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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
299-87-310-10-001101
299-87-310-10-001101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
 144 $2.86
299 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)GoldFlashBeryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
115-93-324-41-003000
115-93-324-41-003000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
 223 $2.80
115 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-43-624-41-001000
115-43-624-41-001000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
 89 $2.92
115 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-44-628-01-670800
214-44-628-01-670800
CONN IC DIP SOCKET 28POS TIN
Mill-Max Manufacturing Corp.
 80 $2.99
214 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
382
382
CONN IC DIP SOCKET 28POS
Adafruit Industries LLC
 48 $2.98
Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)-------------
D2928-42
D2928-42
CONN IC DIP SOCKET 28POS GOLD
Harwin Inc.
 180 $3.09
D2 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin196.9µin (5.00µm)BrassPlastic-55°C ~ 125°C
210-93-632-41-001000
210-93-632-41-001000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 93 $3.10
210 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
210-43-632-41-001000
210-43-632-41-001000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 139 $3.04
210 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-43-328-41-003000
115-43-328-41-003000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 181 $3.20
115 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
22-4518-10
22-4518-10
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
 76 $3.26
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
115-93-628-41-003000
115-93-628-41-003000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 125 $3.26
115 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
32-6518-10
32-6518-10
CONN IC DIP SOCKET 32POS GOLD
Aries Electronics
 179 $3.34
518 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
299-87-312-11-001101
299-87-312-11-001101
CONN IC DIP SOCKET 12POS GOLD
Preci-Dip
 184 $3.46
299 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing12 (2 x 6)0.100" (2.54mm)GoldFlashBeryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
115-43-328-41-001000
115-43-328-41-001000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 230 $3.31
115 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
ICF-628-T-O-TR
ICF-628-T-O-TR
CONN IC DIP SOCKET 28POS TIN
Samtec Inc.
 203 $4.82
iCF Tape & Reel (TR) ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperLiquid Crystal Polymer (LCP)-55°C ~ 125°C
XR2A-0802
XR2A-0802
CONN IC DIP SOCKET 8POS GOLD
Omron Electronics Inc-EMC Div
 235 $3.50
XR2 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
111-43-628-41-001000
111-43-628-41-001000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 15 $3.72
111 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
24-4518-10
24-4518-10
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
 113 $3.72
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
115-93-632-41-003000
115-93-632-41-003000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 141 $3.76
115 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-43-632-41-003000
115-43-632-41-003000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 54 $3.76
115 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C