SPC5777CDK3MME3
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NXP USA Inc. SPC5777CDK3MME3

Manufacturer No:
SPC5777CDK3MME3
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 8MB FLASH 416MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The NXP SPC5777CDK3MME3 is a high-performance, 32-bit tri-core embedded microcontroller from the MPC57xx series. It is designed to target industrial and automotive engine control applications, emphasizing advanced performance, timing systems, security, and functional safety. This MCU features an e200z7 core architecture, which includes three dual-issue, 32-bit CPU core complexes, two of which run in lockstep for enhanced reliability and safety.

Key Specifications

Parameter Specification
Core Processor e200z7, 32-bit Tri-Core
Clock Speed 264 MHz
Program Memory 8 MB FLASH
RAM Size 512 KB (including 64 KB standby RAM)
Package 416-pin MAPBGA (27x27)
Operating Temperature -40°C to 125°C
Voltage Supply 3 V ~ 5.5 V
Functional Safety ISO 26262, ASIL D
Connectivity CAN, Ethernet, LIN, SPI, FlexCAN, PSI5, SENT
Peripherals DMA, LVD, POR, Zipwire, eQADC, SDADC, eSCI, etc.

Key Features

  • Three dual-issue, 32-bit CPU core complexes (e200z7), with two cores running in lockstep for enhanced reliability and safety.
  • Power Architecture embedded specification compliance and instruction set enhancement for code size reduction.
  • Signal processing extension (SPE1.1) for digital signal processing (DSP) and single-precision floating point operations.
  • 16 KB I-Cache and 16 KB D-Cache per core, with hardware cache coherency between cores.
  • 8 MB on-chip flash memory with read during program and erase operations, and multiple blocks allowing EEPROM emulation.
  • 512 KB on-chip general-purpose SRAM, including 64 KB standby RAM.
  • Dual core Interrupt Controller (INTC) and dual phase-locked loops (PLLs).
  • Crossbar Switch architecture for concurrent access to peripherals, flash memory, or RAM from multiple bus masters with End-To-End ECC.
  • Enhanced Time Processor Units (eTPUs), Enhanced Modular Input/Output System (eMIOS), and Enhanced Queued Analog-to-Digital Converter (eQADC) modules.
  • Cryptographic Services Engine (CSE) and compliance with Secure Hardware Extension (SHE) Functional Specification Version 1.1 security functions.
  • Tamper Detection Module (TDM) and Fault Collection and Control Unit (FCCU).

Applications

  • Industrial and automotive engine control applications.
  • Industrial automation and control systems.
  • Automotive electronics, including advanced driver-assistance systems (ADAS) and autonomous vehicles.
  • Robotics and motion control systems.
  • Aerospace and defense systems requiring high reliability and functional safety.

Q & A

  1. What is the core architecture of the SPC5777CDK3MME3?

    The SPC5777CDK3MME3 features an e200z7 core architecture, which includes three dual-issue, 32-bit CPU core complexes, two of which run in lockstep.

  2. What is the clock speed of the SPC5777CDK3MME3?

    The clock speed of the SPC5777CDK3MME3 is 264 MHz.

  3. How much program memory and RAM does the SPC5777CDK3MME3 have?

    The SPC5777CDK3MME3 has 8 MB of FLASH program memory and 512 KB of RAM, including 64 KB standby RAM.

  4. What are the operating temperature ranges for the SPC5777CDK3MME3?

    The operating temperature range for the SPC5777CDK3MME3 is -40°C to 125°C.

  5. What functional safety standards does the SPC5777CDK3MME3 comply with?

    The SPC5777CDK3MME3 complies with ISO 26262 and supports ASIL D functional safety.

  6. What types of connectivity options are available on the SPC5777CDK3MME3?

    The SPC5777CDK3MME3 supports various connectivity options including CAN, Ethernet, LIN, SPI, FlexCAN, PSI5, and SENT.

  7. What security features are included in the SPC5777CDK3MME3?

    The SPC5777CDK3MME3 includes a Cryptographic Services Engine (CSE) and complies with Secure Hardware Extension (SHE) Functional Specification Version 1.1 security functions).

  8. What are the packaging options for the SPC5777CDK3MME3?

    The SPC5777CDK3MME3 is available in a 416-pin MAPBGA (27x27) surface mount package).

  9. Does the SPC5777CDK3MME3 support any specific development interfaces?

    The SPC5777CDK3MME3 supports the Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard and JTAG IEEE 1149.1 and 1149.7 for device and board testing).

  10. What are some of the peripheral modules available on the SPC5777CDK3MME3?

    The SPC5777CDK3MME3 includes various peripheral modules such as DMA, LVD, POR, Zipwire, eQADC, SDADC, eSCI, and more).

  11. Is the SPC5777CDK3MME3 compatible with other MPC57xx series microcontrollers?

    Yes, the SPC5777CDK3MME3 is compatible with the MPC57xx series of embedded microcontrollers, allowing for easy integration into existing designs and seamless upgrades).

Product Attributes

Core Processor:e200z7
Core Size:32-Bit Tri-Core
Speed:264MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:DMA, LVD, POR, Zipwire
Number of I/O:- 
Program Memory Size:8MB (8M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 16b Sigma-Delta, eQADC
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:416-BGA
Supplier Device Package:416-MAPBGA (27x27)
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Similar Products

Part Number SPC5777CDK3MME3 SPC5777CK3MME3 SPC5777CDK3MME4 SPC5777CRK3MME3 SPC5777CLK3MME3 SPC5777CSK3MME3 SPC5777CDK3MME3R SPC5777CDK3MMO3 SPC5777CAK3MME3 SPC5777CCK3MME3
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Active Active Active
Core Processor e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7
Core Size 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core
Speed 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire
Number of I/O - - - - - - - - - -
Program Memory Size 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - - - - - -
RAM Size 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 416-BGA 416-BGA 416-BGA 416-BGA 416-BGA 416-BGA 416-BGA 516-BGA 416-BGA 416-BGA
Supplier Device Package 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 516-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27)

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