TMS320C6670AXCYP
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Texas Instruments TMS320C6670AXCYP

Manufacturer No:
TMS320C6670AXCYP
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC DSP FIX/FLOAT POINT 841FCBGA
Delivery:
Payment:
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Product Introduction

Overview

The TMS320C6670AXCYP is a high-performance digital signal processor (DSP) designed by Texas Instruments. It is part of the C66xx SoC family, based on TI's KeyStone Multicore SoC Architecture. This DSP is tailored for demanding real-time applications, including telecommunications, medical imaging, industrial automation, and aerospace and defense sectors.

The TMS320C6670AXCYP integrates four TMS320C66x DSP Core Subsystems, each operating at frequencies up to 1.2 GHz, enabling a combined processing power of up to 4.8 GHz. This architecture supports a wide range of high-performance applications, such as software-defined radio, emerging broadband, and other communications segments.

Key Specifications

Specification Details
Processor Cores Four TMS320C66x DSP Core Subsystems
Operating Frequency 1.0 GHz to 1.2 GHz
Performance 153.6 GMAC/76.8 GFLOP @ 1.2GHz
Cache Memory 32KB L1P, 32KB L1D, 1024KB L2 Per Core; 2MB Shared L2
Memory Interface 64-Bit DDR3 Interface (DDR3-1600) - 8 GByte Addressable Memory Space
Operating Temperature Range -40°C to 100°C
Package Type FCBGA (CYP) with 841 pins
Interfaces Four Lanes of SRIO 2.1, Two Lanes PCIe Gen2, HyperLink, Ethernet MAC Subsystem, Six Lane SerDes-Based Antenna Interface (AIF2)
Hardware Coprocessors Enhanced Coprocessors for Turbo Encoding/Decoding, Viterbi Decoders, Fast Fourier Transform Coprocessors, Bit Rate CoProcessor, Receiver and Transmitter Accelerators for WCDMA

Key Features

  • High-Performance Processing: Four TMS320C66x DSP Core Subsystems operating at up to 1.2 GHz, providing up to 4.8 GHz combined processing power.
  • Advanced Memory and Cache: 32KB L1P, 32KB L1D, 1024KB L2 per core, and 2MB shared L2 memory.
  • High-Speed Interfaces: Includes SRIO 2.1, PCIe Gen2, HyperLink, Ethernet MAC Subsystem, and SerDes-Based Antenna Interface (AIF2).
  • Hardware Acceleration: Packet Accelerator, Security Accelerator, Turbo Encoding/Decoding Coprocessors, Viterbi Decoders, Fast Fourier Transform Coprocessors, and more.
  • Power Efficiency: Designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications.
  • Environmental Robustness: Operates within a temperature range of -40°C to 100°C and is designed to withstand humidity and vibration.

Applications

  • Telecommunications: Ideal for software-defined radio, emerging broadband, and other communications segments.
  • Medical Imaging: Used in medical imaging applications requiring high-speed signal processing.
  • Industrial Automation: Suitable for industrial automation tasks that demand real-time processing.
  • Aerospace and Defense: Utilized in radar systems, satellite communication, and electronic warfare platforms.
  • Automotive and Industrial: Can be used in applications subjected to mechanical vibrations, such as automotive or industrial settings.

Q & A

  1. What is the TMS320C6670AXCYP?

    The TMS320C6670AXCYP is a high-performance digital signal processor (DSP) from Texas Instruments, part of the C66xx SoC family.

  2. What are the key applications of the TMS320C6670AXCYP?

    Key applications include telecommunications, medical imaging, industrial automation, and aerospace and defense sectors.

  3. What is the operating frequency of the TMS320C6670AXCYP?

    The processor cores operate at frequencies up to 1.2 GHz.

  4. What kind of memory does the TMS320C6670AXCYP have?

    It features 32KB L1P, 32KB L1D, 1024KB L2 per core, and 2MB shared L2 memory.

  5. What are the environmental considerations for the TMS320C6670AXCYP?

    The device must be protected from high temperatures, humidity, and vibration through appropriate thermal management, enclosures, and shock-absorbing mounts.

  6. What interfaces does the TMS320C6670AXCYP support?

    It supports SRIO 2.1, PCIe Gen2, HyperLink, Ethernet MAC Subsystem, and SerDes-Based Antenna Interface (AIF2).

  7. Does the TMS320C6670AXCYP have hardware acceleration?

    Yes, it includes various hardware coprocessors such as Packet Accelerator, Security Accelerator, Turbo Encoding/Decoding Coprocessors, and more.

  8. Is the TMS320C6670AXCYP power-efficient?

    Yes, it is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications.

  9. What is the operating temperature range of the TMS320C6670AXCYP?

    The operating temperature range is from -40°C to 100°C.

  10. How many pins does the FCBGA package of the TMS320C6670AXCYP have?

    The FCBGA package has 841 pins.

Product Attributes

Type:Fixed/Floating Point
Interface:EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
Clock Rate:1GHz
Non-Volatile Memory:ROM (128kB)
On-Chip RAM:6.25MB
Voltage - I/O:1.0V, 1.5V, 1.8V
Voltage - Core:1.00V
Operating Temperature:0°C ~ 100°C (TC)
Mounting Type:Surface Mount
Package / Case:841-BFBGA, FCBGA
Supplier Device Package:841-FCBGA (24x24)
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Similar Products

Part Number TMS320C6670AXCYP TMS320C6678AXCYP TMS320C6670AXCYP2 TMS320C6670AXCYPA TMS320C6670ACYP
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Active
Type Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point
Interface EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, I²C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
Clock Rate 1GHz 1GHz 1.2GHz 1GHz 1GHz
Non-Volatile Memory ROM (128kB) ROM (128kB) ROM (128kB) ROM (128kB) ROM (128kB)
On-Chip RAM 6.25MB 8.5MB 6.25MB 6.25MB 6.25MB
Voltage - I/O 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V
Voltage - Core 1.00V 1.00V 1.00V 1.00V 1.00V
Operating Temperature 0°C ~ 100°C (TC) 0°C ~ 85°C (TC) 0°C ~ 100°C (TC) -40°C ~ 100°C (TC) 0°C ~ 100°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA
Supplier Device Package 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24)

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