Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	36-0501-30 CONN SOCKET SIP 36POS TIN Aries Electronics	39	$20.01		501	Bulk	Active	SIP	36 (1 x 36)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	156-PGM16012-10 CONN SOCKET PGA GOLD Aries Electronics	27	$19.80		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-6556-21 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	5	$19.94		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	24-6556-31 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	30	$20.29		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	22-3503-21 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	23	$20.14		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	22-3503-31 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	47	$19.89		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	40-526-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	45	$20.32		Lo-PRO®file, 526	Bulk	Active	DIP, ZIF (ZIP)	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	612-43-648-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	32	$20.38		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-93-648-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	37	$19.85		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-41-652-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2	$19.91		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-91-652-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	31	$20.10		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-93-964-31-012000 SOCKET CARRIER LOWPRO .900 64POS Mill-Max Manufacturing Corp.	25	$20.14		614	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-43-964-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	39	$20.40		614	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-44-636-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	20	$19.98			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-99-636-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$20.04			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	26-6621-30 CONN IC DIP SOCKET 26POS TIN Aries Electronics	16	$20.13		6621	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	26 (2 x 13)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Bottom Entry; Through Board	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	116-93-952-41-008000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	50	$19.85		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-952-41-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	10	$20.43		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	40-516-11S CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	15	$19.98		516	Bulk	Active	DIP, ZIF (ZIP)	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	126-93-642-41-003000 CONN IC DIP SOCKET 42POS GOLD Mill-Max Manufacturing Corp.	40	$20.39		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C