LPC5514JBD64E
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NXP USA Inc. LPC5514JBD64E

Manufacturer No:
LPC5514JBD64E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 128KB FLASH 64HTQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC5514JBD64E is a 32-bit microcontroller from NXP USA Inc., part of the LPC551x family. It is based on the Arm Cortex-M33 core, which provides a high level of performance and efficiency. This microcontroller is designed for embedded applications and offers a range of advanced features, including cryptographic acceleration, secure flash updates, and multiple communication interfaces.

Key Specifications

Parameter Specification
Microcontroller Core Arm Cortex-M33
Operating Frequency Up to 150 MHz
Flash Memory 128 KB (128K x 8)
SRAM 64 KB (contiguous) + 16 KB USB SRAM
Package Type 64-HTQFP (10x10 mm)
Operating Voltage 1.8 V to 3.6 V
Operating Temperature -40°C to +105°C
Communication Interfaces USB (Full-Speed and High-Speed), CAN FD, USART, SPI, I2C, I2S
Crypto Engine CASPER Crypto co-processor for ECC and other cryptographic functions
ADC 16-bit ADC with 5 differential channel pairs (or 10 single-ended channels)

Key Features

  • Arm Cortex-M33 Core: Provides high performance and efficiency with a Floating Point Unit (FPU) and Memory Protection Unit (MPU).
  • Crypto Engine: CASPER Crypto co-processor for hardware acceleration of cryptographic functions such as Elliptic Curve Cryptography (ECC).
  • Secure Flash Updates: PRINCE module for real-time encryption and decryption of on-chip flash data.
  • Multiple Communication Interfaces: Includes USB (Full-Speed and High-Speed), CAN FD, USART, SPI, I2C, and I2S.
  • Advanced Analog Peripherals: 16-bit ADC with multiple channel configurations and an integrated temperature sensor.
  • Power Management: Internal DC-DC converter, Power-On Reset (POR), and Brown-Out Detectors (BOD).
  • Debug Capabilities: Serial Wire Debug with eight breakpoints and four watchpoints, and JTAG boundary scan supported.

Applications

  • Industrial Automation: Suitable for control systems, sensors, and actuators due to its robust communication interfaces and secure data handling.
  • IoT Devices: Ideal for Internet of Things applications requiring secure data transmission and efficient processing.
  • Automotive Systems: Can be used in automotive control units, infotainment systems, and other vehicle electronics due to its high reliability and security features.
  • Medical Devices: Applicable in medical devices that require secure data handling, such as patient monitoring systems and diagnostic equipment.

Q & A

  1. What is the core architecture of the LPC5514JBD64E microcontroller?

    The LPC5514JBD64E is based on the Arm Cortex-M33 core.

  2. What is the maximum operating frequency of the LPC5514JBD64E?

    The maximum operating frequency is up to 150 MHz.

  3. How much flash and SRAM memory does the LPC5514JBD64E have?

    The LPC5514JBD64E has 128 KB of flash memory and 64 KB of SRAM (plus an additional 16 KB of USB SRAM).

  4. What cryptographic capabilities does the LPC5514JBD64E offer?

    The LPC5514JBD64E includes a CASPER Crypto co-processor for hardware acceleration of cryptographic functions such as Elliptic Curve Cryptography (ECC).

  5. What are the communication interfaces available on the LPC5514JBD64E?

    The LPC5514JBD64E supports USB (Full-Speed and High-Speed), CAN FD, USART, SPI, I2C, and I2S interfaces.

  6. Does the LPC5514JBD64E support secure flash updates?

    Yes, it includes a PRINCE module for real-time encryption and decryption of on-chip flash data.

  7. What is the operating voltage range of the LPC5514JBD64E?

    The operating voltage range is from 1.8 V to 3.6 V.

  8. What is the operating temperature range of the LPC5514JBD64E?

    The operating temperature range is from -40°C to +105°C.

  9. Does the LPC5514JBD64E support JTAG boundary scan?

    Yes, it supports JTAG boundary scan.

  10. What type of ADC does the LPC5514JBD64E have?

    The LPC5514JBD64E has a 16-bit ADC with five differential channel pairs (or 10 single-ended channels).

Product Attributes

Core Processor:ARM® Cortex®-M33
Core Size:32-Bit Single-Core
Speed:150MHz
Connectivity:CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O:36
Program Memory Size:128KB (128K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:80K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 10x16b SAR
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:64-TQFP Exposed Pad
Supplier Device Package:64-HTQFP (10x10)
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Similar Products

Part Number LPC5514JBD64E LPC55S14JBD64E LPC5516JBD64E LPC5534JBD64E LPC5504JBD64E LPC5512JBD64E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 150MHz 150MHz 150MHz 150MHz 96MHz 150MHz
Connectivity CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART CANbus, Flex COMM, I²C, SPI, UART/USART CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT DMA, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O 36 36 36 39 45 36
Program Memory Size 128KB (128K x 8) 128KB (128K x 8) 256KB (256K x 8) 128KB (128K x 8) 128KB (128K x 8) 64KB (64K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - -
RAM Size 80K x 8 80K x 8 96K x 8 96K x 8 80K x 8 48K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 10x16b SAR A/D 10x16b SAR A/D 10x16b SAR A/D 13x16b; D/A 1x12b A/D 9x16b SAR A/D 10x16b SAR
Oscillator Type Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10)

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