SPC5777CCK3MME3R
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NXP USA Inc. SPC5777CCK3MME3R

Manufacturer No:
SPC5777CCK3MME3R
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 8MB FLASH 416MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The SPC5777CCK3MME3R is a high-performance 32-bit microcontroller from NXP USA Inc., designed specifically for automotive and industrial applications. This microcontroller features the powerful e200z7 tri-core processor, operating at a speed of 264 MHz. It is part of the MPC5777C family, known for its robust and reliable performance in demanding environments. The device is packaged in a 416-ball MAPBGA, ensuring a high level of integration and compact design. With its wide operating temperature range of -40°C to 125°C, it is well-suited for use in harsh automotive and industrial settings.

Key Specifications

ParameterSpecification
Core Processore200z7, 32-bit Tri-Core
Speed264 MHz
Program Memory TypeFLASH
Program Memory Size8 MB (8M x 8)
RAM Size512 KB (including 64 KB standby RAM)
Operating Temperature-40°C to 125°C
Package416-ball MAPBGA
Voltage - Supply (Vcc/Vdd)3V ~ 5.5V
ConnectivityCANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Data Converters16-bit Sigma-Delta ADCs, eQADC

Key Features

  • Three dual-issue, 32-bit CPU core complexes with single-precision floating point operations
  • On-chip modules including 16 KB I-Cache and 16 KB D-Cache per core, hardware cache coherency, and 16 hardware semaphores
  • 8 MB on-chip flash memory with read during program and erase operations, and multiple blocks allowing EEPROM emulation
  • 512 KB on-chip general-purpose SRAM and 64 KB standby RAM
  • Dual core Interrupt Controller (INTC) and dual phase-locked loops (PLLs)
  • Crossbar Switch architecture for concurrent access to peripherals, flash memory, or RAM from multiple bus masters with End-To-End ECC
  • Enhanced Modular Input/Output System (eMIOS) and Enhanced Queued Analog-to-Digital Converter (eQADC) modules
  • Four independent 16-bit Sigma-Delta ADCs and various communication interfaces (CAN, FlexCAN, Ethernet, etc.)
  • Boot Assist Module (BAM) for serial bootload via CAN or SCI, and Cryptographic Services Engine (CSE) for security functions

Applications

The SPC5777CCK3MME3R microcontroller is primarily designed for automotive and industrial applications where high performance, reliability, and robustness are critical. It is suitable for use in advanced driver-assistance systems (ADAS), engine control units, transmission control units, and other safety-critical systems. Additionally, its features make it a strong candidate for industrial control systems, medical devices, and other applications requiring high computational power and reliability.

Q & A

  1. What is the core processor of the SPC5777CCK3MME3R microcontroller?
    The core processor is the e200z7, a 32-bit tri-core processor.
  2. What is the operating speed of the SPC5777CCK3MME3R?
    The operating speed is 264 MHz.
  3. What is the program memory size of the SPC5777CCK3MME3R?
    The program memory size is 8 MB (8M x 8).
  4. What is the operating temperature range of the SPC5777CCK3MME3R?
    The operating temperature range is -40°C to 125°C.
  5. What type of package does the SPC5777CCK3MME3R use?
    The package is a 416-ball MAPBGA.
  6. What are the key connectivity options available on the SPC5777CCK3MME3R?
    The key connectivity options include CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, and SPI.
  7. Does the SPC5777CCK3MME3R support any security features?
    Yes, it includes a Cryptographic Services Engine (CSE) and other security features like Secure Hardware Extension (SHE).
  8. What type of data converters are available on the SPC5777CCK3MME3R?
    The device features 16-bit Sigma-Delta ADCs and eQADC modules.
  9. Is the SPC5777CCK3MME3R suitable for automotive applications?
    Yes, it is designed for automotive and industrial applications, including ADAS, engine control units, and transmission control units.
  10. What is the RAM size of the SPC5777CCK3MME3R?
    The RAM size is 512 KB, including 64 KB standby RAM.

Product Attributes

Core Processor:e200z7
Core Size:32-Bit Tri-Core
Speed:264MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:DMA, LVD, POR, Zipwire
Number of I/O:- 
Program Memory Size:8MB (8M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 16b Sigma-Delta, eQADC
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:416-BGA
Supplier Device Package:416-MAPBGA (27x27)
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Similar Products

Part Number SPC5777CCK3MME3R SPC5777CCK3MMO3R SPC5777CK3MME3R SPC5777CDK3MME3R SPC5777CLK3MME3R SPC5777CSK3MME3R SPC5777CAK3MME3R SPC5777CCK3MME3
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Active
Core Processor e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7 e200z7
Core Size 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core
Speed 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire
Number of I/O - - - - - - - -
Program Memory Size 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - - - -
RAM Size 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal Internal Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 416-BGA 516-BGA 416-BGA 416-BGA 416-BGA 416-BGA 416-BGA 416-BGA
Supplier Device Package 416-MAPBGA (27x27) 516-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27) 416-MAPBGA (27x27)

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