +95°C), and Automotive (–40°C to +105°C).
  10. Does this component support self refresh and automatic self refresh?
    Yes, it supports both self refresh mode and automatic self refresh (ASR).

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - DDR3L
Memory Size:4Gb (512M x 8)
Memory Interface:Parallel
Clock Frequency:933 MHz
Write Cycle Time - Word, Page:- 
Access Time:20 ns
Voltage - Supply:1.283V ~ 1.45V
Operating Temperature:0°C ~ 95°C (TC)
Mounting Type:Surface Mount
Package / Case:78-TFBGA
Supplier Device Package:78-FBGA (8x10.5)
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