LPC5512JBD64E
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NXP USA Inc. LPC5512JBD64E

Manufacturer No:
LPC5512JBD64E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 64KB FLASH 64HTQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The LPC5512JBD64E is a 32-bit microcontroller from NXP Semiconductors, part of the LPC5500 series. It is based on the Arm Cortex-M33 core, which provides a high-performance and power-efficient solution for various embedded applications. This microcontroller is designed to meet the demands of modern IoT, industrial, and consumer electronics with its advanced security features, robust peripherals, and flexible configuration options.

Key Specifications

SpecificationDetails
CoreArm Cortex-M33
FrequencyUp to 150 MHz
Flash MemoryUp to 256 KB with flash accelerator
SRAMUp to 96 KB
PackageHTQFP64
Operating Voltage1.8 V to 3.6 V
Operating Temperature-40°C to +105°C
USBUSB 2.0 full speed and high speed host/device controller
ADC16-bit, up to 2.0 MSamples/sec, 10 single-ended or 5 differential channels
Security FeaturesCASPER Crypto co-processor, TrustZone, AES, SHA, CRC, RNG

Key Features

  • Arm Cortex-M33 Core: Provides high performance and power efficiency.
  • Advanced Security: Includes CASPER Crypto co-processor, TrustZone, AES, SHA, CRC, and RNG for enhanced security.
  • Peripheral Set: Features DMA controllers, CAN FD module, 16-bit ADC, comparator, temperature sensor, and multiple FlexComm interfaces (USART, SPI, I2C, I2S).
  • Clock Generation: Internal Free Running Oscillator (FRO) with selectable frequencies and Power-On Reset (POR) and Brown-Out Detectors (BOD).
  • Debug Capabilities: Serial Wire Debug with eight breakpoints and four watchpoints, and Serial Wire Output.

Applications

The LPC5512JBD64E is suitable for a wide range of applications, including:

  • Internet of Things (IoT): For smart home devices, wearables, and other connected devices.
  • Industrial Automation: For control systems, sensors, and actuators.
  • Consumer Electronics: For devices such as smart appliances, audio equipment, and gaming consoles.
  • Automotive Systems: For infotainment, driver assistance, and vehicle control systems.

Q & A

  1. What is the core architecture of the LPC5512JBD64E?
    The LPC5512JBD64E is based on the Arm Cortex-M33 core.
  2. What is the maximum operating frequency of the LPC5512JBD64E?
    The maximum operating frequency is up to 150 MHz.
  3. How much flash and SRAM memory does the LPC5512JBD64E have?
    The LPC5512JBD64E has up to 256 KB of flash memory and up to 96 KB of SRAM.
  4. What are the key security features of the LPC5512JBD64E?
    The key security features include the CASPER Crypto co-processor, TrustZone, AES, SHA, CRC, and RNG.
  5. What types of USB interfaces are supported by the LPC5512JBD64E?
    The LPC5512JBD64E supports USB 2.0 full speed and high speed host/device controllers.
  6. What is the operating temperature range of the LPC5512JBD64E?
    The operating temperature range is -40°C to +105°C.
  7. Does the LPC5512JBD64E support CAN FD?
    Yes, the LPC5512JBD64E includes a CAN FD module with a dedicated DMA controller.
  8. What is the resolution and sample rate of the ADC in the LPC5512JBD64E?
    The ADC is 16-bit with a sample rate of up to 2.0 MSamples/sec.
  9. Does the LPC5512JBD64E have any debug capabilities?
    Yes, it supports Serial Wire Debug with eight breakpoints and four watchpoints, and Serial Wire Output.
  10. What package options are available for the LPC5512JBD64E?
    The LPC5512JBD64E is available in the HTQFP64 package.

Product Attributes

Core Processor:ARM® Cortex®-M33
Core Size:32-Bit Single-Core
Speed:150MHz
Connectivity:CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O:36
Program Memory Size:64KB (64K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:48K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 10x16b SAR
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:64-TQFP Exposed Pad
Supplier Device Package:64-HTQFP (10x10)
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Similar Products

Part Number LPC5512JBD64E LPC5514JBD64E LPC5516JBD64E LPC5502JBD64E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 150MHz 150MHz 150MHz 96MHz
Connectivity CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O 36 36 36 45
Program Memory Size 64KB (64K x 8) 128KB (128K x 8) 256KB (256K x 8) 64KB (64K x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size - - - -
RAM Size 48K x 8 80K x 8 96K x 8 48K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 10x16b SAR A/D 10x16b SAR A/D 10x16b SAR A/D 9x16b SAR
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10)

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