SPC5602DF1MLL4
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NXP USA Inc. SPC5602DF1MLL4

Manufacturer No:
SPC5602DF1MLL4
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 256KB FLASH 100LQFP
Delivery:
Payment:
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Product Introduction

Overview

The SPC5602DF1MLL4 is a 32-bit microcontroller from NXP USA Inc., part of the MPC560xB/C/D family. This microcontroller is designed for automotive body electronics and industrial applications, offering a robust and scalable solution for various embedded systems. It features a Power Architecture e200z0h core, which includes an instruction set enhancement allowing for variable length encoding (VLE) to reduce code size footprint. The device operates within a temperature range of -40°C to 125°C, making it suitable for harsh environments.

Key Specifications

ParameterSpecification
CorePower Architecture e200z0h
Flash MemoryUp to 256 KB Code Flash with ECC
Data Flash64 KB with ECC
SRAMUp to 16 KB with ECC
FrequencyUp to 48 MHz
Package100 LQFP (10 mm x 10 mm)
Temperature Range-40°C to 125°C
Interrupt ControllerINTC with multiple interrupt vectors, including 20 external interrupt sources and 18 external interrupt/wakeup sources
Peripheral InterfacesDSPI, FlexCAN, LINFlex, eMIOS, ADC, and more

Key Features

  • Single issue, 32-bit CPU core complex compliant with the Power Architecture embedded category.
  • Instruction set enhancement allowing variable length encoding (VLE) for code size footprint reduction.
  • Integrated Flash controller and ECC for both Code and Data Flash.
  • Multiple peripheral interfaces including DSPI, FlexCAN, LINFlex, and eMIOS.
  • Frequency modulated phase-locked loop (FMPLL) for clock management.
  • Interrupt controller with multiple interrupt vectors and external interrupt sources.
  • GPIO and JTAG port for debugging and interface purposes.

Applications

The SPC5602DF1MLL4 is primarily used in automotive body electronics and industrial applications. It is suitable for various systems such as:

  • Automotive body control modules.
  • Industrial control systems.
  • Gateway applications.
  • Powertrain control systems.

Q & A

  1. What is the core architecture of the SPC5602DF1MLL4?
    The SPC5602DF1MLL4 features a Power Architecture e200z0h core.
  2. How much Flash memory does the SPC5602DF1MLL4 have?
    The device has up to 256 KB of Code Flash and 64 KB of Data Flash, both with ECC.
  3. What is the operating temperature range of the SPC5602DF1MLL4?
    The operating temperature range is -40°C to 125°C.
  4. What are the key peripheral interfaces available on the SPC5602DF1MLL4?
    The device includes DSPI, FlexCAN, LINFlex, eMIOS, and ADC among others.
  5. What is the purpose of the FMPLL in the SPC5602DF1MLL4?
    The FMPLL is used for clock management, providing a stable clock signal.
  6. How many external interrupt sources does the SPC5602DF1MLL4 support?
    The device supports 20 external interrupt sources and 18 external interrupt/wakeup sources.
  7. What type of package is the SPC5602DF1MLL4 available in?
    The device is available in a 100 LQFP package (10 mm x 10 mm).
  8. Is the SPC5602DF1MLL4 suitable for industrial applications?
    Yes, it is designed for both automotive and industrial applications.
  9. What is the maximum operating frequency of the SPC5602DF1MLL4?
    The maximum operating frequency is up to 48 MHz.
  10. Does the SPC5602DF1MLL4 support JTAG for debugging?
    Yes, it includes a JTAG port for debugging purposes.

Product Attributes

Core Processor:e200z0h
Core Size:32-Bit Single-Core
Speed:48MHz
Connectivity:CANbus, LINbus, SCI, SPI
Peripherals:DMA, POR, PWM, WDT
Number of I/O:79
Program Memory Size:256KB (256K x 8)
Program Memory Type:Flash
EEPROM Size:4K x 16
RAM Size:16K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 33x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:100-LQFP
Supplier Device Package:100-LQFP (14x14)
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Part Number SPC5602DF1MLL4 SPC5602DF1VLL4 SPC5602DF1MLL4R SPC5601DF1MLL4 SPC5602DF1MLH4 SPC5602DF1MLL3
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active
Core Processor e200z0h e200z0h e200z0h e200z0h e200z0h e200z0h
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 48MHz 48MHz 48MHz 48MHz 48MHz 32MHz
Connectivity CANbus, LINbus, SCI, SPI CANbus, LINbus, SCI, SPI CANbus, LINbus, SCI, SPI CANbus, LINbus, SCI, SPI CANbus, LINbus, SCI, SPI CANbus, LINbus, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 79 79 79 79 45 79
Program Memory Size 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 128KB (128K x 8) 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash
EEPROM Size 4K x 16 4K x 16 4K x 16 4K x 16 4K x 16 64K x 8
RAM Size 16K x 8 16K x 8 16K x 8 12K x 8 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 33x12b A/D 33x12b A/D 33x12b A/D 33x12b A/D 16x12b A/D 33x12b
Oscillator Type Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 100-LQFP 100-LQFP 100-LQFP 100-LQFP 64-LQFP 100-LQFP
Supplier Device Package 100-LQFP (14x14) 100-LQFP (14x14) 100-LQFP (14x14) 100-LQFP (14x14) 64-LQFP (10x10) 100-LQFP (14x14)

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