EP4CE115F29I7N
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Intel EP4CE115F29I7N

Manufacturer No:
EP4CE115F29I7N
Manufacturer:
Intel
Package:
Tray
Description:
IC FPGA 528 I/O 780FBGA
Delivery:
Payment:
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Product Introduction

Overview

The Intel Cyclone IV EP4CE115F29I7N is a Field-Programmable Gate Array (FPGA) from the Cyclone IV E family. Launched in 2009, this FPGA is fabricated using 60 nm technology, offering a balance between performance and power efficiency. It is part of Intel's Cyclone series, known for its cost-effectiveness and versatility in various applications.

This specific model, EP4CE115F29I7N, is packaged in a 780-pin FineLine BGA (FBGA) and operates with a core voltage of 1.0 V or 1.2 V. It is designed to support a wide range of I/O standards and external memory interfaces, making it suitable for diverse system designs.

Key Specifications

Parameter Specification
Logic Elements (LE) 114,000
Fabric and I/O Phase-Locked Loops (PLLs) 4
Maximum Embedded Memory 3.888 Mb
Digital Signal Processing (DSP) Blocks 266
DSP Format Multiply
Hard Memory Controllers No
External Memory Interfaces (EMIF) DDR, DDR2, SDR
Maximum User I/O Count 528
I/O Standards Support 3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, Mini-LVDS, RSDS, LVPECL, BLVDS, PPDS
Package Options F484, F780 (this model: F780)
Lithography 60 nm

Key Features

  • High Logic Element Count: With 114,000 logic elements, this FPGA offers significant processing capability.
  • Advanced I/O Standards: Supports a wide range of I/O standards, including LVTTL, LVCMOS, PCI, PCI-X, and more.
  • Embedded Memory and DSP Blocks: Features 3.888 Mb of embedded memory and 266 DSP blocks, enhancing its capability for digital signal processing.
  • External Memory Interfaces: Supports DDR, DDR2, and SDR external memory interfaces, facilitating integration with various memory types.
  • Phase-Locked Loops (PLLs): Includes four PLLs for clock management and synchronization.

Applications

  • Communication Systems: Suitable for use in telecommunications equipment, network routers, and switches due to its high I/O count and support for various I/O standards.
  • Industrial Control Systems: Can be used in industrial automation, control systems, and monitoring devices due to its robust processing capabilities and memory resources.
  • Consumer Electronics: Applicable in consumer electronics such as set-top boxes, digital video recorders, and other multimedia devices.
  • Aerospace and Defense: Its reliability and performance make it a candidate for use in aerospace and defense applications.

Q & A

  1. What is the logic element count of the EP4CE115F29I7N FPGA?

    The EP4CE115F29I7N FPGA has 114,000 logic elements.

  2. What is the maximum embedded memory of this FPGA?

    The maximum embedded memory is 3.888 Mb.

  3. How many DSP blocks does this FPGA have?

    This FPGA features 266 DSP blocks.

  4. What are the supported external memory interfaces?

    The FPGA supports DDR, DDR2, and SDR external memory interfaces.

  5. What is the package type of the EP4CE115F29I7N?

    The package type is a 780-pin FineLine BGA (FBGA).

  6. What are the supported I/O standards?

    The FPGA supports a wide range of I/O standards including LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, and others.

  7. How many PLLs does this FPGA have?

    The FPGA includes four Phase-Locked Loops (PLLs).

  8. What is the lithography process used for this FPGA?

    The FPGA is fabricated using 60 nm technology.

  9. What are some typical applications of the EP4CE115F29I7N FPGA?

    It is suitable for communication systems, industrial control systems, consumer electronics, and aerospace and defense applications.

  10. Is the EP4CE115F29I7N FPGA still in production?

    Although launched in 2009, it is still available from various suppliers, but it is recommended to check the current production status with Intel or authorized distributors.

Product Attributes

Number of LABs/CLBs:7155
Number of Logic Elements/Cells:114480
Total RAM Bits:3981312
Number of I/O:528
Number of Gates:- 
Voltage - Supply:1.15V ~ 1.25V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:780-BGA
Supplier Device Package:780-FBGA (29x29)
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Similar Products

Part Number EP4CE115F29I7N EP4CE115F23I7N EP4CE115F29C7N EP4CE115F29I7
Manufacturer Intel Intel Intel Intel
Product Status Active Active Active Active
Number of LABs/CLBs 7155 7155 7155 7155
Number of Logic Elements/Cells 114480 114480 114480 114480
Total RAM Bits 3981312 3981312 3981312 3981312
Number of I/O 528 280 528 528
Number of Gates - - - -
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Package / Case 780-BGA 484-BGA 780-BGA 780-BGA
Supplier Device Package 780-FBGA (29x29) 484-FBGA (23x23) 780-FBGA (29x29) 780-FBGA (29x29)

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