TMS320C6474FZUN8
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Texas Instruments TMS320C6474FZUN8

Manufacturer No:
TMS320C6474FZUN8
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC DSP MULTICORE 561FCBGA
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Payment:
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Product Introduction

Overview

The TMS320C6474FZUN8 is a high-performance multicore digital signal processor (DSP) from Texas Instruments. It is part of the TMS320C6000™ DSP platform and features the advanced VelociTI™ very-long-instruction-word (VLIW) architecture. This device is designed for demanding applications requiring high processing power, such as video and telecom infrastructures, medical imaging, and other high-bandwidth systems. The C6474 device is based on 65-nm process technology and offers significant improvements in performance and power efficiency.

Key Specifications

Specification Details
Processor Cores 3 TMS320C64x+™ DSP Cores
Clock Rate 850 MHz to 1.2 GHz
Instruction Cycle Time 1.18 ns (850 MHz), 1 ns (1 GHz), 0.83 ns (1.2 GHz)
Memory 256 K-Bit (32 K-Byte) L1P Program Cache, 512 K-Byte L2 SRAM
DDR2 Memory Controller 16-/32-bit DDR2 SDRAM interface
Package Type 561-Pin Ball Grid Array (BGA)
Process Technology 65-nm
Operating Temperature -40°C to 100°C
Voltage Core: 0.9-V to 1.2-V, I/O: 1.8 V, 1.1 V
Peripherals 1000 Mbps Ethernet MAC, Serial RapidIO (SRIO), McBSP, I2C, GPIO, etc.

Key Features

  • High-Performance Multicore DSP: The C6474 features three TMS320C64x+™ DSP cores, providing a total raw DSP processing power of up to 3.6 GHz.
  • Advanced VLIW Architecture: Utilizes the VelociTI™ VLIW architecture for high instruction-level parallelism.
  • Memory and Cache: Includes 256 K-Bit L1P program cache and 512 K-Byte L2 SRAM.
  • High-Speed Interfaces: Supports 1000 Mbps Ethernet MAC, Serial RapidIO (SRIO) with link rates up to 3.125 Gbps, and a SerDes-based antenna interface (AIF) capable of up to 3.072 Gbps per link.
  • Peripheral Support: Includes McBSP, I2C, GPIO, six 64-bit general-purpose timers, and a frame synchronization module.
  • Power Management: Features SmartReflex power management for efficient power usage.

Applications

  • Video and Telecom Infrastructures: Ideal for high-bandwidth video processing and telecom applications.
  • Medical Imaging: Suitable for medical imaging systems that require high processing power and low latency.
  • Industrial Automation: Can be used in industrial automation systems that need robust signal processing capabilities.
  • Aerospace and Defense: Applicable in various aerospace and defense applications requiring high-performance signal processing.

Q & A

  1. What is the clock rate of the TMS320C6474FZUN8?

    The clock rate of the TMS320C6474FZUN8 ranges from 850 MHz to 1.2 GHz.

  2. How many DSP cores does the TMS320C6474FZUN8 have?

    The device features three TMS320C64x+™ DSP cores.

  3. What type of memory does the TMS320C6474FZUN8 support?

    The device supports 16-/32-bit DDR2 SDRAM and includes on-chip L1 and L2 SRAM.

  4. What are the operating temperature ranges for the TMS320C6474FZUN8?

    The operating temperature ranges from -40°C to 100°C.

  5. Does the TMS320C6474FZUN8 support Ethernet?

    Yes, it includes a 1000 Mbps Ethernet media access controller (EMAC).

  6. What is the package type of the TMS320C6474FZUN8?

    The device is packaged in a 561-Pin Ball Grid Array (BGA).

  7. What process technology is used in the TMS320C6474FZUN8?

    The device is based on 65-nm process technology.

  8. Does the TMS320C6474FZUN8 support Serial RapidIO (SRIO)?

    Yes, it supports Serial RapidIO with link rates up to 3.125 Gbps.

  9. What is the purpose of the SmartReflex power management in the TMS320C6474FZUN8?

    SmartReflex power management helps in efficient power usage and is required for proper device operation.

  10. What are some typical applications of the TMS320C6474FZUN8?

    Typical applications include video and telecom infrastructures, medical imaging, industrial automation, and aerospace and defense systems.

Product Attributes

Type:Fixed Point
Interface:Ethernet MAC, I²C, McBSP
Clock Rate:850MHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:3.168MB
Voltage - I/O:1.1V, 1.8V
Voltage - Core:1.10V
Operating Temperature:0°C ~ 100°C (TC)
Mounting Type:Surface Mount
Package / Case:561-BFBGA, FCBGA Exposed Pad
Supplier Device Package:561-FCBGA (23x23)
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Similar Products

Part Number TMS320C6474FZUN8 TMS320C6474FZUNA TMS320C6474FCUN8 TMS320C6474FZUN TMS320C6474FZUN2
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Obsolete Active Obsolete Obsolete
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP
Clock Rate 850MHz 1GHz 850MHz 1GHz 1.2GHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB
Voltage - I/O 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V
Voltage - Core 1.10V 1.10V 1.10V 1.10V 1.10V
Operating Temperature 0°C ~ 100°C (TC) -40°C ~ 100°C (TC) 0°C ~ 100°C (TC) 0°C ~ 100°C (TC) 0°C ~ 95°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 561-BFBGA, FCBGA Exposed Pad 561-BFBGA, FCBGA Exposed Pad 561-BFBGA, FCCSPBGA 561-BFBGA, FCBGA Exposed Pad 561-BFBGA, FCBGA Exposed Pad
Supplier Device Package 561-FCBGA (23x23) 561-FCBGA (23x23) 561-FC/CSP (23x23) 561-FCBGA (23x23) 561-FCBGA (23x23)

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