TMS320C6474FCUN2
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Texas Instruments TMS320C6474FCUN2

Manufacturer No:
TMS320C6474FCUN2
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DSP MULTICORE 561CSP
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The TMS320C6474FCUN2 is a high-performance multicore digital signal processor (DSP) developed by Texas Instruments. It is part of the TMS320C6000™ DSP platform and specifically belongs to the C64x+™ generation. This device is based on the third-generation advanced VelociTI™ very-long-instruction-word (VLIW) architecture, offering significant improvements in processing power and efficiency. The C6474 device features three TMS320C64x+™ DSP cores, each capable of operating at different clock rates up to 1.2 GHz, making it suitable for demanding applications in various fields such as telecommunications, video processing, and medical imaging.

Key Specifications

Parameter Description
Processor Cores 3 TMS320C64x+™ DSP Cores
Clock Rate 1 GHz to 1.2 GHz (1.2-GHz Device), 1 GHz (1-GHz Device), 850 MHz (850-MHz Device)
Instruction Cycle Time 0.83 ns (1.2-GHz Device), 1 ns (1-GHz Device), 1.18 ns (850-MHz Device)
Memory 256 K-Bit (32 K-Byte) L1P Program Cache, 256 K-Bit (32 K-Byte) L1D Data Cache, 512 K-Bit (64 K-Byte) L3 ROM, 3.168 MB On-Chip RAM
Memory Controller 16-/32-Bit DDR2-667 Memory Controller
Interfaces Two 1x Serial RapidIO® Links, v1.2 Compliant; One 1.8-V Inter-Integrated Circuit (I2C) Bus; Two 1.8-V McBSPs; 1000 Mbps Ethernet MAC (EMAC)
Timers Six 64-Bit General-Purpose Timers (configurable as twelve 32-bit timers)
GPIO 16 General-Purpose I/O (GPIO) Pins
Temperature Range Commercial: 0°C to 100°C; Extended: -40°C to 100°C
Package 561-Pin Ball Grid Array (BGA) Package (CUN)

Key Features

  • High-Performance Multicore DSP with three TMS320C64x+™ DSP Cores
  • Dedicated SPLOOP Instructions and Compact Instructions (16-Bit)
  • Exception Handling and Instruction Cycle Time Optimization
  • Enhanced VCP2/TCP2 and Frame Synchronization Interface
  • EDMA3 Controller for efficient data transfer
  • Antenna Interface with up to 3.072 Gbps operation per link, compliant to OBSAI RP3 and CPRI standards
  • Two 1x Serial RapidIO® Links, v1.2 Compliant, with link rates of 1.25 Gbps, 2.5 Gbps, or 3.125 Gbps
  • 1000 Mbps Ethernet MAC (EMAC), IEEE 802.3 Compliant, and SGMII v1.8 Compliant
  • Six 64-Bit General-Purpose Timers and 16 General-Purpose I/O (GPIO) Pins
  • Internal Semaphore Module for managing shared resources
  • System PLL and PLL Controller, DDR PLL and PLL Controller dedicated to DDR2 Memory Controller

Applications

The TMS320C6474FCUN2 is designed for a variety of high-performance applications, including:

  • Telecommunications: Supports multiple wireless standards and high-speed data processing for base stations and other telecom infrastructure.
  • Video Processing: Ideal for video encoding, decoding, and processing in various formats.
  • Medical Imaging: Used in medical imaging devices for real-time processing of high-resolution images.
  • Industrial Automation: Suitable for control systems and data processing in industrial environments.
  • Aerospace and Defense: Used in radar, sonar, and other defense-related applications requiring high computational power.

Q & A

  1. What is the TMS320C6474FCUN2?

    The TMS320C6474FCUN2 is a high-performance multicore digital signal processor (DSP) developed by Texas Instruments.

  2. How many DSP cores does the TMS320C6474FCUN2 have?

    The device features three TMS320C64x+™ DSP cores.

  3. What are the clock rates of the TMS320C6474FCUN2?

    The clock rates are 1 GHz to 1.2 GHz (1.2-GHz Device), 1 GHz (1-GHz Device), and 850 MHz (850-MHz Device).

  4. What type of memory does the TMS320C6474FCUN2 support?

    The device supports 16-/32-Bit DDR2-667 Memory and has on-chip RAM of 3.168 MB.

  5. What interfaces are available on the TMS320C6474FCUN2?

    The device includes Serial RapidIO, I²C, McBSP, and 1000 Mbps Ethernet MAC (EMAC).

  6. What is the temperature range for the TMS320C6474FCUN2?

    The commercial temperature range is 0°C to 100°C, and the extended temperature range is -40°C to 100°C.

  7. What package type does the TMS320C6474FCUN2 use?

    The device is packaged in a 561-Pin Ball Grid Array (BGA) Package (CUN).

  8. What are some of the key features of the TMS320C6474FCUN2?

    Key features include dedicated SPLOOP instructions, compact instructions, enhanced VCP2/TCP2, frame synchronization interface, and an antenna interface.

  9. What applications is the TMS320C6474FCUN2 suitable for?

    The device is suitable for telecommunications, video processing, medical imaging, industrial automation, and aerospace and defense applications.

  10. Is the TMS320C6474FCUN2 backward compatible with previous DSPs in the C6000™ platform?

    Yes, the C64x+™ devices are upward code-compatible from previous devices in the C6000™ DSP platform.

  11. What is the role of the EDMA3 controller in the TMS320C6474FCUN2?

    The EDMA3 controller is responsible for efficient data transfer and management within the device.

Product Attributes

Type:Fixed Point
Interface:Ethernet MAC, I²C, McBSP
Clock Rate:1.2GHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:3.168MB
Voltage - I/O:1.1V, 1.8V
Voltage - Core:1.10V
Operating Temperature:0°C ~ 95°C (TC)
Mounting Type:Surface Mount
Package / Case:561-BFBGA, FCCSPBGA
Supplier Device Package:561-FC/CSP (23x23)
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Similar Products

Part Number TMS320C6474FCUN2 TMS320C6474FCUN8 TMS320C6474FCUNA TMS320C6474FCUNA2 TMS320C6474FZUN2 TMS320C6474FGUN2 TMS320C6474FCUN
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Obsolete Discontinued at Digi-Key Active
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP
Clock Rate 1.2GHz 850MHz 1GHz 1.2GHz 1.2GHz 1.2GHz 1GHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB
Voltage - I/O 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V
Voltage - Core 1.10V 1.10V 1.10V 1.10V 1.10V 1.10V 1.10V
Operating Temperature 0°C ~ 95°C (TC) 0°C ~ 100°C (TC) -40°C ~ 100°C (TC) -40°C ~ 95°C (TC) 0°C ~ 95°C (TC) 0°C ~ 95°C (TC) 0°C ~ 100°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 561-BFBGA, FCCSPBGA 561-BFBGA, FCCSPBGA 561-BFBGA, FCCSPBGA 561-BFBGA, FCCSPBGA 561-BFBGA, FCBGA Exposed Pad 561-BFBGA 561-BFBGA, FCCSPBGA
Supplier Device Package 561-FC/CSP (23x23) 561-FC/CSP (23x23) 561-FC/CSP (23x23) 561-FC/CSP (23x23) 561-FCBGA (23x23) 561-FCBGA (23x23) 561-FC/CSP (23x23)

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