Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	25-0503-21 CONN SOCKET SIP 25POS GOLD Aries Electronics	34	$20.13		0503	Bulk	Active	SIP	25 (1 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
	25-0503-31 CONN SOCKET SIP 25POS GOLD Aries Electronics	24	$19.84		0503	Bulk	Active	SIP	25 (1 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
	18-3508-211 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	34	$20.13		508	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	18-3508-311 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	27	$19.83		508	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	111-93-314-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	46	$19.96			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	23-0511-11 CONN SOCKET SIP 23POS GOLD Aries Electronics	19	$20.27		511	Bulk	Active	SIP	23 (1 x 23)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	40-6556-30 40 POS TEST SOCK RECEPT SOLDER Aries Electronics	27	$19.84		6556	-	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	40-6556-20 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	37	$20.00		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	110-43-420-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$20.12			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-420-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	10	$19.72			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	612-43-652-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2	$20.23		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-93-652-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	27	$19.87		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	714-93-264-41-001000 SOCKET CARRIER DUAL INLINE 64POS Mill-Max Manufacturing Corp.	48	$20.02		714	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	322-93-164-41-001000 SOCKET 2 LEVEL WRAPOST SIP 64POS Mill-Max Manufacturing Corp.	5	$20.22		322	Tube	Active	SIP	64 (1 x 64)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-41-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$19.81			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-328-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	11	$19.79			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	41	$20.16			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-44-420-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	35	$20.20			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	614-41-964-31-002000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	27	$19.92		614	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-91-964-31-002000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	35	$20.08		614	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C