Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	160-PGM15050-10 CONN SOCKET PGA GOLD Aries Electronics	9	$20.45		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	160-PGM15056-10 CONN SOCKET PGA GOLD Aries Electronics	46	$20.09		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	712-93-264-41-001000 SOCKET CARRIER DUAL INLINE 64POS Mill-Max Manufacturing Corp.	13	$20.64		712	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	127-41-764-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	50	$20.56		127	Tube	Active	DIP, 0.75" (19.05mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	127-91-764-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	45	$20.28		127	Tube	Active	DIP, 0.75" (19.05mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-41-432-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	49	$20.19			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-432-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	26	$20.22			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-632-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	45	$20.34			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-314-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	17	$20.03			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-314-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$20.27			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	64-9518-11H CONN IC DIP SOCKET 64POS GOLD Aries Electronics	46	$20.12		518	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	116-41-964-41-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	16	$20.66		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-91-964-41-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$20.42		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-210-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	14	$20.33			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-210-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	23	$20.27			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	123-13-642-41-001000 CONN IC DIP SOCKET 42POS GOLD Mill-Max Manufacturing Corp.	2	$20.53		123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-43-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$20.55			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	38	$20.67			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	40-6508-302 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	48	$20.30		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	517-83-369-18-091111 CONN SOCKET PGA 369POS GOLD Preci-Dip	29	$20.98		517	Bulk	Active	PGA	369 (18 x 18)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C