TMS320C6670AXCYP2
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Texas Instruments TMS320C6670AXCYP2

Manufacturer No:
TMS320C6670AXCYP2
Manufacturer:
Texas Instruments
Package:
Bulk
Description:
IC DSP FIX/FLOAT POINT 841FCBGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The TMS320C6670AXCYP2 is a member of the TMS320C66xx family of multicore Digital Signal Processors (DSPs) from Texas Instruments. This System on Chip (SoC) is based on TI's KeyStone Multicore SoC Architecture, designed for high-performance applications such as software-defined radio, emerging broadband, and other communications segments. The device integrates four TMS320C66x DSP Core Subsystems, each operating at frequencies up to 1.2 GHz, providing a combined processing power of up to 4.8 GHz. This architecture ensures high integration, power efficiency, and ease of use for implementing multi-band, multi-standard waveforms, including proprietary air-interfaces.

Key Specifications

Specification Details
Package 841-BFBGA, FCBGA
Pins 841
Operating Temperature Range 0°C to 100°C (TC)
Voltage - Core 1.00V
Voltage - I/O 1.0V, 1.5V, 1.8V
Clock Rate Up to 1.2 GHz
Non-Volatile Memory ROM (128 kB)
On-Chip RAM 6.25 MB
Memory Interface 64-Bit DDR3 Interface (DDR3-1600), up to 8 GByte addressable memory space
Interfaces EBI/EMI, Ethernet MAC, PCIe, I2C, SPI, SRIO, UART
Other Features Four lanes of SRIO 2.1, two lanes PCIe Gen2, HyperLink, Ethernet MAC subsystem with two SGMII ports, six lane SerDes-based antenna interface (AIF2)

Key Features

  • Four TMS320C66x DSP Core Subsystems at 1.00 GHz and 1.2 GHz, providing up to 4.8 GHz combined processing power.
  • High performance with 153.6 GMAC/76.8 GFLOP @ 1.2 GHz.
  • Memory architecture includes 32KB L1P, 32KB L1D, 1024KB L2 per core, and 2MB shared L2.
  • Multicore Navigator and TeraNet Switch Fabric for efficient data flow.
  • Network Coprocessors including Packet Accelerator and Security Accelerator.
  • Hardware coprocessors for turbo encoding, turbo decoding, Viterbi decoding, FFT, and other functions.
  • Multiple high-speed interfaces: SRIO 2.1, PCIe Gen2, HyperLink, and Ethernet MAC subsystem.
  • Six lane SerDes-based antenna interface (AIF2) operating at up to 6.144 Gbps.
  • I2C, SPI, and UART interfaces, along with 16 GPIO pins and eight 64-bit timers).

Applications

The TMS320C6670AXCYP2 is designed for various high-performance applications, including:

  • Software-defined radio and other wireless communication systems.
  • Emerging broadband and communications segments.
  • Test and measurement equipment).
  • Mission-critical systems).
  • Industrial automation and control systems).
  • Medical and high-end imaging equipment).
  • High-performance computing and data processing).

Q & A

  1. What is the TMS320C6670AXCYP2?

    The TMS320C6670AXCYP2 is a multicore Digital Signal Processor (DSP) from Texas Instruments, part of the TMS320C66xx family, designed for high-performance applications.

  2. How many DSP cores does the TMS320C6670AXCYP2 have?

    The device has four TMS320C66x DSP Core Subsystems.

  3. What are the operating frequencies of the DSP cores?

    The DSP cores operate at frequencies up to 1.2 GHz.

  4. What is the memory architecture of the TMS320C6670AXCYP2?

    The memory architecture includes 32KB L1P, 32KB L1D, 1024KB L2 per core, and 2MB shared L2.

  5. What high-speed interfaces does the TMS320C6670AXCYP2 support?

    The device supports SRIO 2.1, PCIe Gen2, HyperLink, and Ethernet MAC subsystem.

  6. What are some of the hardware coprocessors available on the TMS320C6670AXCYP2?

    The device includes hardware coprocessors for turbo encoding, turbo decoding, Viterbi decoding, FFT, and other functions.

  7. What is the operating temperature range of the TMS320C6670AXCYP2?

    The operating temperature range is from 0°C to 100°C (TC).

  8. What type of memory interface does the TMS320C6670AXCYP2 have?

    The device has a 64-Bit DDR3 Interface (DDR3-1600) with up to 8 GByte addressable memory space.

  9. What are some typical applications of the TMS320C6670AXCYP2?

    Typical applications include software-defined radio, emerging broadband, test and measurement, mission-critical systems, industrial automation, medical and high-end imaging equipment, and high-performance computing.

  10. What is the package type of the TMS320C6670AXCYP2?

    The device is packaged in a 841-BFBGA, FCBGA.

Product Attributes

Type:Fixed/Floating Point
Interface:EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
Clock Rate:1.2GHz
Non-Volatile Memory:ROM (128kB)
On-Chip RAM:6.25MB
Voltage - I/O:1.0V, 1.5V, 1.8V
Voltage - Core:1.00V
Operating Temperature:0°C ~ 100°C (TC)
Mounting Type:Surface Mount
Package / Case:841-BFBGA, FCBGA
Supplier Device Package:841-FCBGA (24x24)
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Similar Products

Part Number TMS320C6670AXCYP2 TMS320C6670AXCYPA TMS320C6670AXCYPA2 TMS320C6670ACYP2 TMS320C6670AXCYP
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Active
Type Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point
Interface EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
Clock Rate 1.2GHz 1GHz 1.2GHz 1.2GHz 1GHz
Non-Volatile Memory ROM (128kB) ROM (128kB) ROM (128kB) ROM (128kB) ROM (128kB)
On-Chip RAM 6.25MB 6.25MB 6.25MB 6.25MB 6.25MB
Voltage - I/O 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V
Voltage - Core 1.00V 1.00V 1.00V 1.00V 1.00V
Operating Temperature 0°C ~ 100°C (TC) -40°C ~ 100°C (TC) -40°C ~ 100°C (TC) 0°C ~ 100°C (TC) 0°C ~ 100°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA
Supplier Device Package 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24)

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