0
My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
540-44-020-17-400000
540-44-020-17-400000
CONN SOCKET PLCC 20POS TIN
Mill-Max Manufacturing Corp.
 15 $3.74
540 Tube ActivePLCC20 (4 x 5)0.050" (1.27mm)Tin150.0µin (3.81µm)Copper AlloySurface MountClosed FrameSolder0.100" (2.54mm)Tin150.0µin (3.81µm)Copper AlloyPolyphenylene Sulfide (PPS)-55°C ~ 125°C
123-43-314-41-001000
123-43-314-41-001000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
 56 $3.74
123 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
14-8400-10
14-8400-10
CONN IC DIP SOCKET 14POS TIN
Aries Electronics
 119 $3.86
8 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough HoleClosed Frame, ElevatedSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
614-43-316-31-012000
614-43-316-31-012000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
 200 $3.88
614 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-93-632-41-001000
115-93-632-41-001000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 176 $3.90
115 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-44-640-01-670800
214-44-640-01-670800
CONN IC DIP SOCKET 40POS TIN
Mill-Max Manufacturing Corp.
 5 $3.88
214 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-640-01-670800
214-99-640-01-670800
CONN IC DIP SOCKET 40POS TINLEAD
Mill-Max Manufacturing Corp.
 22 $3.91
214 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Lead100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-43-316-41-001000
123-43-316-41-001000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
 113 $4.05
123 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
111-93-632-41-001000
111-93-632-41-001000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 3 $4.20
111 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
117-47-642-41-005000
117-47-642-41-005000
CONN IC DIP SOCKET 42POS GOLD
Mill-Max Manufacturing Corp.
 4 $4.32
117 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing42 (2 x 21)0.070" (1.78mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
299-43-310-11-001000
299-43-310-11-001000
CONN IC DIP SOCKET 10POS GOLD
Mill-Max Manufacturing Corp.
 25 $4.34
299 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-318-31-012000
614-93-318-31-012000
CONN IC DIP SOCKET 18POS GOLD
Mill-Max Manufacturing Corp.
 196 $4.30
614 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
18-6513-10
18-6513-10
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
 53 $4.24
Lo-PRO®file, 513 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
110-13-632-41-001000
110-13-632-41-001000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 132 $4.53
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-648-41-001000
110-93-648-41-001000
CONN IC DIP SOCKET 48POS GOLD
Mill-Max Manufacturing Corp.
 65 $4.53
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
299-93-308-11-001000
299-93-308-11-001000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
 39 $4.48
299 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-43-640-41-003000
115-43-640-41-003000
CONN IC DIP SOCKET 40POS GOLD
Mill-Max Manufacturing Corp.
 139 $4.65
115 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-43-314-41-801000
110-43-314-41-801000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
 156 $4.84
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
16-C280-10
16-C280-10
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
 146 $5.25
EJECT-A-DIP™ Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
12-0511-10
12-0511-10
CONN SOCKET SIP 12POS TIN
Aries Electronics
 98 $5.13
511 Bulk ActiveSIP12 (1 x 12)0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C