NZQA6V8XV5T1G
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onsemi NZQA6V8XV5T1G

Manufacturer No:
NZQA6V8XV5T1G
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
TVS DIODE 4.3V 12.5V SOT553
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The NZQA6V8XV5T1G is a quad monolithic silicon voltage suppressor designed by onsemi for applications requiring transient overvoltage protection. This device is part of the NZQA series, which is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other similar applications. Its quad junction common anode design allows it to protect four separate lines using only one package, making it ideal for situations where board space is limited.

Key Specifications

Parameter Symbol Value Unit
Breakdown Voltage @ 1 mA VBR 6.8 - 7.14 V
Working Peak Reverse Voltage VRWM 6.8 V
Maximum Reverse Leakage Current @ VRWM IRWM 0.1 μA
Clamping Voltage @ IPP VC 12.5 V
Maximum Reverse Peak Pulse Current IPP 10 A
Peak Power Dissipation (8 x 20 μs @ TA = 25°C) PPK 100 W
Steady State Power - 1 Diode PD 300 mW
Thermal Resistance Junction to Ambient RJA 370 °C/W
Maximum Junction Temperature TJmax 150 °C
Operating Junction and Storage Temperature Range TJ Tstg -55 to +150 °C
ESD Discharge (IEC61000-4-2, Air Discharge) VPP 30 kV
Lead Solder Temperature (10 seconds duration) TL 260 °C

Key Features

  • Quad Junction Common Anode Design: Protects four separate lines using only one package, ideal for space-constrained applications.
  • Low Leakage Current: Less than 1 μA at 3 V, minimizing power consumption.
  • ESD Protection: Meets IEC61000-4-2 Level 4 standards for robust protection against electrostatic discharges.
  • AEC-Q101 Qualified: Suitable for automotive and other applications requiring high reliability and unique site and control change requirements.
  • Pb-Free and RoHS Compliant: Environmentally friendly and compliant with lead-free regulations.
  • Small Package Size: SOT-553 package designed for high-density applications and optimal automated board assembly.
  • Corrosion Resistant Finish: Easily solderable and resistant to corrosion.

Applications

  • Computers and Peripherals: Protects against transient overvoltages in computers, printers, and other business machines.
  • Communication Systems: Used in communication equipment to safeguard against voltage spikes and ESD.
  • Medical Equipment: Ensures the reliability and safety of medical devices by protecting against overvoltages.
  • Automotive Systems: Suitable for automotive applications due to its AEC-Q101 qualification and robust ESD protection.
  • Industrial and Consumer Electronics: Protects a wide range of electronic devices in industrial and consumer applications.

Q & A

  1. What is the NZQA6V8XV5T1G used for?

    The NZQA6V8XV5T1G is used for transient overvoltage protection in various electronic devices, including computers, communication systems, medical equipment, and automotive systems.

  2. What is the breakdown voltage of the NZQA6V8XV5T1G?

    The breakdown voltage of the NZQA6V8XV5T1G is between 6.8 V and 7.14 V at 1 mA.

  3. Does the NZQA6V8XV5T1G meet any specific industry standards?

    Yes, it meets IEC61000-4-2 Level 4 standards for ESD protection and is AEC-Q101 qualified for automotive applications.

  4. What is the maximum junction temperature of the NZQA6V8XV5T1G?

    The maximum junction temperature is 150°C.

  5. Is the NZQA6V8XV5T1G lead-free?

    Yes, the NZQA6V8XV5T1G is a lead-free device and is RoHS compliant.

  6. What is the package type of the NZQA6V8XV5T1G?

    The device is packaged in a SOT-553 package.

  7. What is the peak power dissipation of the NZQA6V8XV5T1G?

    The peak power dissipation is 100 W for an 8 x 20 μs pulse at 25°C.

  8. Can the NZQA6V8XV5T1G be used in high-density applications?

    Yes, the small package size and design of the NZQA6V8XV5T1G make it suitable for high-density applications.

  9. Is the NZQA6V8XV5T1G suitable for automated board assembly?

    Yes, the package is designed for optimal automated board assembly.

  10. What is the thermal resistance junction to ambient of the NZQA6V8XV5T1G?

    The thermal resistance junction to ambient is 370 °C/W.

Product Attributes

Type:Zener
Unidirectional Channels:4
Bidirectional Channels:- 
Voltage - Reverse Standoff (Typ):4.3V
Voltage - Breakdown (Min):6.46V
Voltage - Clamping (Max) @ Ipp:12.5V
Current - Peak Pulse (10/1000µs):8A (8/20µs)
Power - Peak Pulse:100W
Power Line Protection:No
Applications:General Purpose
Capacitance @ Frequency:70pF @ 1MHz
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Package / Case:SOT-553
Supplier Device Package:SOT-553
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In Stock

$0.14
3,830

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Similar Products

Part Number NZQA6V8XV5T1G NZQA6V2XV5T1G NZQA6V8AXV5T1G NZQA6V8XV5T1
Manufacturer onsemi onsemi onsemi onsemi
Product Status Active Active Active Obsolete
Type Zener Zener Zener Zener
Unidirectional Channels 4 4 4 4
Bidirectional Channels - - - -
Voltage - Reverse Standoff (Typ) 4.3V 4V 4.3V 4.3V
Voltage - Breakdown (Min) 6.46V 5.89V 6.47V 6.46V
Voltage - Clamping (Max) @ Ipp 12.5V 11.5V 13V 12.5V
Current - Peak Pulse (10/1000µs) 8A (8/20µs) 9A (8/20µs) 1.6A (8/20µs) 8A (8/20µs)
Power - Peak Pulse 100W 100W 20W 100W
Power Line Protection No No No No
Applications General Purpose General Purpose General Purpose General Purpose
Capacitance @ Frequency 70pF @ 1MHz 80pF @ 1MHz 12pF @ 1MHz 70pF @ 1MHz
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case SOT-553 SOT-553 SOT-553 SOT-553
Supplier Device Package SOT-553 SOT-553 SOT-553 SOT-553

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