Overview
The ESD5481MUT3G is an ESD protection diode designed by onsemi to safeguard voltage-sensitive components from electrostatic discharge (ESD). This micro-packaged diode is renowned for its excellent clamping capability, low leakage current, and fast response time, making it ideal for protecting designs exposed to ESD events.
Its compact size and low profile make it particularly suited for use in portable applications such as cellular phones, MP3 players, and digital cameras, where board space is limited.
Key Specifications
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM | I/O Pin to I/O Pin | - | - | 5.0 | V |
| Breakdown Voltage | VBR | IT = 5 μA | 4.5 | - | 10 | V |
| Breakdown Voltage | VBR | IT = 1 mA | 5.7 | - | 8.0 | V |
| Reverse Leakage Current | IR | VRWM = 5.0 V | - | - | 1.0 μA | A |
| Clamping Voltage | VC | IEC61000-4-2, ±8 kV Contact | - | - | 19.7 - 23 V | V |
| Clamping Voltage (8/20 μs Waveform) | VC | IPP = 1 A, IPP = 2 A | 9.8 - 12.4 V | - | 12 - 15 V | V |
| Dynamic Resistance | RDYN | Pin 1 to Pin 2, Pin 2 to Pin 1 | 0.49 Ω | - | 0.28 Ω | Ω |
| Reverse Peak Pulse Current | IPP | IEC 61000-4-5 (8/20 μs) | - | - | 2.0 A | A |
| Junction Capacitance | CJ | VR = 0 V, f = 1 MHz | 12 pF | - | 15 pF | pF |
| Package Dimensions | - | - | - | - | 0.60 mm x 0.30 mm x 0.3 mm | mm |
| Maximum Junction Temperature | TJ | - | -55°C | - | 150°C | °C |
| Lead Solder Temperature (10 Second Duration) | TL | - | - | - | 260°C | °C |
Key Features
- Low Capacitance: 15 pF, ensuring minimal impact on high-frequency signals.
- Low Clamping Voltage: Effective in limiting the voltage during ESD events.
- Compact Size: Dimensions of 0.60 mm x 0.30 mm x 0.3 mm, ideal for space-constrained designs.
- Fast Response Time: Less than 1 ns, providing rapid protection against ESD pulses.
- Low Leakage Current: Minimal current leakage at the working voltage.
- IEC 61000-4-2 Level 4 ESD Protection: Capable of withstanding ±20 kV contact and ±20 kV air discharges.
- IEC 61000-4-4 Level 4 EFT Protection: Resistant to electrical fast transient (EFT) pulses.
- RoHS Compliant: Pb-free, halogen-free, and BFR-free, ensuring environmental compliance.
Applications
- Portable Electronics: Cellular phones, MP3 players, digital cameras, and other handheld devices.
- Consumer Electronics: Tablets, smartwatches, and other consumer electronic devices.
- Industrial Equipment: Protection in industrial control systems and automation devices.
- Automotive Systems: ESD protection in automotive electronics and infotainment systems.
Q & A
- What is the primary function of the ESD5481MUT3G?
The primary function of the ESD5481MUT3G is to protect voltage-sensitive components from electrostatic discharge (ESD).
- What are the dimensions of the ESD5481MUT3G package?
The package dimensions are 0.60 mm x 0.30 mm x 0.3 mm.
- What is the maximum junction temperature for the ESD5481MUT3G?
The maximum junction temperature is 150°C.
- Is the ESD5481MUT3G RoHS compliant?
Yes, the ESD5481MUT3G is Pb-free, halogen-free, and BFR-free, making it RoHS compliant.
- What level of ESD protection does the ESD5481MUT3G offer according to IEC 61000-4-2?
The ESD5481MUT3G offers Level 4 ESD protection, capable of withstanding ±20 kV contact and ±20 kV air discharges.
- What is the typical clamping voltage of the ESD5481MUT3G during an ESD event?
The typical clamping voltage is between 19.7 V and 23 V for an 8 kV contact discharge.
- What is the dynamic resistance of the ESD5481MUT3G?
The dynamic resistance is between 0.49 Ω and 0.28 Ω.
- What is the junction capacitance of the ESD5481MUT3G?
The junction capacitance is between 12 pF and 15 pF at 1 MHz.
- Can the ESD5481MUT3G be used in automotive applications?
Yes, the ESD5481MUT3G can be used in automotive electronics and infotainment systems for ESD protection.
- What is the maximum lead solder temperature for the ESD5481MUT3G?
The maximum lead solder temperature is 260°C for a 10-second duration.
