Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	126-91-952-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	41	$20.14		126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	8080-1G9 CONN TRANSIST TO-3 4POS GOLD TE Connectivity AMP Connectors	46	$20.35		8080	Bulk	Active	Transistor, TO-3	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
	APA-324-G-Q ADAPTER PLUG Samtec Inc.	10	$20.03		APA	Tube	Active	-	24 (2 x 12)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	APA-624-G-Q ADAPTER PLUG Samtec Inc.	12	$20.18		APA	Tube	Active	-	24 (2 x 12)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	104-13-952-41-780000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	17	$20.28		104	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic	-
	110-43-316-61-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$20.27			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-316-61-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	41	$20.39			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	517-83-364-17-091111 CONN SOCKET PGA 364POS GOLD Preci-Dip	33	$21.12		517	Bulk	Active	PGA	364 (17 x 17)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	1109310-48 SER X55X UNIV ZIF DIP TST SCKT Aries Electronics	20	$20.48			-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	517-87-503-22-131111 CONN SOCKET PGA 503POS GOLD Preci-Dip	7	$20.98		517	Bulk	Active	PGA	503 (22 x 22)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	614-83-168-17-101112 CONN SOCKET PGA 168POS GOLD Preci-Dip	47	$20.97		614	Bulk	Active	PGA	168 (17 x 17)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	115-43-318-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	16	$20.02			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-318-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	44	$19.95			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	121-13-652-41-001000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	49	$20.22		121	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-308-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	39	$20.33			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-308-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	35	$20.05			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	34-81150-610C CONN IC DIP SOCKET 34POS GOLD Aries Electronics	17	$20.50		8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	34-81250-610C CONN IC DIP SOCKET 34POS GOLD Aries Electronics	48	$20.32		8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	115-43-320-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$20.20			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-43-420-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	8	$20.14			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-