LPC5506JBD64E
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NXP USA Inc. LPC5506JBD64E

Manufacturer No:
LPC5506JBD64E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 256KB FLASH 64HTQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC5506JBD64E is a 32-bit microcontroller from NXP USA Inc., part of the LPC550x family based on the ARM Cortex-M33 core. This microcontroller is designed for embedded applications, offering a balance of performance, security, and power efficiency. It is particularly suited for applications requiring advanced security features and low power consumption.

Key Specifications

ParameterValue
CoreARM Cortex-M33
Clock SpeedUp to 96 MHz
Flash Memory256 KB
SRAMUp to 96 KB (16 KB on Code Bus, 64 KB on System Bus, and 16 KB on System Bus)
Package64-HTQFP (10x10 mm)
Operating Voltage1.8 V to 3.6 V
Operating Temperature-40 °C to +105 °C
GPIO PinsUp to 45
InterfacesFlexcomm (UART, SPI, I2C), CAN FD, DMA controllers

Key Features

  • Security Features: Includes CASPER Crypto engine, PRINCE module for real-time encryption and decryption, AES, SHA, CRC, and PUF (Physically Unclonable Function).
  • Memory and Storage: Up to 256 KB on-chip flash program memory and up to 96 KB SRAM.
  • Interfaces and Peripherals: Flexcomm interfaces (UART, SPI, I2C), CAN FD module, DMA controllers, 16-bit ADC, comparator, and temperature sensor.
  • Power and Operating Conditions: Single power supply from 1.8 V to 3.6 V and an operating temperature range of -40 °C to +105 °C.
  • Bootloader and Programming: On-chip ROM bootloader supports booting from on-chip flash, CRC32 image integrity checking, and secure firmware update using NXP Secure Boot file format.

Applications

The LPC5506JBD64E microcontroller is suitable for a variety of embedded applications, including but not limited to:

  • Industrial Automation: For control and monitoring systems requiring advanced security and low power consumption.
  • Internet of Things (IoT): For secure and efficient IoT devices.
  • Automotive Systems: For applications needing robust security features and reliable performance.
  • Medical Devices: For secure and low-power medical device applications.

Q & A

  1. What is the core architecture of the LPC5506JBD64E microcontroller?
    The LPC5506JBD64E is based on the ARM Cortex-M33 core.
  2. How much flash memory does the LPC5506JBD64E have?
    The LPC5506JBD64E has up to 256 KB of on-chip flash program memory.
  3. What are the key security features of the LPC5506JBD64E?
    The key security features include the CASPER Crypto engine, PRINCE module, AES, SHA, CRC, and PUF.
  4. What interfaces does the LPC5506JBD64E support?
    The LPC5506JBD64E supports Flexcomm interfaces (UART, SPI, I2C), CAN FD module, and DMA controllers.
  5. What is the operating voltage range of the LPC5506JBD64E?
    The operating voltage range is from 1.8 V to 3.6 V.
  6. What is the temperature range for the LPC5506JBD64E?
    The operating temperature range is from -40 °C to +105 °C.
  7. How many GPIO pins does the LPC5506JBD64E have?
    The LPC5506JBD64E has up to 45 GPIO pins.
  8. Does the LPC5506JBD64E support secure boot and firmware updates?
    Yes, it supports secure boot and firmware updates using the NXP Secure Boot file format.
  9. What package options are available for the LPC5506JBD64E?
    The LPC5506JBD64E is available in a 64-HTQFP package.
  10. What are some typical applications for the LPC5506JBD64E?
    Typical applications include industrial automation, IoT devices, automotive systems, and medical devices.

Product Attributes

Core Processor:ARM® Cortex®-M33
Core Size:32-Bit Single-Core
Speed:96MHz
Connectivity:CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O:45
Program Memory Size:256KB (256K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:96K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 9x16b SAR
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:64-TQFP Exposed Pad
Supplier Device Package:64-HTQFP (10x10)
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Similar Products

Part Number LPC5506JBD64E LPC5516JBD64E LPC55S06JBD64E LPC5536JBD64E LPC5502JBD64E LPC5504JBD64E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 96MHz 150MHz 96MHz 150MHz 96MHz 96MHz
Connectivity CANbus, Flex COMM, I²C, SPI, UART/USART CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flex COMM, I²C, SPI, UART/USART CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART CANbus, Flex COMM, I²C, SPI, UART/USART CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT DMA, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O 45 36 45 39 45 45
Program Memory Size 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 64KB (64K x 8) 128KB (128K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - -
RAM Size 96K x 8 96K x 8 96K x 8 128K x 8 48K x 8 80K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 9x16b SAR A/D 10x16b SAR A/D 9x16b SAR A/D 13x16b; D/A 1x12b A/D 9x16b SAR A/D 9x16b SAR
Oscillator Type Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10)

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