Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	115-93-320-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	35	$20.18			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-420-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4	$20.18			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	64-9518-10TE CONN IC DIP SOCKET 64POS GOLD Aries Electronics	29	$20.36		518	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	20-810-90 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	28	$20.05		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	110-44-642-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2	$20.51			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-99-642-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	17	$20.17			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	517-83-365-17-091111 CONN SOCKET PGA 365POS GOLD Preci-Dip	5	$21.05		517	Bulk	Active	PGA	365 (17 x 17)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	517-83-365-14-000111 CONN SOCKET PGA 365POS GOLD Preci-Dip	25	$21.09		517	Bulk	Active	PGA	365 (14 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	33-0501-21 CONN SOCKET SIP 33POS GOLD Aries Electronics	2	$20.05		501	Bulk	Active	SIP	33 (1 x 33)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	33-0501-31 CONN SOCKET SIP 33POS GOLD Aries Electronics	34	$20.40		501	Bulk	Active	SIP	33 (1 x 33)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	28-0508-21 CONN SOCKET SIP 28POS GOLD Aries Electronics	32	$20.41		508	Bulk	Active	SIP	28 (1 x 28)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	28-0508-31 CONN SOCKET SIP 28POS GOLD Aries Electronics	6	$20.49		508	Bulk	Active	SIP	28 (1 x 28)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	122-11-652-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	49	$20.10		122	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-114-13-062001 PGA SOCK 114PIN 13X13 SOLDER TL Mill-Max Manufacturing Corp.	44	$20.40		510	Tube	Active	PGA	114 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	28-1508-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	49	$20.43		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	28-1508-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	29	$20.07		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	614-93-964-31-018000 SOCKET CARRIER LOWPRO .900 64POS Mill-Max Manufacturing Corp.	5	$20.53		614	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-43-964-31-018000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	20	$20.06		614	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-318-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$20.57			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-318-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	7	$20.37			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-