TMS320C6474FZUN2
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Texas Instruments TMS320C6474FZUN2

Manufacturer No:
TMS320C6474FZUN2
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC DSP FIXED POINT 561FCBGA
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Payment:
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Product Introduction

Overview

The TMS320C6474FZUN2 is a high-performance multicore digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000™ DSP platform. This device is based on the third-generation VelociTI™ very-long-instruction-word (VLIW) architecture and features three TMS320C64x+™ DSP cores. It is designed for demanding applications requiring high processing power, such as video and telecom infrastructures, medical imaging, and other high-bandwidth systems.

Key Specifications

SpecificationDetails
Number of Cores3 TMS320C64x+™ DSP Cores
Clock Rate1 GHz to 1.2 GHz
Instruction Cycle Time0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device)
L1 Memory256 K-Bit (32 K-Byte) L1P Program Cache [Direct Mapped]
L2 Memory512 KBytes L2 SRAM
Package Type561-Pin Ball Grid Array (BGA)
Operating Temperature Range-40°C to 100°C (extended temperature range)
Supply Voltage0.9-V to 1.2-V Adaptive Core Voltage
Ethernet MAC1000 Mbps Ethernet MAC (EMAC), IEEE 802.3 Compliant
Serial RapidIOTwo Serial RapidIO® (SRIO) with link rates of 1.25 Gbps, 2.5 Gbps or 3.125 Gbps
Antenna InterfaceSerDes-based antenna interface (AIF) capable of up to 3.072 Gbps operation per link

Key Features

  • High-performance multicore DSP with 3.6 GHz of total raw DSP processing power
  • Compact instructions (16-Bit) and dedicated SPLOOP instructions
  • 1000 Mbps Ethernet media access controller (EMAC) with SGMII and MDIO support
  • Six 64-bit general-purpose timers (configurable as twelve 32-bit timers)
  • Sixteen general-purpose input/output ports (GPIO) with programmable interrupt/event generation modes
  • Two multichannel buffered serial ports (McBSPs) each at 100 Mbps
  • Internal semaphore module for access control to shared resources
  • SmartReflex™ Class 0 - adaptive core voltage
  • IEEE-1149.1 and IEEE-1149.6 (JTAG™) boundary-scan-compatible

Applications

The TMS320C6474FZUN2 is suited for a variety of high-performance applications, including:

  • Video and telecom infrastructures
  • Medical and imaging systems
  • High-bandwidth data processing systems
  • Point-to-point inter-device communication in complex systems
  • Antenna data transmission and reception in wireless communication systems

Q & A

  1. What is the clock rate of the TMS320C6474FZUN2?
    The clock rate of the TMS320C6474FZUN2 is 1 GHz to 1.2 GHz.
  2. How many DSP cores does the TMS320C6474FZUN2 have?
    The TMS320C6474FZUN2 has 3 TMS320C64x+™ DSP cores.
  3. What is the operating temperature range of the TMS320C6474FZUN2?
    The operating temperature range is -40°C to 100°C (extended temperature range).
  4. What type of Ethernet MAC does the TMS320C6474FZUN2 support?
    The TMS320C6474FZUN2 supports a 1000 Mbps Ethernet MAC (EMAC), which is IEEE 802.3 compliant.
  5. What is the purpose of the Serial RapidIO (SRIO) in the TMS320C6474FZUN2?
    The Serial RapidIO (SRIO) is used for high-bandwidth point-to-point inter-device communication, supporting link rates of 1.25 Gbps, 2.5 Gbps, or 3.125 Gbps.
  6. What is the antenna interface capability of the TMS320C6474FZUN2?
    The TMS320C6474FZUN2 features a SerDes-based antenna interface (AIF) capable of up to 3.072 Gbps operation per link.
  7. How many general-purpose timers does the TMS320C6474FZUN2 have?
    The TMS320C6474FZUN2 has six 64-bit general-purpose timers, which can be configured as twelve 32-bit timers.
  8. What is the role of the internal semaphore module in the TMS320C6474FZUN2?
    The internal semaphore module allows access control to shared resources with unique interrupts to each of the cores.
  9. Is the TMS320C6474FZUN2 compatible with JTAG boundary-scan?
    Yes, the TMS320C6474FZUN2 is IEEE-1149.1 and IEEE-1149.6 (JTAG™) boundary-scan-compatible.
  10. What is the package type of the TMS320C6474FZUN2?
    The package type is a 561-Pin Ball Grid Array (BGA).

Product Attributes

Type:Fixed Point
Interface:Ethernet MAC, I²C, McBSP
Clock Rate:1.2GHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:3.168MB
Voltage - I/O:1.1V, 1.8V
Voltage - Core:1.10V
Operating Temperature:0°C ~ 95°C (TC)
Mounting Type:Surface Mount
Package / Case:561-BFBGA, FCBGA Exposed Pad
Supplier Device Package:561-FCBGA (23x23)
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Similar Products

Part Number TMS320C6474FZUN2 TMS320C6474FZUNA TMS320C6474FZUNA2 TMS320C6474FZUN8 TMS320C6474FCUN2 TMS320C6474FGUN2 TMS320C6474FZUN
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Obsolete Discontinued at Digi-Key Obsolete Active Discontinued at Digi-Key Obsolete
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP
Clock Rate 1.2GHz 1GHz 1.2GHz 850MHz 1.2GHz 1.2GHz 1GHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB
Voltage - I/O 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V
Voltage - Core 1.10V 1.10V 1.10V 1.10V 1.10V 1.10V 1.10V
Operating Temperature 0°C ~ 95°C (TC) -40°C ~ 100°C (TC) 0°C ~ 95°C (TC) 0°C ~ 100°C (TC) 0°C ~ 95°C (TC) 0°C ~ 95°C (TC) 0°C ~ 100°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 561-BFBGA, FCBGA Exposed Pad 561-BFBGA, FCBGA Exposed Pad 561-BFBGA, FCBGA Exposed Pad 561-BFBGA, FCBGA Exposed Pad 561-BFBGA, FCCSPBGA 561-BFBGA 561-BFBGA, FCBGA Exposed Pad
Supplier Device Package 561-FCBGA (23x23) 561-FCBGA (23x23) 561-FCBGA (23x23) 561-FCBGA (23x23) 561-FC/CSP (23x23) 561-FCBGA (23x23) 561-FCBGA (23x23)

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