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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
28-526-10
28-526-10
CONN IC DIP SOCKET ZIF 28POS TIN
Aries Electronics
 20 $12.60
Lo-PRO®file, 526 Bulk ActiveDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
12-810-90C
12-810-90C
CONN IC DIP SOCKET 12POS GOLD
Aries Electronics
 52 $12.68
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing12 (2 x 6)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-6554-10
24-6554-10
CONN IC DIP SOCKET ZIF 24POS TIN
Aries Electronics
 35 $13.06
55 Tube ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
TDU03DTOD
TDU03DTOD
CONN SOCKET TRANSIST 3POS GOLD
Sullins Connector Solutions
 40 $13.73
Tray ActiveTransistor3 (Rectangular)-Gold30.0µin (0.76µm)Beryllium CopperThrough HoleBoard Guide, FlangeSolder-Gold30.0µin (0.76µm)Beryllium CopperPolyphenylene Sulfide (PPS)-55°C ~ 175°C
714-43-164-31-018000
714-43-164-31-018000
CONN SOCKET SIP 64POS GOLD
Mill-Max Manufacturing Corp.
 11 $13.87
714 Tube ActiveSIP64 (1 x 64)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrierSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
25-0503-30
25-0503-30
CONN SOCKET SIP 25POS GOLD
Aries Electronics
 47 $14.30
0503 Bulk ActiveSIP25 (1 x 25)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA), Nylon, Glass Filled-
40-526-10
40-526-10
CONN IC DIP SOCKET ZIF 40POS TIN
Aries Electronics
 24 $14.88
Lo-PRO®file, 526 Bulk ActiveDIP, ZIF (ZIP)40 (2 x 20)0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
28-6554-10
28-6554-10
CONN IC DIP SOCKET ZIF 28POS TIN
Aries Electronics
 38 $14.89
55 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
TCC05DCSN-S1403
TCC05DCSN-S1403
CONN TRANSIST TO-220/TO-247 5POS
Sullins Connector Solutions
 36 $15.14
Tray ActiveTransistor, TO-220 and TO-2475 (Rectangular)-Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Solder-Gold30.0µin (0.76µm)Beryllium CopperPolyphenylene Sulfide (PPS)-65°C ~ 175°C
32-6554-10
32-6554-10
CONN IC DIP SOCKET ZIF 32POS TIN
Aries Electronics
 10 $15.84
55 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
MPP-1100-05-DS-4GR(S1402)
MPP-1100-05-DS-4GR(S1402)
CONN TRANSIST TO-220/TO-247 5POS
Sullins Connector Solutions
 47 $17.25
Tray ActiveTransistor, TO-220 and TO-2475 (Rectangular)-Gold30.0µin (0.76µm)Nickel BoronThrough Hole, Right Angle-Solder-Gold30.0µin (0.76µm)Nickel BoronPolyphenylene Sulfide (PPS)-65°C ~ 200°C
40-6554-10
40-6554-10
CONN IC DIP SOCKET ZIF 40POS TIN
Aries Electronics
 42 $18.96
55 Tube ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
24-6554-11
24-6554-11
CONN IC DIP SOCKET ZIF 24POS GLD
Aries Electronics
 35 $18.85
55 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
48-6554-10
48-6554-10
CONN IC DIP SOCKET ZIF 48POS TIN
Aries Electronics
 20 $19.83
55 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
28-6554-11
28-6554-11
CONN IC DIP SOCKET ZIF 28POS GLD
Aries Electronics
 6 $21.06
55 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
32-6554-11
32-6554-11
CONN IC DIP SOCKET ZIF 32POS GLD
Aries Electronics
 23 $23.11
55 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
222-3343-00-0602J
222-3343-00-0602J
CONN IC DIP SOCKET ZIF 22POS GLD
3M
 32 $25.15
Textool™ Tube ActiveDIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
0804MC
0804MC
CONN TRANSIST TO-3 8POS GOLD
Texas Instruments
 11 $28.60
Tray ActiveTransistor, TO-38 (Oval)-Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder-Tin200.0µin (5.08µm)BrassPolyester, Glass Filled-55°C ~ 150°C
1-2324271-2
1-2324271-2
LEFT SEGMEN LGA4189-4 SOCKET-P4
TE Connectivity AMP Connectors
 14 $28.48
Tray ActiveLGA 418920920.039" (1.00mm)Gold30.0µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.034" (0.86mm)Gold30.0µin (0.76µm)Copper AlloyThermoplastic-25°C ~ 100°C
210-2599-00-0602
210-2599-00-0602
CONN SOCKET SIP ZIF 10POS GOLD
3M
 15 $44.96
Textool™ Bulk ActiveSIP, ZIF (ZIP)10 (1 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C