Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available
UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
14-823-90
14-823-90
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
84 $10.58
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
10-810-90C
10-810-90C
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
7 $11.15
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
14-810-90C
14-810-90C
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
17 $11.14
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
299-43-628-10-002000
299-43-628-10-002000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
76 $12.17
299 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
20-823-90
20-823-90
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
57 $12.47
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
16-2820-90C
16-2820-90C
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
22 $12.60
Vertisockets™ 800 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
18-6810-90T
18-6810-90T
CONN IC DIP SOCKET 18POS TIN
Aries Electronics
48 $13.84
Vertisockets™ 800 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
8080-1G1
8080-1G1
CONN TRANSIST TO-3 4POS GOLD
TE Connectivity AMP Connectors
10 $15.03
8080 Bulk ActiveTransistor, TO-34 (Round)-Tin-Lead-Beryllium CopperThrough HoleClosed FrameSolder-Tin-Lead-Beryllium CopperFluoropolymer (FP)-55°C ~ 125°C
110-43-308-41-105000
110-43-308-41-105000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
34 $15.29
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
8080-1G15
8080-1G15
CONN TRANSIST TO-3 3POS TIN-LEAD
TE Connectivity AMP Connectors
27 $16.19
8080 Bulk ActiveTransistor, TO-33 (Oval)-Tin-Lead200.0µin (5.08µm)Beryllium CopperChassis MountClosed FrameSolder-Tin-Lead200.0µin (5.08µm)Beryllium CopperFluoropolymer (FP)-55°C ~ 125°C
8080-1G24
8080-1G24
CONN SOCKET TRANSIST TO-3 3POS
TE Connectivity AMP Connectors
19 $16.08
Bulk ActiveTransistor, TO-33 (Round)-Tin-Lead20.0µin (0.51µm)Beryllium CopperChassis MountClosed FrameSolder-Tin-Lead20.0µin (0.51µm)Beryllium CopperDiallyl Phthalate (DAP)-55°C ~ 125°C
APA-628-G-N
APA-628-G-N
ADAPTER PLUG
Samtec Inc.
42 $18.88
APA Tube Active-28 (2 x 14)0.100" (2.54mm)Gold20.0µin (0.51µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold20.0µin (0.51µm)Phosphor BronzePolybutylene Terephthalate (PBT), Glass Filled-
2201838-1
2201838-1
CONN SOCKET LGA 2011POS GOLD
TE Connectivity AMP Connectors
9 $25.13
Bulk Last Time BuyLGA2011 (47 x 58)0.040" (1.02mm)Gold15.0µin (0.38µm)Copper AlloySurface MountOpen FrameSolder0.035" (0.90mm)Gold15.0µin (0.38µm)Copper AlloyThermoplastic-
2-2822979-3
2-2822979-3
CONN SOCKET LGA 3647POS GOLD
TE Connectivity AMP Connectors
10 $64.50
Tray ActiveLGA36470.039" (1.00mm)Gold30.0µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.034" (0.86mm)Gold30.0µin (0.76µm)Copper AlloyThermoplastic-
D2818-42
D2818-42
CONN IC DIP SOCKET 18POS GOLD
Harwin Inc.
171 $2.11
D2 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin196.9µin (5.00µm)BrassPlastic-55°C ~ 125°C
117-87-432-41-005101
117-87-432-41-005101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
93 $2.31
117 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing32 (2 x 16)0.070" (1.78mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
115-93-318-41-003000
115-93-318-41-003000
CONN IC DIP SOCKET 18POS GOLD
Mill-Max Manufacturing Corp.
325 $2.36
115 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-43-422-41-003000
115-43-422-41-003000
CONN IC DIP SOCKET 22POS GOLD
Mill-Max Manufacturing Corp.
277 $3.05
115 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
111-43-324-41-001000
111-43-324-41-001000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
123 $3.15
111 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-632-01-670800
214-99-632-01-670800
CONN IC DIP SOCKET 32POS TINLEAD
Mill-Max Manufacturing Corp.
206 $3.31
214 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin-Lead100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C