Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	24-1508-21 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	11	$19.65		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	24-1508-31 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	43	$19.54		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	116-43-306-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	10	$19.75			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-306-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	37	$19.93			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	126-93-652-41-001000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	48	$19.58		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-652-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	20	$19.93		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-314-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	40	$19.98			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	121-13-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	11	$19.92		121	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	38-6820-90C CONN IC DIP SOCKET 38POS GOLD Aries Electronics	30	$20.09		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	38-6822-90C CONN IC DIP SOCKET 38POS GOLD Aries Electronics	8	$19.64		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	38-6823-90C CONN IC DIP SOCKET 38POS GOLD Aries Electronics	25	$19.88		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	116-93-950-41-008000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	44	$19.98		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-950-41-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2	$19.83		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	APA-628-G-P ADAPTER PLUG Samtec Inc.	32	$19.82		APA	Tube	Active	-	28 (2 x 14)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	115-44-324-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	19	$19.89			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-44-624-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	5	$19.90			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	127-41-664-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	23	$20.09		127	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	127-91-664-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	21	$19.73		127	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-93-950-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	25	$19.74		126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-950-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	36	$20.04		126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C