LPC1774FBD208,551
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NXP USA Inc. LPC1774FBD208,551

Manufacturer No:
LPC1774FBD208,551
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 32BIT 128KB FLASH 208LQFP
Delivery:
Payment:
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Product Introduction

Overview

The LPC1774FBD208,551 is a 32-bit microcontroller from NXP USA Inc., based on the ARM Cortex-M3 architecture. This microcontroller is designed for embedded applications, offering a high level of integration and low power consumption. It operates at a frequency of up to 120 MHz, making it suitable for a wide range of applications that require both performance and energy efficiency.

Key Specifications

SpecificationValue
Processor CoreARM Cortex-M3
Operating FrequencyUp to 120 MHz
Flash Memory128 KB
SRAM32 KB (main SRAM) + 8 KB (peripheral SRAM)
EEPROM2048 bytes
Package Type208-LQFP (28x28 mm)
GPIO PinsUp to 165 general purpose I/O pins
InterfacesUSB Device/Host/OTG, 5 UARTs, 3 SSP controllers, 3 I2C-bus interfaces, 1 I2S interface, DAC, 8-channel 12-bit ADC
Other FeaturesExternal Memory Controller (EMC), General Purpose DMA controller, Quadrature Encoder Interface, ultra-low power RTC, windowed watchdog timer, CRC calculation engine

Key Features

  • High-performance ARM Cortex-M3 processor with up to 120 MHz frequency.
  • Low power consumption, making it suitable for battery-powered devices.
  • Rich set of peripherals including USB, UARTs, SSP, I2C, I2S, DAC, and an 8-channel 12-bit ADC.
  • External Memory Controller (EMC) for expanding memory capabilities.
  • General Purpose DMA controller for efficient data transfer.
  • Ultra-low power Real-Time Clock (RTC) with separate battery supply and event recorder.
  • Windowed watchdog timer and CRC calculation engine for enhanced reliability.

Applications

The LPC1774FBD208,551 is versatile and can be used in a variety of applications, including:

  • Industrial control systems.
  • Medical devices.
  • Consumer electronics.
  • Automotive systems.
  • IoT devices.
  • Robotics and automation.

Q & A

  1. What is the processor core of the LPC1774FBD208,551?
    The processor core is the ARM Cortex-M3.
  2. What is the maximum operating frequency of the LPC1774FBD208,551?
    The maximum operating frequency is up to 120 MHz.
  3. How much flash memory does the LPC1774FBD208,551 have?
    The LPC1774FBD208,551 has 128 KB of flash memory.
  4. What is the SRAM capacity of the LPC1774FBD208,551?
    The SRAM capacity is 32 KB (main SRAM) + 8 KB (peripheral SRAM).
  5. Does the LPC1774FBD208,551 support USB?
    Yes, it supports USB Device/Host/OTG.
  6. What types of interfaces does the LPC1774FBD208,551 have?
    The interfaces include UARTs, SSP controllers, I2C-bus interfaces, I2S interface, DAC, and an 8-channel 12-bit ADC.
  7. Does the LPC1774FBD208,551 have an External Memory Controller?
    Yes, it has an External Memory Controller (EMC).
  8. What is the package type of the LPC1774FBD208,551?
    The package type is 208-LQFP (28x28 mm).
  9. How many GPIO pins does the LPC1774FBD208,551 have?
    It has up to 165 general purpose I/O pins.
  10. Does the LPC1774FBD208,551 have a Real-Time Clock (RTC)?
    Yes, it has an ultra-low power RTC with separate battery supply and event recorder.

Product Attributes

Core Processor:ARM® Cortex®-M3
Core Size:32-Bit Single-Core
Speed:120MHz
Connectivity:CANbus, EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O:165
Program Memory Size:128KB (128K x 8)
Program Memory Type:Flash
EEPROM Size:2K x 8
RAM Size:40K x 8
Voltage - Supply (Vcc/Vdd):2.4V ~ 3.6V
Data Converters:A/D 8x12b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:208-LQFP
Supplier Device Package:208-LQFP (28x28)
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Similar Products

Part Number LPC1774FBD208,551 LPC1777FBD208,551 LPC1778FBD208,551 LPC1776FBD208,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Discontinued at Digi-Key Discontinued at Digi-Key
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 120MHz 120MHz 120MHz 120MHz
Connectivity CANbus, EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 165 165 165 165
Program Memory Size 128KB (128K x 8) 512KB (512K x 8) 512KB (512K x 8) 256KB (256K x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size 2K x 8 4K x 8 4K x 8 4K x 8
RAM Size 40K x 8 96K x 8 96K x 8 80K x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V 2.4V ~ 3.6V 2.4V ~ 3.6V 2.4V ~ 3.6V
Data Converters A/D 8x12b; D/A 1x10b A/D 8x12b; D/A 1x10b A/D 8x12b; D/A 1x10b A/D 8x12b; D/A 1x10b
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 208-LQFP 208-LQFP 208-LQFP 208-LQFP
Supplier Device Package 208-LQFP (28x28) 208-LQFP (28x28) 208-LQFP (28x28) 208-LQFP (28x28)

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