Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	110-41-324-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	29	$19.67			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-41-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	8	$19.45			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-41-624-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	31	$19.55			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-324-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	8	$19.68			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	48	$19.51			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-624-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	38	$19.96			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	612-41-652-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	27	$19.83		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-91-652-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	5	$19.72		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-308-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	44	$19.54			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-308-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	25	$19.55			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	605-41-964-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp.	10	$19.49		605	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	605-91-964-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp.	3	$19.97		605	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-43-950-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	48	$19.57		612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-93-950-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	18	$19.92		612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-93-652-41-001000 SOCKET CARRIER SLDRTL .600 52POS Mill-Max Manufacturing Corp.	8	$20.04		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-43-652-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	22	$19.72		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	22-4503-21 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	29	$19.85		503	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	22-4503-31 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	44	$19.64		503	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	24-0508-21 CONN SOCKET SIP 24POS GOLD Aries Electronics	19	$19.95		508	Bulk	Active	SIP	24 (1 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	24-0508-31 CONN SOCKET SIP 24POS GOLD Aries Electronics	5	$19.93		508	Bulk	Active	SIP	24 (1 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C