TMS320C6474FCUN
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Texas Instruments TMS320C6474FCUN

Manufacturer No:
TMS320C6474FCUN
Manufacturer:
Texas Instruments
Package:
Bulk
Description:
IC DSP MULTICORE 561FCBGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The TMS320C6474FCUN is a high-performance multicore digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000™ DSP platform. This device is based on the third-generation advanced VelociTI™ very-long-instruction-word (VLIW) architecture. It features three TMS320C64x+™ DSP cores, each capable of executing up to 28,800 million instructions per second (MIPS) or 28,800 16-bit MACs per cycle, making it a powerful solution for high-performance DSP applications.

Key Specifications

Parameter Description
Clock Rate 1 GHz to 1.2 GHz (1.2-GHz Device); 1 GHz (1-GHz Device); 850 MHz (850-MHz Device)
Instruction Cycle Time 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns (850-MHz Device)
Temperature Range 1-GHz Device: -40°C to 100°C; 1.2-GHz Device: -40°C to 95°C
Memory 256 K-Bit (32 K-Byte) L1P Program Cache [Direct Mapped]; 256 K-Bit (32 K-Byte) L1D Data Cache [2-Way Set-Associative]; 512 K-Bit (64 K-Byte) L3 ROM
Package 561-Pin Ball Grid Array (BGA) Package (CUN, GUN, or ZUN Suffix)
Peripherals 1000 Mbps Ethernet MAC (EMAC), IEEE 802.3 Compliant; Two 1x Serial RapidIO® Links, v1.2 Compliant; Six 64-Bit General-Purpose Timers; Two 1.8-V McBSPs; One 1.8-V I2C Bus; 16 General-Purpose I/O (GPIO) Pins
Memory Controller 16-/32-Bit DDR2-667 Memory Controller
Other Features EDMA3 Controller, Frame Synchronization Interface, Antenna Interface, OBSAI RP1 and RP3 Compliant

Key Features

  • High-Performance Multicore DSP with three TMS320C64x+™ DSP Cores
  • Dedicated SPLOOP Instructions and Compact Instructions (16-Bit)
  • Exception Handling and Instruction Cycle Time Optimization
  • Enhanced VCP2/TCP2 and Frame Synchronization Interface
  • Antenna Interface with up to 3.072 Gbps operation per link, compliant to OBSAI RP3 and CPRI standards
  • Two 1x Serial RapidIO® Links, v1.2 Compliant, with link rates of 1.25 Gbps, 2.5 Gbps, or 3.125 Gbps
  • 1000 Mbps Ethernet MAC (EMAC), IEEE 802.3 Compliant, supporting SGMII, v1.8 Compliant
  • Six 64-Bit General-Purpose Timers, configurable as twelve 32-bit timers
  • 16 General-Purpose I/O (GPIO) Pins with programmable interrupt/event generation modes
  • SmartReflex™ Class 0 - 0.9-V to 1.2-V Adaptive Core Voltage

Applications

The TMS320C6474FCUN is designed for various high-performance applications, including:

  • Telecom and wireless infrastructure
  • Video and imaging processing
  • Medical imaging and diagnostics
  • High-speed data processing and analytics
  • CDMA and other wireless communication systems, leveraging its six RSAs for CDMA processing
  • Industrial automation and control systems requiring advanced DSP capabilities

Q & A

  1. What is the clock rate of the TMS320C6474FCUN?

    The clock rate of the TMS320C6474FCUN ranges from 850 MHz to 1.2 GHz depending on the device variant.

  2. How many DSP cores does the TMS320C6474FCUN have?

    The TMS320C6474FCUN has three TMS320C64x+™ DSP cores.

  3. What type of memory does the TMS320C6474FCUN support?

    The device supports 16-/32-Bit DDR2-667 memory and has on-chip memory including L1P, L1D, and L3 ROM.

  4. What are the key peripherals of the TMS320C6474FCUN?

    The key peripherals include 1000 Mbps Ethernet MAC (EMAC), two Serial RapidIO® links, six 64-bit general-purpose timers, two McBSPs, one I2C bus, and 16 GPIO pins.

  5. Is the TMS320C6474FCUN compatible with previous C6000™ DSP devices?

    Yes, the C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.

  6. What is the temperature range for the TMS320C6474FCUN?

    The temperature range varies by device variant: 1-GHz Device: -40°C to 100°C; 1.2-GHz Device: -40°C to 95°C.

  7. Does the TMS320C6474FCUN support any specific communication standards?

    Yes, it supports OBSAI RP1 and RP3 protocols, as well as Serial RapidIO® and Ethernet standards.

  8. What is the package type of the TMS320C6474FCUN?

    The device comes in a 561-Pin Ball Grid Array (BGA) package (CUN, GUN, or ZUN suffix).

  9. What is the purpose of the Antenna Interface in the TMS320C6474FCUN?

    The Antenna Interface is used for high-speed serial links, compliant to OBSAI RP3 and CPRI standards, for antenna data transmission and reception.

  10. Does the TMS320C6474FCUN have any power management features?

    Yes, it includes SmartReflex™ Class 0 - 0.9-V to 1.2-V Adaptive Core Voltage for power management.

Product Attributes

Type:Fixed Point
Interface:Ethernet MAC, I²C, McBSP
Clock Rate:1GHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:3.168MB
Voltage - I/O:1.1V, 1.8V
Voltage - Core:1.10V
Operating Temperature:0°C ~ 100°C (TC)
Mounting Type:Surface Mount
Package / Case:561-BFBGA, FCCSPBGA
Supplier Device Package:561-FC/CSP (23x23)
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Similar Products

Part Number TMS320C6474FCUN TMS320C6474FCUN8 TMS320C6474FCUN2 TMS320C6474FCUNA TMS320C6474FGUN TMS320C6474FZUN
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Discontinued at Digi-Key Obsolete
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP
Clock Rate 1GHz 850MHz 1.2GHz 1GHz 1GHz 1GHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB
Voltage - I/O 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V
Voltage - Core 1.10V 1.10V 1.10V 1.10V 1.10V 1.10V
Operating Temperature 0°C ~ 100°C (TC) 0°C ~ 100°C (TC) 0°C ~ 95°C (TC) -40°C ~ 100°C (TC) 0°C ~ 100°C (TC) 0°C ~ 100°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 561-BFBGA, FCCSPBGA 561-BFBGA, FCCSPBGA 561-BFBGA, FCCSPBGA 561-BFBGA, FCCSPBGA 561-BFBGA 561-BFBGA, FCBGA Exposed Pad
Supplier Device Package 561-FC/CSP (23x23) 561-FC/CSP (23x23) 561-FC/CSP (23x23) 561-FC/CSP (23x23) 561-FCBGA (23x23) 561-FCBGA (23x23)

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