Overview
The MT41K512M8DA-107:P TR is a 4Gb DDR3L SDRAM module produced by Micron Technology Inc. This component is designed to offer high performance and low power consumption, making it suitable for a variety of applications requiring robust memory solutions. The DDR3L specification is a low-voltage version of the DDR3 standard, operating at 1.35V while maintaining backward compatibility with 1.5V DDR3 systems.
Key Specifications
Parameter | Value |
---|---|
Capacity | 4Gb (512 Meg x 8) |
Package | FBGA (78-ball, 9mm x 10.5mm, Pb-free) |
Voltage | VDD = VDDQ = 1.35V (1.283–1.45V), backward compatible to 1.5V ±0.075V |
Speed Grade | DDR3-1866 (MT/s) |
CAS Latency (CL) | 13 (ns) |
tRCD-tRP-CL | 13-13-13 (ns) |
Internal Banks | 8 |
Refresh Count | 8K |
Row Address | 64K (A[15:0]) |
Column Address | 1K (A[9:0]) |
Page Size | 1KB |
Operating Temperature | Commercial (0°C to +95°C), Industrial (–40°C to +95°C), Automotive (–40°C to +105°C) |
Key Features
- Differential bidirectional data strobe
- Differential clock inputs (CK, CK#)
- Programmable CAS (READ) latency (CL) and CAS (WRITE) latency (CWL)
- Fixed burst length (BL) of 8 and burst chop (BC) of 4
- Selectable BC4 or BL8 on-the-fly (OTF)
- Self refresh mode and automatic self refresh (ASR)
- Write leveling and multipurpose register
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
Applications
The MT41K512M8DA-107:P TR is suitable for various applications requiring high-density, low-power memory solutions. These include:
- Server and data center systems
- Cloud computing infrastructure
- High-performance computing (HPC) systems
- Embedded systems and industrial control devices
- Automotive systems requiring robust and reliable memory
Q & A
- What is the capacity of the MT41K512M8DA-107:P TR?
The capacity is 4Gb, configured as 512 Meg x 8. - What is the operating voltage of this DDR3L SDRAM?
The operating voltage is 1.35V, with backward compatibility to 1.5V ±0.075V. - What is the speed grade of this component?
The speed grade is DDR3-1866 (MT/s). - How many internal banks does this SDRAM have?
It has 8 internal banks. - What are the key features of this SDRAM?
Key features include differential bidirectional data strobe, programmable CAS latency, self refresh mode, and on-die termination. - What are the typical applications for this component?
Typical applications include server and data center systems, cloud computing infrastructure, HPC systems, embedded systems, and automotive systems. - What is the package type and size of this component?
The package type is FBGA (78-ball), with dimensions of 9mm x 10.5mm. - Is this component backward compatible with DDR3 systems?
Yes, it is backward compatible with 1.5V DDR3 systems. - What are the operating temperature ranges for this component?
The operating temperature ranges are Commercial (0°C to +95°C), Industrial (–40°C to +95°C), and Automotive (–40°C to +105°C). - Does this component support self refresh and automatic self refresh?
Yes, it supports both self refresh mode and automatic self refresh (ASR).