Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	122-11-650-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	44	$19.70		122	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	42-6556-11 CONN IC DIP SOCKET 42POS GOLD Aries Electronics	5	$19.62		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-0501-21 CONN SOCKET SIP 32POS GOLD Aries Electronics	25	$19.86		501	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	32-0501-31 CONN SOCKET SIP 32POS GOLD Aries Electronics	17	$19.73		501	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	36-6823-90T CONN IC DIP SOCKET 36POS TIN Aries Electronics	30	$20.00		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	APA-422-G-B ADAPTER PLUG Samtec Inc.	4	$19.61		APA	Bulk	Active	-	22 (2 x 11)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	299-93-626-10-002000 CONN IC DIP SOCKET 26POS GOLD Mill-Max Manufacturing Corp.	36	$19.96		299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	26 (2 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-44-432-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	42	$19.95			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-99-432-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$19.60			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-210-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	49	$19.71			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-210-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$19.95			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	510-91-022-05-001001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	16	$19.86		510	Bulk	Active	PGA	22 (5 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-022-05-001002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	9	$19.71		510	Bulk	Active	PGA	22 (5 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-022-05-001003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	10	$20.00		510	Bulk	Active	PGA	22 (5 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	311-13-164-41-001000 SOCKET LONG SOLDERTAIL SIP 64POS Mill-Max Manufacturing Corp.	46	$19.67		311	Tube	Active	SIP	64 (1 x 64)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-308-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	35	$19.67			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-308-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	46	$19.73			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	127-43-656-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	41	$20.16		127	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	56 (2 x 28)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	127-93-656-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$19.79		127	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	56 (2 x 28)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	20-9503-21 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	30	$19.99		503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C