LPC5516JBD64E
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NXP USA Inc. LPC5516JBD64E

Manufacturer No:
LPC5516JBD64E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 256KB FLASH 64HTQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC5516JBD64E is a 32-bit microcontroller from NXP Semiconductors, part of the LPC551x/S1x family. It is based on the Arm Cortex-M33 core and is designed for embedded applications, offering a balance of performance, power efficiency, and advanced security features. This microcontroller is integrated into the EdgeVerse™ edge computing platform and is certified under the EdgeLock® Assurance program, ensuring robust security solutions. The LPC5516JBD64E is particularly suited for industrial and general embedded markets, providing ease of use through pin-, software-, and peripheral-compatibility.

Key Specifications

SpecificationDetails
Processor CoreArm Cortex-M33
Flash MemoryUp to 256 KB
SRAMUp to 96 KB
ADC16-bit, 2.0 MSamples/sec, 10 single-ended or 5 differential channels
Temperature SensorIntegrated temperature sensor connected to the ADC
ComparatorWith five input pins and external or internal reference voltage
Clock GenerationInternal Free Running Oscillator (FRO) with 96 MHz and 12 MHz outputs
Power SupplySingle power supply 1.8 V to 3.6 V
Operating Temperature-40°C to +105°C
PackageHTQFP64
Security FeaturesCASPER Crypto co-processor, TrustZone®, AES, SHA, CRC, RNG, PUF
InterfacesUSB HS, Flexcomm (USART, SPI, I2C, I2S), CAN FD

Key Features

  • Advanced Security: Integrated CASPER Crypto co-processor for hardware acceleration of cryptographic functions like Elliptic Curve Cryptography (ECC), AES, SHA, CRC, and RNG. Also features TrustZone® and Physical Unclonable Function (PUF).
  • High-Performance Core: Arm Cortex-M33 core with a Floating Point Unit (FPU) and Memory Protection Unit (MPU).
  • Advanced Analog Peripherals: 16-bit ADC with high sample rates, integrated temperature sensor, and a comparator with multiple input pins.
  • Flexible Interfaces: Includes USB High Speed, Flexcomm interfaces (USART, SPI, I2C, I2S), and CAN FD.
  • Debug Capabilities: Serial Wire Debug with eight breakpoints and four watchpoints, along with Serial Wire Output for enhanced debug capabilities.
  • Power Management: Internal DC-DC converter, Power-On Reset (POR), and Brown-Out Detectors (BOD) for reliable power management.

Applications

The LPC5516JBD64E is versatile and can be used in a variety of applications, including:

  • Industrial Automation: For control and monitoring systems in industrial environments.
  • Internet of Things (IoT): For secure and efficient IoT devices requiring advanced cryptographic capabilities.
  • Automotive Systems: For various automotive applications where robust security and reliability are crucial.
  • Consumer Electronics: For devices requiring high-performance processing and advanced security features.

Q & A

  1. What is the core architecture of the LPC5516JBD64E?
    The LPC5516JBD64E is based on the Arm Cortex-M33 core.
  2. How much flash and SRAM memory does the LPC5516JBD64E have?
    The LPC5516JBD64E has up to 256 KB of flash memory and up to 96 KB of SRAM.
  3. What are the key security features of the LPC5516JBD64E?
    The key security features include the CASPER Crypto co-processor, TrustZone®, AES, SHA, CRC, RNG, and PUF.
  4. What types of interfaces does the LPC5516JBD64E support?
    The LPC5516JBD64E supports USB High Speed, Flexcomm interfaces (USART, SPI, I2C, I2S), and CAN FD.
  5. What is the operating temperature range of the LPC5516JBD64E?
    The operating temperature range is -40°C to +105°C.
  6. What package options are available for the LPC5516JBD64E?
    The LPC5516JBD64E is available in the HTQFP64 package.
  7. Does the LPC5516JBD64E support advanced debug capabilities?
    Yes, it supports Serial Wire Debug with eight breakpoints and four watchpoints, along with Serial Wire Output.
  8. What is the power supply range for the LPC5516JBD64E?
    The power supply range is 1.8 V to 3.6 V.
  9. Is the LPC5516JBD64E certified under any security standards?
    Yes, it is certified under the EdgeLock® Assurance program and has been awarded Level 2 certifications by both the PSA Certified™ scheme and the GlobalPlatform Security Evaluation Standard for IoT Platforms (SESIP).
  10. What are some typical applications for the LPC5516JBD64E?
    Typical applications include industrial automation, IoT devices, automotive systems, and consumer electronics.

Product Attributes

Core Processor:ARM® Cortex®-M33
Core Size:32-Bit Single-Core
Speed:150MHz
Connectivity:CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O:36
Program Memory Size:256KB (256K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:96K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 10x16b SAR
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:64-TQFP Exposed Pad
Supplier Device Package:64-HTQFP (10x10)
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Similar Products

Part Number LPC5516JBD64E LPC55S16JBD64E LPC5536JBD64E LPC5506JBD64E LPC5512JBD64E LPC5514JBD64E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 150MHz 150MHz 150MHz 96MHz 150MHz 150MHz
Connectivity CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART CANbus, Flex COMM, I²C, SPI, UART/USART CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT DMA, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O 36 36 39 45 36 36
Program Memory Size 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 64KB (64K x 8) 128KB (128K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - -
RAM Size 96K x 8 96K x 8 128K x 8 96K x 8 48K x 8 80K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 10x16b SAR A/D 10x16b SAR A/D 13x16b; D/A 1x12b A/D 9x16b SAR A/D 10x16b SAR A/D 10x16b SAR
Oscillator Type Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10)

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