SPC5777CDK3MME3R
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NXP USA Inc. SPC5777CDK3MME3R

Manufacturer No:
SPC5777CDK3MME3R
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 8MB FLASH 416MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The SPC5777CDK3MME3R is a high-performance, 32-bit microcontroller from NXP Semiconductors, part of the MPC57xx series. This microcontroller is designed to meet the stringent requirements of automotive and industrial applications. It features a Tri-Core e200z7 processor, offering robust performance and multitasking capabilities. The device is known for its extensive connectivity options, ample memory resources, and advanced peripherals, making it suitable for complex and demanding environments.

Key Specifications

Parameter Specification
Core Processor e200z7
Core Size 32-Bit Tri-Core
Speed 264MHz
Program Memory Size 8MB FLASH (8M x 8)
RAM Size 512K x 8
Operating Temperature -40°C to 125°C
Voltage Supply 3V ~ 5.5V
Package / Case 416-MAPBGA (27x27)

Key Features

  • Advanced Tri-Core Architecture: Enables efficient multitasking and high-performance processing.
  • Extensive Connectivity Options: Includes CANbus, Ethernet, FlexCANbus, and SPI for seamless integration into multiple systems.
  • Rich Set of Peripherals: Features DMA, LVD, POR, Zipwire, and integrated 16-bit Sigma-Delta analog-to-digital converters.
  • Ample Memory Resources: 8MB FLASH program memory and 512K x 8 RAM.
  • Operational Stability: Functions reliably across a wide temperature range and includes Low Voltage Detection (LVD) and Power-On Reset (POR) for safe operation.

Applications

  • Automotive Systems: Suitable for various automotive applications due to its robust performance and adherence to automotive-grade standards.
  • Industrial Control Units: Ideal for industrial control systems that require high reliability and performance.
  • Embedded Processing: Used in embedded systems that demand advanced processing capabilities and extensive connectivity.

Q & A

  1. What is the core processor of the SPC5777CDK3MME3R?

    The core processor is the e200z7, a 32-Bit Tri-Core processor.

  2. What is the maximum operating temperature of the SPC5777CDK3MME3R?

    The maximum operating temperature is 125°C.

  3. What are the primary applications of the SPC5777CDK3MME3R?

    The primary applications include automotive systems, industrial control units, and embedded processing.

  4. What is the program memory size of the SPC5777CDK3MME3R?

    The program memory size is 8MB FLASH (8M x 8).

  5. Does the SPC5777CDK3MME3R have any safety features?

    Yes, it includes Low Voltage Detection (LVD) and Power-On Reset (POR) for safe operation.

  6. What is the package type of the SPC5777CDK3MME3R?

    The package type is 416-MAPBGA (27x27).

  7. What are the connectivity options available on the SPC5777CDK3MME3R?

    The device features CANbus, Ethernet, FlexCANbus, and SPI for connectivity.

  8. What is the RAM size of the SPC5777CDK3MME3R?

    The RAM size is 512K x 8.

  9. Is the SPC5777CDK3MME3R suitable for harsh environments?

    Yes, it is designed to operate reliably across a wide temperature range from -40°C to 125°C.

  10. What is the voltage supply range for the SPC5777CDK3MME3R?

    The voltage supply range is 3V ~ 5.5V.

Product Attributes

Core Processor:e200z7
Core Size:32-Bit Tri-Core
Speed:264MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:DMA, LVD, POR, Zipwire
Number of I/O:- 
Program Memory Size:8MB (8M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 16b Sigma-Delta, eQADC
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:416-BGA
Supplier Device Package:416-MAPBGA (27x27)
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Similar Products

Part Number SPC5777CDK3MME3R SPC5777CK3MME3R SPC5777CLK3MME3R SPC5777CSK3MME3R SPC5777CDK3MMO3R SPC5777CDK3MME4R SPC5777CAK3MME3R SPC5777CCK3MME3R SPC5777CDK3MME3
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Active Active
Core Processor e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7
Core Size 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core
Speed 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire
Number of I/O - - - - - - - - -
Program Memory Size 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - - - - -
RAM Size 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal Internal Internal Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 416-BGA 416-BGA 416-BGA 416-BGA 516-BGA 416-BGA 416-BGA 416-BGA 416-BGA
Supplier Device Package 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 516-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27)

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