Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available
UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
110-87-308-41-001101
110-87-308-41-001101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
1,263 $0.48
110 Box ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
4808-3004-CP
4808-3004-CP
CONN IC DIP SOCKET 8POS TIN
3M
372 $0.62
4800 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin35.4µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35.0µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
SA163000
SA163000
CONN IC DIP SOCKET 16POS GOLD
On Shore Technology Inc.
1,166 $0.73
SA Tube ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassThermoplastic, Polyester, Glass Filled-40°C ~ 105°C
110-93-308-41-001000
110-93-308-41-001000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
515 $0.93
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-44-308-01-670800
214-44-308-01-670800
CONN IC DIP SOCKET 8POS TIN
Mill-Max Manufacturing Corp.
395 $1.03
214 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-44-318-41-001000
110-44-318-41-001000
CONN IC DIP SOCKET 18POS TIN
Mill-Max Manufacturing Corp.
399 $1.14
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
08-0518-10
08-0518-10
CONN SOCKET SIP 8POS GOLD
Aries Electronics
769 $1.25
518 Bulk ActiveSIP8 (1 x 8)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
110-44-424-41-001000
110-44-424-41-001000
CONN IC DIP SOCKET 24POS TIN
Mill-Max Manufacturing Corp.
183 $1.42
110 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-13-308-41-001000
110-13-308-41-001000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
141 $1.42
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-43-314-41-001000
110-43-314-41-001000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
319 $1.43
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-314-41-001000
110-93-314-41-001000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
663 $1.45
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-44-314-01-670800
214-44-314-01-670800
CONN IC DIP SOCKET 14POS TIN
Mill-Max Manufacturing Corp.
58 $1.59
214 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
08-3518-00
08-3518-00
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
58 $1.61
518 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
110-43-316-41-001000
110-43-316-41-001000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
563 $1.64
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-316-41-001000
110-93-316-41-001000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
525 $1.64
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
8444-21B1-RK-TR
8444-21B1-RK-TR
CONN SOCKET PLCC 44POS TIN
3M
49 $2.53
8400 Tape & Reel (TR) ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
110-43-210-10-002000
110-43-210-10-002000
CONN IC DIP SOCKET 10POS GOLD
Mill-Max Manufacturing Corp.
269 $1.85
110 Tube ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5), 8 Loaded0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
D01-9972042
D01-9972042
CONN SOCKET SIP 20POS GOLD
Harwin Inc.
257 $1.79
D01-997 Tube ActiveSIP20 (1 x 20)0.100" (2.54mm)GoldFlashBeryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin196.9µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
940-44-032-17-400000
940-44-032-17-400000
CONN SOCKET PLCC 32POS TIN
Mill-Max Manufacturing Corp.
187 $1.91
940 Tube ActivePLCC32 (2 x 7, 2 x 9)0.050" (1.27mm)Tin150.0µin (3.81µm)Beryllium CopperSurface MountClosed FrameSolder0.050" (1.27mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-43-320-41-001000
110-43-320-41-001000
CONN IC DIP SOCKET 20POS GOLD
Mill-Max Manufacturing Corp.
356 $1.99
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C

About Sockets for ICs, Transistors

What are Sockets for ICs, Transistors?

Sockets for ICs, Transistors

Sockets for Integrated Circuits (ICs) and transistors are essential components in electronic systems, serving as interfaces that allow these semiconductor devices to be easily inserted and removed from a circuit. They provide a reliable electrical connection between the IC or transistor and the printed circuit board (PCB) without the need for soldering, which facilitates testing, prototyping, and replacement. The basic operating principle involves a series of conductive contacts within the socket that align with the pins or leads of the IC or transistor, ensuring a secure and stable connection. This design not only enhances the longevity of the semiconductor devices by minimizing thermal and mechanical stress but also simplifies maintenance and upgrades.

Types of Sockets for ICs, Transistors

1. Dual In-line Package (DIP) Sockets

DIP sockets are designed for ICs with two parallel rows of pins. They are commonly used in prototyping and testing environments due to their ease of use. These sockets can accommodate a wide range of pin counts and are available in various materials and configurations, including open-frame and closed-frame designs.

2. Zero Insertion Force (ZIF) Sockets

ZIF sockets are engineered to minimize the force required to insert and remove ICs, reducing the risk of damage to the pins. They feature a lever mechanism that opens and closes the contacts, allowing for easy insertion and removal of the IC. ZIF sockets are ideal for applications where frequent IC changes are necessary.

3. Pin Grid Array (PGA) Sockets

PGA sockets are used for ICs with a grid of pins on the bottom surface. These sockets are often found in microprocessor applications and are designed to provide a robust connection with high pin counts. PGA sockets typically feature a locking mechanism to secure the IC in place.

4. Transistor Sockets

Transistor sockets are specifically designed for discrete transistors, allowing for easy replacement and testing. They come in various configurations to accommodate different transistor packages, such as TO-92 and TO-220. These sockets ensure a reliable connection while facilitating thermal management and mechanical stability.

How to choose Sockets for ICs, Transistors?

When selecting sockets for ICs and transistors, several key parameters should be considered:

  • Compatibility: Ensure the socket is compatible with the pin configuration and package type of the IC or transistor.
  • Material: Consider the materials used in the socket construction, such as plastic or ceramic, which can affect thermal and electrical performance.
  • Contact Quality: Evaluate the quality of the contacts, as they are critical for ensuring a reliable connection. Look for gold-plated contacts for enhanced conductivity and corrosion resistance.
  • Insertion Force: Choose a socket with an appropriate insertion force, especially if frequent IC changes are anticipated.
  • Environmental Factors: Consider the operating environment, including temperature and humidity, which may impact the socket's performance and longevity.

To evaluate product quality and reliability, review supplier certifications, customer reviews, and test reports. Additionally, consider the installation requirements, such as PCB layout and mounting options, to ensure compatibility with your design.

Applications of Sockets for ICs, Transistors

1. Consumer Electronics

In consumer electronics, sockets for ICs and transistors are used in devices like televisions, computers, and smartphones. They facilitate easy upgrades and repairs, allowing manufacturers to replace faulty components without soldering.

2. Automotive Industry

The automotive industry utilizes these sockets in electronic control units (ECUs) and infotainment systems. They enable quick testing and replacement of components, ensuring vehicle reliability and performance.

3. Telecommunications

In telecommunications, sockets are employed in network equipment and base stations. They allow for rapid prototyping and testing of new technologies, as well as easy maintenance and upgrades of existing systems.

4. Industrial Automation

Industrial automation systems rely on sockets for ICs and transistors in programmable logic controllers (PLCs) and motor drives. These sockets support efficient troubleshooting and component replacement, minimizing downtime.

5. Aerospace and Defense

In aerospace and defense applications, sockets are used in avionics and radar systems. They provide a reliable connection in harsh environments, allowing for quick component swaps during maintenance and upgrades.