Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available
UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
299-93-308-10-001000
299-93-308-10-001000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
151 $5.27
299 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
111-93-640-41-001000
111-93-640-41-001000
CONN IC DIP SOCKET 40POS GOLD
Mill-Max Manufacturing Corp.
92 $5.31
111 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-13-314-41-001000
123-13-314-41-001000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
20 $5.19
123 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-43-316-41-801000
110-43-316-41-801000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
89 $5.26
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
08-2503-30
08-2503-30
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
8 $5.44
503 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
614-93-324-31-012000
614-93-324-31-012000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
81 $5.35
614 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
117-93-428-41-005000
117-93-428-41-005000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
177 $5.45
117 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.070" (1.78mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
XR2C-2005
XR2C-2005
CONN SOCKET SIP 20POS GOLD
Omron Electronics Inc-EMC Div
88 $5.46
XR2 Bulk ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
117-93-430-41-005000
117-93-430-41-005000
CONN IC DIP SOCKET 30POS GOLD
Mill-Max Manufacturing Corp.
65 $5.63
117 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing30 (2 x 15)0.070" (1.78mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-43-320-41-801000
110-43-320-41-801000
CONN IC DIP SOCKET 20POS GOLD
Mill-Max Manufacturing Corp.
124 $5.64
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
ICA-628-SST
ICA-628-SST
CONN IC DIP SOCKET 28POS GOLD
Samtec Inc.
35 $5.84
ICA Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperPolyester-55°C ~ 125°C
299-93-314-11-001000
299-93-314-11-001000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
59 $5.78
299 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
299-43-314-11-001000
299-43-314-11-001000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
124 $5.83
299 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-628-31-012000
614-93-628-31-012000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
135 $6.04
614 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
ICO-628-NTT
ICO-628-NTT
100" LOW PROFILE SCREW MACHINE D
Samtec Inc.
153 $6.05
ICO Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 105°C
123-93-314-41-801000
123-93-314-41-801000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
87 $6.21
123 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-43-324-41-801000
110-43-324-41-801000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
99 $6.22
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-324-41-801000
110-93-324-41-801000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
147 $6.16
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
299-43-316-11-001000
299-43-316-11-001000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
145 $6.43
299 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-624-41-801000
110-93-624-41-801000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
66 $6.58
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C